PCMFxUSB3BA/C series
Common-mode EMI filter for differential channels with
integrated bidirectional ESD protection
Rev. 3 — 25 November 2019
Product data sheet
1. General description
Common-mode ElectroMagnetic Interference (EMI) filters with integrated bidirectional ElectroStatic
Discharge (ESD) protection for one, two and three differential channels. The devices are designed
to provide low insertion loss for differential high-speed signals on each channel while unwanted
common-mode signals are attenuated.
Each differential channel incorporates two signal lines that are coupled by integrated coils. Diodes
provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.
Table 1. Product overview
Type number
Number of channels Package Name
PCMF1USB3BA/C
1
WLCSP5
PCMF2USB3BA/C
2
WLCSP10
PCMF3USB3BA/C
3
WLCSP15
2. Features and benefits
•
•
•
•
•
•
One, two and three differential channels common-mode EMI filters with integrated ESD
protection
ESD protection up to ±15 kV contact discharge according to IEC 61000-4-2
Superior common-mode suppression over a wide frequency range
Superior RF performance compared to other integrated filters or discrete filters with external
ESD protection
Extremely high symmetry between line pairs
Industry-standard Wafer-Level Chip-Scale Packages: WLCSP5, 10 and 15 for smaller footprint
3. Applications
•
•
•
•
•
Smartphone, cellular and cordless phone
USB3.2, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection for differential data lines
Tablet PC and Mobile Internet Device (MID)
MIPI M-PHY and D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface
(DSI)
PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
4. Pinning information
Table 2. Pinning
Pin
Symbol
Description
Simplified outline
Graphic symbol
PCMF1USB3BA/C (WLCSP5_2-1-2)
A1
CH1_IN+
channel 1+, external
A2
CH1_IN-
channel 1-, external
B1
GND_CH1
ground channel 1
C1
CH1_OUT+
channel 1+, internal
C2
CH1_OUT-
channel 1-, internal
2
B1
A1
C1
A2
C2
1
A
B
C
Transparent top view
WLCSP5_2-1-2
B1
aaa-028492
PCMF2USB3BA/C (WLCSP10_4-2-4)
A1
CH1_IN+
channel 1+, external
A2
CH1_IN-
channel 1-, external
A3
CH2_IN+
channel 2+, external
A4
CH2_IN-
channel 2-, external
B1
GND_CH1
ground channel 1
B2
GND_CH2
ground channel 2
C1
CH1_OUT+
channel 1+, internal
C2
CH1_OUT-
channel 1-, internal
C3
CH2_OUT+
channel 2+, internal
C4
CH2_OUT-
channel 2-, internal
4
B2
A1, 3
C1, 3
A2, 4
C2, 4
3
2
B1
1
B1, B2 - no internal connection
A
B
C
aaa-028493
Transparent top view
WLCSP10_4-2-4
PCMF3USB3BA/C (WLCSP15_6-3-6)
A1
CH1_IN+
channel 1+, external
A2
CH1_IN-
channel 1-, external
A3
CH2_IN+
channel 2+, external
A4
CH2_IN-
channel 2-, external
A5
CH3_IN+
channel 3+, external
A6
CH3_IN-
channel 3-, external
B1
GND_CH1
ground channel 1
B2
GND_CH2
ground channel 2
B3
GND_CH3
ground channel 3
C1
CH1_OUT+
channel 1+, internal
C2
CH1_OUT-
channel 1-, internal
C3
CH2_OUT+
channel 2+, internal
C4
CH2_OUT-
channel 2-, internal
C5
CH3_OUT+
channel 3+, internal
C6
CH3_OUT-
channel 3-, internal
PCMFXUSB3BA_C_SER
Product data sheet
6
B3
A1, 3, 5
C1, 3, 5
A2, 4, 6
C2, 4, 6
5
4
B2
3
B1, B2, B3 - no internal connection
aaa-028494
2
B1
1
A
B
C
Transparent top view
WLCSP15_6-3-6
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
5. Ordering information
Table 3. Ordering information
Type number
Package
Name
Description
PCMF1USB3BA/C
WLCSP5
wafer level chip-size package; 5 bumps (2-1-2)
PCMF2USB3BA/C
WLCSP10
wafer level chip-size package; 10 bumps (4-2-4)
PCMF3USB3BA/C
WLCSP15
wafer level chip-size package; 15 bumps (6-3-6)
6. Marking
Table 4. Marking codes
Type number
Marking code
PCMF1USB3BA/C
PF1A
PCMF2USB3BA/C
PF2A
PCMF3USB3BA/C
PF3A
7. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VI
input voltage
VESD
electrostatic discharge
voltage
Conditions
Min
Max
Unit
-4
4
V
IEC 61000-4-2, level 4;all
input pins to ground
•
contact discharge
-15
15
kV
•
air discharge
-15
15
kV
IEC 61000-4-2, level 4;all
output pins to ground
PCMFXUSB3BA_C_SER
Product data sheet
•
contact discharge
-2
2
kV
•
air discharge
-2
2
kV
-7.5
7.5
A
IPPM
rated peak-pulse
current
tp = 8/20 μs
Tstg
storage temperature
-40
+125
°C
Tamb
ambient temperature
-40
+125
°C
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
8. Characteristics
8.1. Channel characteristics
Table 6. Channel characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
parameter
Conditions
Min
Typ
Max
Unit
RS(ch)
channel
series
resistance
single line; input
to output
-
2.2
-
Ω
Cd
diode
capacitance
f = 1 MHz;
VI = 2.5 V
[1] -
0.3
-
pF
IRM
reverse
leakage
current
per line;
VI = 4 V
-
1
100
nA
VBR
breakdown
voltage
IR = 1 mA
6
9
-
V
Rdyn
dynamic
resistance
TLP; positive
transient
[2] -
0.29
-
Ω
TLP; negative
transient
[2] -
0.29
-
Ω
[1]
[2]
This parameter is guaranteed by design
100 ns Transmission Line Pulse (TLP); 50 Ω; pulser at 70 ns to 90 ns.
