UMW
R
UMW 30N06
1.
The 30N06 is the highest performance trench N-ch MOSFETs with extreme high cell
density,which provide excellent RDSON and gate charge for most of the synchronous buck converter
applications.The 30N06 meet the RoHS and Green Product requirenment,100%EAS guaranteed
with full function reliability approved.
2.
RDS(on)=25mΩ @ VDS=60V
Avanced high cell density Trench technology
Super Low Gate Charge
Excellent Cdv/dt effect decline
100%EAS Guaranteed
Green Device Available
3.
High Frequency Point-of-Load Synchronous Buck Converter
Networking DC-DC Power System
Load Switch
4.
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1
Pin
Function
1
Gate
2
Drain
3
Source
4
Drain
友台半导体有限公司
UMW
R
UMW 30N06
5. Absolute maximum ratings
Parameter
Drain-source voltage
Gate-source voltage
Continuous drain current,
VGS @10V1
Pulsed drain current 2
Symbol
VDS
VGS
TC=25ºC
TC=100ºC
ID
IDM
EAS
IAS
PD
TJ
TSTG
Single pulse avalanche energy3
Avalanche current
TC=25 ºC
Total power dissipation4
Operation junction temperature range
Storage temperature range
Units
V
V
A
A
A
mJ
A
W
ºC
ºC
Rating
60
+20
25
18
50
34.5
22.6
34.7
-55 to150
-55 to150
6. Thermal characteristics
Parameter
Symbol
Typ
Max
Thermal resistance,Junction-ambient1
RθJA
--
62
Thermal resistance,Junction-case1
RθJC
--
3.6
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2
Unit
ºC/W
友台半导体有限公司
UMW
R
UMW 30N06
7. Electrical characteristics
Parameter
Drain-source breakdown voltage
BVDSS temperature coefficient
Static drain-source on-resistance2
Gate threshold voltage
VGS(th) temperature coefficient
(TJ=25°C,unless otherwise noted
Test Conditions
Min Typ
Max
Units
VGS=0V,ID=250μA
60
V
Reference to 25 ºC,
V/°C
0.063
ID=1mA
Symbol
BVDSS
△BVDSS/△TJ
RDS(on)
VGS=10V,ID=15A
VGS=4.5V,ID=10A
VGS(th)
△VGS(th)
VDS=VGS, ID=250μA
Drain-source leakage current
IDSS
Gate- source leakage current
Forward transconductance
IGSS
gfs
VDS=48V, VGS=0V
TJ=25°C
VDS=48V, VGS=0V
TJ=55°C
VGS=+20V, VDS=0V
VDS=5V, ID=15A
Gate resistance
Rg
VDS=0V, VGS=0V,f=1MHz
Total gate charge(4.5V)
Gate-source charge
Gate-drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Input capacitance
Output capacitance
Reverse transfer capacitance
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Ciss
Coss
Crss
Single pulse avalanche energy5
EAS
VDS=48V, VGS=4.5V
ID =10A
VDD=30V,ID=10A,
RG=3.3Ω, VGS=10V
VDS=25V,VGS=0V,
f=1MHz
25
30
1.2
-
30
38
2.5
-5.24
mΩ
V
mV/°C
1
μA
5
μA
+100
17
nA
S
3.2
Ω
12.56
3.24
6.31
8
14.2
24.4
4.6
1345
72.5
54.4
VDD=25V,L=0.1mH,
15.2
IAS=15A
Continuous source current1,6
IS
25
VG= VD==0V,
Pulsed source current2,6
ISM
Force current
50
VSD
Diode forward voltage2
1.2
VGS=0V,IS=1A, TJ=25ºC
Note:1.The data tested by surface mounted on a 1 inch2 FR-4 board with 20Z copper.
nC
ns
pF
mJ
A
A
V
2.The data tested by pulsed, pulse width
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