SMD1210 Series
Surface Mountable PTC Resettable Fuse
Features:
RoHS Compliant & Halogen Free
faster tripping, 1210 Dimension, Surface mountable, Solid state
Operation Current: 0.05A~2.00A
Maximum Voltage: 6V~60Vdc
Operating Temperature:-40℃ TO 85℃
Product Dimensions
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification
RS 186-9E and ANSI/J-STD-002 Category 3.
Pig.1
Unit :mm
Model
Marking
A
B
C
D
E
Min
Max
Min
Max
Min
Max
Min
Min
SMD1210P005TF
JZ
3.00
3.43
2.35
2.80
0.60
1.25
0.15
0.10
SMD1210P010TF
JN
3.00
3.43
2.35
2.80
0.60
1.25
0.15
0.10
SMD1210P020TF
JF
3.00
3.43
2.35
2.80
0.50
1.00
0.15
0.10
SMD1210P035TF
JB
3.00
3.43
2.35
2.80
0.35
0.90
0.15
0.10
SMD1210P035TF/30
JB
3.00
3.43
2.35
2.80
0.35
1.00
0.15
0.10
SMD1210P050TF
JG
3.00
3.43
2.35
2.80
0.35
0.90
0.15
0.10
SMD1210P075TF
JA
3.00
3.43
2.35
2.80
0.35
0.85
0.15
0.10
SMD1210P110TFT
JK
3.00
3.43
2.35
2.80
0.40
1.10
0.15
0.10
SMD1210P110TF/16
JK
3.00
3.43
2.35
2.80
0.40
1.40
0.15
0.10
SMD1210P150TFT
JK
3.00
3.43
2.35
2.80
0.60
1.40
0.15
0.10
SMD1210P175TF
JK
3.00
3.43
2.35
2.80
0.60
1.40
0.15
0.10
SMD1210P200TF
JK
3.00
3.43
2.35
2.80
0.60
1.50
0.15
0.10
1/6
SMD1210 Series
Surface Mountable PTC Resettable Fuse
Thermal Derating Chart-IH(A)
Model
Maximum ambient operating temperatures(℃)
-40
-20
0
25
40
50
60
70
85
SMD1210P005TF
0.08
0.07
0.06
0.05
0.04
0.04
0.03
0.03
0.02
SMD1210P010TF
0.16
0.14
0.12
0.10
0.08
0.07
0.06
0.05
0.05
SMD1210P020TF
0.29
0.26
0.22
0.20
0.16
0.14
0.13
0.11
0.08
SMD1210P035TF
0.47
0.45
0.40
0.35
0.33
0.28
0.24
0.21
0.18
SMD1210P035TF/30
0.47
0.45
0.40
0.35
0.33
0.28
0.24
0.21
0.18
SMD1210P050TF
0.76
0.67
0.58
0.50
0.43
0.40
0.36
0.32
0.28
SMD1210P075TF
1.00
0.97
0.86
0.75
0.64
0.59
0.54
0.48
0.40
SMD1210P110TFT
1.60
1.42
1.26
1.10
0.94
0.86
0.80
0.70
0.58
SMD1210P110TF/16
1.60
1.42
1.26
1.10
0.94
0.86
0.80
0.70
0.58
SMD1210P150TFT
2.30
2.02
1.76
1.50
1.24
1.11
1.00
0.85
0.65
SMD1210P175TF
2.45
2.22
2.01
1.75
1.45
1.26
1.10
0.98
0.80
SMD1210P200TF
2.60
2.44
2.35
2.00
1.78
1.67
1.50
1.45
1.10
Vmax
Imax
Ihold
Itrip
Pd
(Vdc)
(A)
(A)
(A)
Max.
