MC-313D

www.Sofng.com C Operation:SMT+DIP 式 SMT& 3.1Type-C 插座 ONNECTORS LTEM NO.:MC-313D (Consumer Electronics) (9.85L× (9.85L×9.64W× 9.64W×3.16H & DUL SMT LOW PCB TYPE) Type-C Universal Serial Bus Connectors 外焊 SMT+DIP Technical parameter ╲ LEVEL A[better product] ╲ PROJECT Contact Rating Electrical Initial Contact Resistance Properties Insulation Resistance Withstand Voltage B[average product] 侧向導入 LATERAL 5A, 24V DC 30mΩ max. 100MΩ min.500V DC 精密部品 NICETY 50mΩ max. Skey/PD：100MΩ min.300V DC 500V AC for 1 minute 350 V AC for 1 minut There No Load 6,500 Cycles 5,500 Cycles Rated Load 5,500 Cycles 4,500 Cycles 可靠 STABILIZE Durable Performance 環保材质 RoHS Sterage temp. Page1 -25℃～+75℃(Operating Temp: ) Unit:mm ● C E A D Page2 B ● DECIMALS SPECIFED TOLERANCES ANGLES X.X :±0.25 X.X :±3° X.XX :±0.15 X.XX :±2° X.XXX :±0.10 UNLESS OTHERWISE Material declaration No. NAME MATERIAL DESCRIPTION 2.0μm Ni PLATED OVERALL; ①A TERMINAL COPPER ALLOY【G/F】 0.25μm Au PLATED CONTACT AREA; 接触端子 GOLD FLASH ON SOLDER AREA. ②B SHIELDING PLATE 屏蔽壳 STAINLESS【G/F】 0.25μm Ni PLATED OVERALL; ③C CASE THERMOPLASTIC UL 94V-0,COLOR:BLACK; ④D SHELL STAINLESS【G/F】 0.25μm Ni PLATED OVERALL; ⑤E GUARD PLATE STAINLESS【G/F】 STAINLESS STEEL(t=0.10mm) MATERIAL SOFNG ELECTRONIC TECHNOLOGY Co., LTD CIRCUIT BOARD SIZE (Vertical view) Operating Force Inward 6.0～10.0N.(1N.=100gram-force) Exiting 8.0～12.0N.(1N.=100gram-force) Solder-ability IR Reflow:255℃,5sec. (Max.) Manual:350℃,3sec. ● PIN ASSIGNMENTS PIN Signal NAME Description PIN Signal NAME Description A1 GND Ground return B12 GND Ground return A2 SSTXp1 B11 SSRXp1 Positive half of firs SuperSpeed Positive half of second SuperSpeed TX differential pair RX differential pair Negatice half of first SuperSpeed A3 SSTXn1 Negative half of second SuperSpeed B10 SSRXn1 TX differential pair RX differential pair A4 V BUS Bus Power B9 V BUS Bus Power A5 CC1 Configuration Channel B8 SBU2 Sideband Use(SBU) A6 Dp1 B7 Dn2 Positive half of the USB 2.0 Negative half of the USB 2.0 differential pair-Position 1 differential pair-Position 2 Negative half of the USB 2.0 A7 Dn1 Positive half of the USB 2.0 B6 Dp2 differential pair-Position 1 differential pair-Position 2 A8 SBU1 Sideband Use(SBU) B5 CC2 Configuration Channel A9 V BUS Bus Power B4 V BUS Bus Power A10 SSRXn2 B3 SSTXn2 Negative half of second Negatice half of first SuperSpeed TX SuperSpeed RX differential pair differential pair2 Positive half of second A11 SSRXp2 Positive half of firs SuperSpeed TX B2 SSTXp2 SuperSpeed RX differential pair 注記 NOTICE A12 GND Ground return 1.碩方公司擁有最終解釋權；The SOFNG company reserves the right of final interpretation； 2.文件禁止外洩、轉載；Leaked and reproduced prohibited； 3.未經授權修改無效。Modify is invalid. differential pair2 B1 GND Ground return