www.Sofng.com
C
Operation:SMT+DIP 沉板式& 3.1Type-C 连接器/防水结构
ARD SOCKETS
LTEM NO.:MC-313F-14
(Consumer Electronics)
(9.65L×
(9.65L×9.20W×
9.20W×4.00H & DUL SMT LOW PCB TYPE)
Universal Serial Bus Connectors
外焊 SMT+DIP
Technical parameter
╲
LEVEL
A[better product]
╲
PROJECT
Contact Rating
Electrical
Initial Contact Resistance
Properties
Insulation Resistance
Withstand Voltage
B[average product]
侧向導入 LATERAL
3A, 24V DC
30mΩ max.
100MΩ min.500V DC
精密部品 NICETY
50mΩ max.
Skey/PD:100MΩ min.300V DC
500V AC for 1 minute
350 V AC for 1 minut
There No Load
6,500 Cycles
5,500 Cycles
Rated Load
5,500 Cycles
4,500 Cycles
可靠 STABILIZE
Durable Performance
環保材质 RoHS
Sterage temp.
Page1
-25℃~+75℃(Operating Temp:
)
Unit:mm
●
●
●
Page2
DECIMALS
SPECIFED TOLERANCES
ANGLES
X.X
:±0.25
X.X
:±3°
X.XX
:±0.15
X.XX
:±2°
UNLESS OTHERWISE
X.XXX :±0.10
Material declaration
No.
①A
NAME
HOUSING
MATERIAL
DESCRIPTION
-
HIGH TEMP[Black]
②B
Terminal-A
12PIN
COPPER ALLOY【G/F】
Au:15μ” PLATING OVERALL;[t=0.12mm]銅鎳硅合金
③C
Terminal-B
12PIN
COPPER ALLOY【G/F】
Au:15μ” PLATING OVERALL;[t=0.12mm]銅鎳硅合金
④D
MID PLATE
STAINLESS【G/F】
STAINLESS STEEL(t=0.15mm)
⑤E
GND PLATE
STAINLESS【G/F】
STAINLESS STEEL/ Ni PLATING(t=0.10mm)
⑥F
SHELL-#1
STAINLESS【G/F】
STAINLESS STEEL/ Ni PLATING(t=0.20mm)
⑦G
SHELL-#2
STAINLESS【G/F】
STAINLESS STEEL/ Ni PLATING(t=0.20mm)
⑧H
GLUE WATER
-
EPOXY[Black]
SOFNG ELECTRONIC TECHNOLOGY Co., LTD
CIRCUIT BOARD SIZE
(Vertical view)
Operating Force
Inward
5.0~8.0N.(1N.=100gram-force)
Exiting
5.0~8.0N.(1N.=100gram-force)
PIN ASSIGNMENTS
Reel label
RoHS label
1000PCS/reel
Vacuum Packed Bag
Solder-ability
IR Reflow:255℃,5sec.
Manual:350℃,3sec.
PIN
Signal NAME
Description
PIN
Signal NAME
Description
A1
GND
Ground return
B12
GND
Ground return
A2
SSTXp1
Positive half of firs SuperSpeed
TX differential pair
B11
SSRXp1
Positive half of second SuperSpeed
RX differential pair
A3
SSTXn1
Negatice half of first SuperSpeed
TX differential pair
B10
SSRXn1
Negative half of second SuperSpeed
RX differential pair
A4
V BUS
Bus Power
B9
V BUS
Bus Power
A5
CC1
Configuration Channel
B8
SBU2
Sideband Use(SBU)
A6
Dp1
Positive half of the USB 2.0
differential pair-Position 1
B7
Dn2
Negative half of the USB 2.0
differential pair-Position 2
A7
Dn1
Negative half of the USB 2.0
differential pair-Position 1
B6
Dp2
Positive half of the USB 2.0
differential pair-Position 2
A8
SBU1
Sideband Use(SBU)
B5
CC2
Configuration Channel
A9
V BUS
Bus Power
B4
V BUS
Bus Power
A10
SSRXn2
Negative half of second
SuperSpeed RX differential pair
B3
SSTXn2
Negatice half of first SuperSpeed TX
differential pair2
A11
SSRXp2
Positive half of second
SuperSpeed RX differential pair
B2
SSTXp2
Positive half of firs SuperSpeed TX
differential pair2
A12
GND
Ground return
B1
GND
Ground return
RoHS label
Cardboard box label
注記 NOTICE
1.碩方公司擁有最終解釋權;The SOFNG company reserves the right of final interpretation;
2.文件禁止外洩、轉載;Leaked and reproduced prohibited;
3.未經授權修改無效。Modify is invalid.
(Max.)
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