SMD2920P100TF

SMD2920 Series Surface Mountable PTC Resettable Fuse Features：      RoHS Compliant ＆ Halogen Free faster tripping, 2920 Dimension, Surface mountable, Solid state Operation Current: 0.30A~3.00A Maximum Voltage: 6V~60Vdc Operating Temperature：-40℃ TO 85℃ Product Dimensions Terminal pad materials :Tin-Plated Nickle-copper Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. Pig.1 Unit ：mm Model A B C D E Min Max Min Max Min Max Min Min SMD2920P030TF 6.73 7.98 4.80 5.44 0.60 1.15 0.30 0.15 SMD2920P050TF 6.73 7.98 4.80 5.44 0.60 1.15 0.30 0.15 SMD2920P075TF/60 6.73 7.98 4.80 5.44 0.60 1.15 0.30 0.15 SMD2920P100TF 6.73 7.98 4.80 5.44 0.60 1.00 0.30 0.15 SMD2920P125TF 6.73 7.98 4.80 5.44 0.60 1.00 0.30 0.15 SMD2920P150TF 6.73 7.98 4.80 5.44 0.60 1.20 0.30 0.15 SMD2920P185TF 6.73 7.98 4.80 5.44 0.60 1.20 0.30 0.15 SMD2920P200TF SMD2920P200TF/24 6.73 7.98 4.80 5.44 0.40 0.80 0.30 0.15 6.73 7.98 4.80 5.44 0.60 1.00 0.30 0.15 SMD2920P250TF 6.73 7.98 4.80 5.44 0.40 0.80 0.30 0.15 SMD2920P260TF/24 SMD2920P300TF 6.73 7.98 4.80 5.44 0.40 0.80 0.30 0.15 6.73 7.98 4.80 5.44 0.40 0.80 0.30 0.15 SMD2920P300TF/15 6.73 7.98 4.80 5.44 0.60 1.20 0.30 0.15 1/6 SMD2920 Series Surface Mountable PTC Resettable Fuse Thermal Derating Chart-IH（A） Maximum ambient operating temperatures（℃） Model -40 -20 0 25 40 50 60 70 85 SMD2920P030TF 0.44 0.37 0.35 0.30 0.28 0.23 0.20 0.18 0.14 SMD2920P050TF 0.73 0.62 0.59 0.50 0.47 0.38 0.34 0.30 0.24 SMD2920P075TF/60 1.09 0.92 0.88 0.75 0.70 0.56 0.50 0.45 0.36 SMD2920P100TF 1.45 1.23 1.17 1.10 0.93 0.75 0.67 0.60 0.48 SMD2920P125TF 1.81 1.54 1.46 1.25 1.16 0.94 0.84 0.75 0.60 SMD2920P150TF 2.18 1.85 1.76 1.50 1.40 1.13 1.01 0.90 0.72 SMD2920P185TF 2.68 2.28 2.16 1.85 1.72 1.39 1.24 1.11 0.89 SMD2920P200TF SMD2920P200TF/24 2.90 2.46 2.34 2.00 1.86 1.50 1.34 1.20 0.96 2.90 2.46 2.34 2.00 1.86 1.50 1.34 1.20 0.96 SMD2920P250TF 3.63 3.08 2.93 2.50 2.33 1.88 1.68 1.50 1.20 SMD2920P260TF/24 SMD2920P300TF 3.77 3.20 3.04 2.60 2.42 1.95 1.74 1.56 1.25 4.35 3.69 3.51 3.00 2.79 2.25 2.01 1.80 1.44 SMD2920P300TF/15 4.35 3.69 3.51 3.00 2.79 2.25 2.01 1.80 1.44 Electrical Characteristic Vmax Imax Ihold Itrip Pd (Vdc) (A) (A) (A) Max. (W) Current Time Rimin R1max (A) (Sec) () () SMD2920P030TF 60 100 0.30 0.60 1.5 1.5 3.0 0.60 4.80 SMD2920P050TF 60 100 0.50 1.00 1.5 2.5 4.0 0.18 1.40 SMD2920P075TF/60 60 100 0.75 1.50 1.5 8.0 0.3 0.30 1.00 SMD2920P100TF 33 100 1.10 2.20 1.5 8.0 0.5 0.065 0.41 SMD2920P125TF 15 100 1.25 2.50 1.5 8.0 2.0 0.05 0.25 SMD2920P150TF 33 100 1.50 3.00 1.5 8.0 2.0 0.035 0.23 SMD2920P185TF 33 100 1.85 3.70 1.5 8.0 2.5 0.030 0.15 SMD2920P200TF 16 100 2.00 4.00 1.5 8.0 4.5 0.020 0.12 SMD2920P200TF/24 SMD2920P250TF 24 100 2.00 4.00 1.5 8.0 4.5 0.020 0.12 16 100 2.50 5.00 1.5 8.0 16.0 0.020 0.085 SMD2920P260TF/24 24 100 2.60 5.20 1.5 8.0 5.0 0.025 0.075 SMD2920P300TF 6 100 3.00 6.00 1.5 8.0 20.0 0.012 0.048 SMD2920P300TF/15 15 100 