AT93C56M/TR

93C46/56/66 3-Wire Serial EEPROM 1K, 2K and 4Kbit (8-bit or 16-bit wide) FEATURES            Standard Voltage and Low Voltage Operation:  HG93C46/56/66: V CC = 2.5V to 5.5V  HG93C46A/56A/66A: V CC = 1.8V to 5.5V User Selectable Internal Organization:  HG93C46: 128 x 8 or 64 x 16  HG93C56: 256 x 8 or 128 x 16  HG93C66: 512 x 8 or 256 x 16 2 MHz Clock Rate (5V) Compatibility. Industry Standard 3-wire Serial Interface. Self-Timed ERASE/WRITE Cycles (5ms max including auto-erase). Automatic ERAL before WRAL. Sequential READ Function. High Reliability: Typical 1 Million Erase/Write Cycle Endurance. 100 Years Data Retention. Industrial Temperature Range (-40o C to 85o C). Standard 8-pin DIP/SOP/TSSOP/DFN Pb-free Packages. DESCRIPTION The HG93C46/56/66 series are 1024/2048/4096 bits of serial Electrical Erasable and Programmable Read Only Memory, commonly known as EEPROM. They are organized as 64/128/256 words of 16 bits each when the ORG pin is connected to VCC (or unconnected) and 128/256/512 words of 8 bits (1 byte) each when the ORG pin is tied to ground. The devices are fabricated with proprietary advanced CMOS process for low power and low voltage applications. These devices are available in standard 8-lead DIP, 8-lead JEDEC SOP, 8-lead TSSOP and 8-lead DFN packages. Our extended VCC range (1.8V to 5.5V) devices enables wide spectrum of applications. The HG93C46/56/66 is enabled through the Chip Select pin (CS), and accessed via a 3-wire serial interface consisting of Data Input (DI), Data Output (DO), and Shift Clock (SCL). Upon receiving a READ instruction at DI, the address is decoded and the data is clocked out serially on the data output pin DO. The WRITE cycle is completely self-timed and no separate ERASE cycle is required before WRITE. The WRITE cycle is only enabled when the part is in the ERASE/WRITE ENABLE state. Once a device begins its self-timed program procedure, the data out pin (DO) can indicate the READY/BUSY status by rising chip select (CS). http://www.hgsemi.com.cn 1 2018 AUG 93C46/56/66 PIN CONFIGURATION Pin Name CS SCL DI DO ORG DC VCC GND Pin Function Chip Select Serial Clock Serial Data Input Serial Data Output Internal Organization Don’t Connect Power Supply Ground All these packaging types come in Pb-free certified. CS SCL DI DO 1 8 2 7 3 6 4 5 8L 8L 8L 8L VCC DC ORG GND DC VCC CS SCL DIP SOP TSSOP DFN 1 8 2 7 3 6 4 5 ORG GND DO DI 8L SOP Rotated (R) 93C46 only ABSOLUTE MAXIMUM RATINGS Industrial operating temperature: Storage temperature: Input voltage on any pin relative to ground: Maximum voltage: -40oC to 85oC -50oC to 125oC -0.3V to VCC + 0.3V 8V * Stresses exceed those listed under “Absolute Maximum Rating” may cause permanent damage to the device. Functional operation of the device at conditions beyond those listed in the specification is not guaranteed. Prolonged exposure to extreme conditions may affect device reliability or functionality. http://www.hgsemi.com.cn 2 2018 AUG 93C46/56/66 PIN DESCRIPTIONS (A) SERIAL CLOCK (SCL) The rising edge of this SCL input is to latch data into the EEPROM device while the rising edge of this clock is to clock data out of the EEPROM device. (B) CHIP SELECT (CS) This is the chip select input signal for the serial EEPROM device. . (C) SERIAL DATA INPUT (DI) This is data input signal for the serial device. (D) SERIAL DATA OUTPUT (DO) This is data output signal for the serial device. (E) INTERNAL ORGANIZATION (ORG) This is internal organization input signal for the serial EEPROM device. When the ORG pin is connected to VCC or unconnected the EEPROM is organized as 64/128/256 word of 16 bits each and when ORG pin is connected to ground the EEPROM is organized as 128/256/512 byte of 8 bits each. Typically, these signals are hardwired to either VIH or VIL. If left unconnected, they are internally recognized as VIH. http://www.hgsemi.com.cn 3 2018 AUG 93C46/56/66 MEMORY ORGANIZATION The HG93C46/56/66 memory is organized either as bytes (x8) or as words (x16). If Internal Organization (ORG) is unconnected (or connected to VCC) the words (x16) organization is