(W)
Current
Time
Rimin
R1max
(A)
(Sec)
()
()
SMD1210P005TF
30
100
0.05
0.15
0.6
0.25
1.50
2.8
50
SMD1210P010TF
30
100
0.10
0.30
0.6
0.50
0.60
0.8
15
SMD1210P020TF
30
100
0.20
0.40
0.6
8.0
0.02
0.40
5
SMD1210P035TF
6
100
0.35
0.75
0.6
8.0
0.20
0.20
1.3
SMD1210P035TF/30
30
100
0.35
0.75
0.6
8.0
0.20
0.20
1.3
SMD1210P050TF
13.2
100
0.50
1.00
0.6
8.0
0.10
0.18
0.9
SMD1210P075TF
6
100
0.75
1.50
0.6
8.0
0.10
0.07
0.4
SMD1210P110TFT
8
100
1.10
2.20
0.6
8.0
0.30
0.05
0.21
SMD1210P110TF/16
16
100
1.10
2.20
0.8
8.0
0.30
0.05
0.25
SMD1210P150TFT
6
100
1.50
3.00
0.8
8.0
0.50
0.03
0.21
SMD1210P175TF
6
100
1.75
3.50
0.8
8.0
0.60
0.02
0.08
SMD1210P200TF
6
100
2.00
4.00
0.8
8.0
1.00
0.015
0.07
Electrical Characteristic
Model
2/6
Maximum time to trip
Resistence
SMD1210 Series
Surface Mountable PTC Resettable Fuse
Test Procedures And Requirements
Test
Test Conditions
Accept/Reject Criteria
Resistance
In still air @ 25℃
Specified current,Vmax ,25℃
Tmaximum Time to Trip
Time to Trip
Rmin≤R≤R max
Hold Current
Trip Cycle Life
30min,at IH
No tri p
Vmax,Imax,100cycles
No arcing or burning
Trip Endurance
Vmax,1 hours
No arcing or burning
Physical Characteristics and Environmental Specifications
Physical Characteristics
Terminal materials :
Tin-Plated Nickle-copper
Soldering
Meets EIA spec ificatio n RS 186-9E and ANSI/J-STD- 002 Cat egory 3.
z on e
Environmental Specifications
Test
Conditions
Resistance Change
Passive aging
Humidity aging
85℃,1000hours
±10%
85℃/85%RH.1000 hours
±5%
Thermal shock
Solvent Resistance
MIL-STD-202,Method 107G
MIL-STD-202,Method 215
no change
Vibration
ML-STD-883C,Test Condition A
No chage
+85℃/-40℃,20times
-30% typical resistance change
Electrical Specifications:
I hold = Hold Current. Maximum current device will not trip in 25°C still air.
I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).
3/6
SMD1210 Series
Surface Mountable PTC Resettable Fuse
Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax).
Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
Recommended pad layout (mm)
Solder reflow conditions
● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to the bottom side of the board.
● Recommended maximum paste thickness is 0.25mm (0.010inch).
● Devices can be cleaned using standard industry methods and solvents.
● Soldering temprature profile meets RoHs leadfree process.
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements
4/6
SMD1210 Series
Surface Mountable PTC Resettable Fuse
Tape Specification And
Reel Dimensions
Coverning Specifications
EIA 481-1(Unit:mm)
W
8.0± 0.3
P0
4.0 ± 0.10
P1
4.0 ± 0.10
P2
2.0 ± 0.05
A0
2.82± 0.10
B0
3.46± 0.10
D0
1.55 ± 0.05
F
3.5 0± 0.05
E1
1.75 ± 0.10
T
0.25 ± 0.10
Leader min.
390
Trailer min.
160
Reel Dimensions
A
178±1.0
N
59±1
W1
8.5+1.0/-0.2
W2
12.0±1
\
Packaging Quantity
Model
Quantity
Model
Quantity
SMD1210P005TF
4000
SMD1210P075TF
4000
SMD1210P010TF
4000
SMD1210P110TFT
4000
SMD1210P020TF
4000
SMD1210P110TF/16
3500
SMD1210P035TF
4000
SMD1210P150TFT
4000
SMD1210P035TF/30
4000
SMD1210P175TF
3000
SMD1210P050TF
4000
SMD1210P200TF
3000
5/6
SMD1210 Series
Surface Mountable PTC Resettable Fuse
Storage
The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the
deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with
high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the
components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be
opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present
WARNING
• Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame.
• PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
• Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
• Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
• Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
• Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.PPTC SMD can be cleaned by standard methods.
• Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profilecould negatively impact solderability performance of our devices.
6/6
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