3.00 6.00 1.5 8.0 20.0 0.015 0.048 Model 2/6 Maximum time to trip Resistence SMD2920 Series Surface Mountable PTC Resettable Fuse Test Procedures And Requirements Accept/Reject Criteria Resistance Test Conditions In still air @ 25℃ Rmin≤R≤R max Time t o Trip Sp ecified current，Vmax ，25℃ Tmaximum Time to Trip Hold Current 30min，at IH No trip Trip Cyc le Life V max，Imax，100cycles No arcing or burning Trip Endurance Vmax，1 hours No arcing or burning Test Physical Characteristics and Environmental Specifications Physical Characteristics Terminal materials : Soldering z on e Tin-Plated Nickle-copper Meets EIA specificatio n RS 1 86-9E and ANS I/J-STD-002 Catego ry 3. Environmental Specifications Conditions Test Resistance Change Passive aging Humidity aging 85℃,1000hours ±10% 85℃/85%RH.1000 hours ±5% Thermal shock Solvent Resistance MIL-STD-202,Method 107G+85℃/-40℃,20times -30% typical resistance change MIL-STD-202,Method 215 no change Vibration ML-STD-883C,Test Condition A No chage 3/6 SMD2920 Series Surface Mountable PTC Resettable Fuse Electrical Specifications: I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). I max = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd=Maximum p ower di ssipatio n wh en device is in the tripp ed state in 25°C still air enviro nment at rated vol tage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. Recommended pad layout (mm) Solder reflow conditions ● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free. ● Devices are not designed to be wave soldered to the bottom side of the board. ● Recommended maximum paste thickness is 0.25mm (0.010inch). ● Devices can be cleaned using standard industry methods and solvents. 4/6 SMD2920 Series Surface Mountable PTC Resettable Fuse ● Soldering temprature profile meets RoHs leadfree process. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements Tape Specification And Reel Dimensions Coverning Specifications EIA 481-1(Unit:mm) W 16± 0.3 P0 4.0 ± 0.10 P1 8.0 ± 0.10 P2 2.0 ± 0.10 A0 5.74 ± 0.10 B0 8.02 ± 0.10 D0 1.55 ± 0.05 F 7.5± 0.10 E1 1.75 ± 0.10 T 0.20± 0.10 Leader min. 390 Trailer min. 160 Reel Dimensions A 178± 1 N 58± 1 W1 16.9± 0.80 W2 19.3± 0.1 5/6 SMD2920 Series Surface Mountable PTC Resettable Fuse Storage The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the defo rmatio n of p ackaging material s. The m aximum relative humidity recommended f o r sto rage is 60%. High humidity w ith high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present WARNING • Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. • PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. • Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. • Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. • Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. • Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods. • Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices. 6/6