selected; When Internal Organization is connected to ground the bytes (x8) organization is selected. INSTRUCTION SET for the HG93C46 Address x8 x 16 Instruction SB Op Code READ 1 10 A6 - A0 A5 - A0 EWEN 1 00 11xxxxx 11xxxx EWDS 1 00 00xxxxx 00xxxx ERASE WRITE ERAL WRAL 1 1 1 1 11 01 00 00 A 6 - A0 A6 - A0 10xxxxx 01xxxxx A5 - A0 A5 - A0 10xxxx 01xxxx Data x8 Comments x 16 D7 - D0 D15 - D0 D7 - D0 D15 - D0 Reads data stored in memory, at specified address. Write enable must precede all programming modes. Disables all programming instructions. Erase memory location An - A0. Writes memory location An - A0. Erases all memory locations. Writes all memory locations. INSTRUCTION SET for the HG93C56 and HG93C66 Address Data Instruction SB Op Code x8 x 16 READ 1 10 A8- A0 A7- A0 EWEN 1 00 11xxxxxxx 11xxxxxx EWDS 1 00 00xxxxxxx 00xxxxxx ERASE WRITE ERAL WRAL 1 1 1 1 11 01 00 00 A8- A0 A 8- A0 10xxxxxxx 01xxxxxxx A7- A0 A7- A0 10xxxxxx 01xxxxxx x8 x 16 D7 - D0 D15 - D0 D7 - D0 D15 - D0 Comments Reads data stored in memory, at specified address. Write enable must precede all programming modes. Disables all programming instructions. Erase memory location An - A0. Writes memory location An - A0. Erases all memory locations. Writes all memory locations. . (A) START BIT (SB) Each instruction is preceded by a rising edge on Chip Select (CS) with Serial Clock (SCL) being held Low. (B) OPERATION CODE (OP-CODE) Two op-code bits, read on Serial Data Input (DI) during the rising edge of Serial Clock (SCL). (C) ADDRESS The address bits of the byte or word that is to be accessed. For the HG93C46, the address is made up of 6 bits for the x16 organization or 7 bits for x8 organization. For the HG93C56, the address is made up of 7 bits for the x16 organization or 8 bits for x8 organization. For the HG93C66, the address is made up of 8 bits for the x16 organization or 9 bits for x8 organization. (D) DATA The data bits of the byte or word that is to be accessed. For the HG93C46/56/66, the data is made up of 16 bits (word) for the x16 organization or 8 bits (byte) for x8 organization. http://www.hgsemi.com.cn 4 2018 AUG 93C46/56/66 INSTRUCTION SETS DESCRIPTION (A) READ The Read (READ) instruction contains the Address code for the memory location to be read. After the instruction and address are decoded, data from the selected memory location is available at the serial output pin DO. Output data changes are synchronized with the rising edges of serial clock SK. It should be noted that when a dummy bit (logic “0”) precedes the 8- or 16-bit data output string. (B) ERASE/WRITE ENABLE To assure data integrity, the part automatically goes into the Erase/Write Disable (EWDS) state when power is first applied. An Erase/Write Enable (EWEN) instruction must be executed first before any programming instructions can be carried out. Please note that once in the Erase/Write Enable state, programming remains enabled until an Erase/Write Disable (EWDS) instruction is executed or VCC power is removed from the part. (C) ERASE/WRITE DISABLE To protect against accidental data disturb, the Erase/Write Disable (EWDS) instruction disables all programming modes and should be executed after all programming operations. The operation of the READ instruction is independent of both the EWEN and EWDS instructions and can be executed at any time. (D) ERASE The Erase (ERASE) instruction programs all bits in the specified memory location to the logical “1” state. The self-timed erase cycle starts once the ERASE instruction and address are decoded. The DO pin outputs the READY/BUSY status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS). A logic “1” at pin DO indicates that the selected memory location has been erased, and the part is ready for another instruction. (E) WRITE The Write (WRITE) instruction contains the 8 or 16 bits of data to be written into the specified memory location. The self-timed programming cycle, tWP, starts after the last bit of data is received at serial data input pin DI. The DO pin outputs the READY/BUSY status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS). A logic “0” at DO indicates that programming is still in progress. A logic “1” indicates that the memory location at the specified address has been written with the data pattern contained in the instruction and the part is ready for further instructions. A READY/BUSY status cannot be obtained if the CS is brought high after the end of the self-timed programming cycle, tWP. (F) ERASE ALL The Erase All (ERAL) instruction programs every bit in the memory array to the logic “1” state and is primarily used for testing purposes. The DO pin outputs the READY/BUSY status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS). The ERAL instruction is valid only at VCC = 5.0V ± 10%. (G) WRITE ALL The Write All (WRAL) instruction programs all memory locations with the data patterns specified in the instruction. The DO pin outputs the READY/BUSY status of the part if CS is brought high after being kept low for a minimum of 250 ns (tCS). The WRAL instruction is valid only at VCC = 5.0V ± 10%. http://www.hgsemi.com.cn 5 2018 AUG 93C46/56/66 Timing Diagrams R E A D T im in g CS SC L DI An A n +1 A1 A0 Dn DO STAR T BIT OP CODE D n +1 D1 D0 D ATA OUT AD D R EWDS Timing CS SCL DI START BIT OP CODE x x x x COMMAND EWEN Timing CS SCL DI START BIT OP CODE http://www.hgsemi.com.cn COMMAND 6 2018 AUG 93C46/56/66 E R A S E T im in g CS SCL DI An A n +1 A1 A0 DO S TA R T B IT OP CODE ADDR Tw c W RITE Timing CS SCL DI An A n +1 A1 Dn A0 D n +1 D1 D0 DO START BIT OP CODE ADDR DATA IN Twc ER AL Tim ing (1) CS SCL DI x x DO START BIT OP CODE http://www.hgsemi.com.cn ADDR Twc 7 2018 AUG 93C46/56/66 WRAL Timing (2) CS SCL DI x x Dn Dn+1 D1 D0 DO START BIT OP CODE ADDR Twc DATA IN Note : 1. Valid only at VCC=4.5V to 5.5V 2. Valid only at VCC=4.5V to 5.5V Synchronous Data Timing CS SCL VIH VIL t CSS t SCLL t CSH VIH VIL t DIS DI t SCLH t DIH VIH VIL t PD0 VIH DO ( read ) VIL t PD1 t SV t DF VIH DO ( program ) VIL http://www.hgsemi.com.cn t DF STATUS VALID 8 2018 AUG 93C46/56/66 AC CHARACTERISTICS Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +1.8V to +5.5V, TAC = 0°C to +70°C, VCC = +1.8V to +5.5V (unless otherwise noted). Symbol Parameter Test Condition 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V fSCL SCL Clock Frequency tSCLH SCL High Time tSCLL SCL Low Time tCS Minimum CS Low Time tCSS CS Setup Time Relative to SCL tDIS DI Setup Time Relative to SCL tCSH CS Hold Time Relative to SCL tDIH DI Hold Time Relative to SCL tPD1 Output Delay to ‘1’ AC Test tPD0 Output Delay to ‘0’ AC Test tSV CS to Status Valid AC Test tDF CS to DO in High Impedance AC Test CS = VIL tWC Write Cycle Time http://www.hgsemi.com.cn Typ 0 0 0 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 2.7V ≤ VCC ≤ 5.5V 1.8V ≤ VCC ≤ 5.5V 4.5V ≤ VCC ≤ 5.5V 9 Min Max Units 2 1 0.25 MHz 250 250 1000 ns 250 250 1000 ns 250 250 1000 ns 50 50 200 ns 100 100 400 ns 0 ns 100 100 400 ns 3 250 250 1000 ns 250 250 1000 ns 250 250 1000 ns 100 100 400 ns 10 ms 2018 AUG 93C46/56/66 DC CHARACTERISTICS Applicable over recommended operating range from TA = -40°C to + 85°C, VCC = As Specified, CL = 1 TTL Gate and 100 pF (unless otherwise noted). Symbol Parameter VCC1 Supply Voltage VCC2 Max Unit 1.8 5.5 V Supply Voltage 2.5 5.5 V VCC3 Supply Voltage 2.7 5.5 V VCC4 Supply Voltage 4.5 5.5 V 0.5 2.0 mA 0.5 2.0 mA ICC Supply Current Test Condition VCC = 5.0V Min READ at 1.0 MHz WRITE at 1.0 MHz Typ ISB1 Standby Current VCC = 1.8V CS = 0V 0.1 µA ISB2 Standby Current VCC = 2.5V CS = 0V 1.5 µA ISB3 Standby Current VCC = 2.7V CS = 0V 1.5 µA ISB4 Standby Current VCC = 5.0V CS = 0V 1.5 µA IIL Input Leakage Vin = 0V to VCC 0.1 1.0 µA IOL Output Leakage Vin = 0V to VCC 0.1 1.0 µA VIL1(1) VIH1(1) Input Low Voltage Input High Voltage 4.5V ≤VCC ≤ 5.5V -0.6 2.0 0.8 VCC + 1 V VIL2(1) VIH2(1) Input Low Voltage Input High Voltage 1.8V ≤VCC≤ 2.7V -0.6 VCC x 0.7 VCC x 0.3 VCC + 1 V 0.4 V VOL1 VOH1 VOL12 VOH2 Output Low Voltage Output High Voltage Output Low Voltage Output High Voltage http://www.hgsemi.com.cn IOL = 2.1 mA 4.5V ≤VCC≤ 5.5V IOH = -0.4 mA 2.4 IOL = 0.15 mA 1.8V ≤VCC ≤ 2.7V IOH = -100 µA 10 V 0.2 VCC - 0.2 V V 2018 AUG