8.2. Frequency characteristics
Table 7. Frequency characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
Unit
10
-
GHz
Differential mode: Sdd21
f-3dB
[1]
PCMFXUSB3BA_C_SER
Product data sheet
cut-off frequency
[1] -
Normalized to attenuation at 1 MHz.
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
aaa-029770
0
aaa-029771
0
Scc21
(dB)
Sdd21
(dB)
-10
-2
-20
-4
-30
-6
107
Fig. 1.
108
109
1010
f (Hz)
-40
107
1011
Differential mode insertion loss; typical values
Fig. 2.
109
1010
f (Hz)
1011
Common-mode insertion loss; typical values
aaa-029773
115
aaa-029772
0
108
Zdif
(Ω)
Sdd21
(dB)
-20
105
Z reference
-40
95
Z DUT
-60
-80
108
85
44.2
109
1010
f (Hz)
CH1 to CH2
Fig. 3.
Differential crosstalk; typical values
PCMFXUSB3BA_C_SER
Product data sheet
44.4
44.6
t (ns)
1011
44.8
tr = 200 ps
Fig. 4.
Differential Time Domain Reflectometer (TDR)
plot; typical values
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
aaa-029774
25
I
(A)
I
(A)
20
-5
15
-10
10
-15
5
-20
0
0
4
8
12
VCL (V)
-25
-16
16
Transmission Line Pulse (TLP) = 100 ns;
measured CH_IN to GND
Fig. 5.
Dynamic resistance with positive clamping;
typical values
I
(A)
-12
-8
-4
VCL (V)
0
Transmission Line Pulse (TLP) = 100 ns;
measured CH_IN to GND
Fig. 6.
Dynamic resistance with negative clamping;
typical values
aaa-029776
60
aaa-029777
0
I
(A)
40
-20
20
-40
0
0
10
20
VCL (V)
-60
-30
30
Very-Fast Transmission Line Pulse
(VF-TLP) = 5 ns;
measured CH_IN to GND
Fig. 7.
aaa-029775
0
-20
-10
VCL (V)
0
Very-Fast Transmission Line Pulse
(VF-TLP) = 5 ns;
measured CH_IN to GND
Dynamic resistance with positive clamping;
typical values
Fig. 8.
Dynamic resistance with negative clamping;
typical values
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD
protection during an ESD event. Do not connect unlimited DC current sources to the data lines to
avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage
(due to an ESD pulse for instance).
PCMFXUSB3BA_C_SER
Product data sheet
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
aaa-029778
8
I
(A)
I
(A)
6
-2
4
-4
2
-6
0
0
2
4
6
VCL (V)
8
IEC61000-4-5; tp = 8/20 μs; positive pulse
Fig. 9.
aaa-029779
0
Dynamic resistance with positive clamping;
typical values
PCMFXUSB3BA_C_SER
Product data sheet
-8
-8
-6
-4
-2
VCL (V)
0
IEC61000-4-5; tp = 8/20 μs; negative pulse
Fig. 10. Dynamic resistance with negative clamping;
typical values
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
9. Application information
The device is designed to provide high-level ESD protection for differential high-speed data line
pairs such as:
•
•
•
•
•
•
USB 3.2
HDMI 2.0
Transition-Minimized Differential Signaling (TMDS)
DisplayPort
external Serial Advanced Technology Attachment (eSATA)
Low Voltage Differential Signaling (LVDS)
When designing the Printed-Circuit Board (PCB), give careful consideration to impedance matching
and signal coupling. Do not connect the protected signal lines to unlimited current sources like, for
example, a battery.
Fig. 11. Application diagram: protecting the differential data lines of a USB Type-C
connector evaluation dongle with PCMF1USB3BA/C
Since the SuperSpeed TX/RX lines are separated by GND or VBUS from the Hi-Speed lines,
PCMF1USB3BA/C makes it easy to achieve same signal lengths, straight routing, and optimal
positioning for ESD protection directly at the connector.
PCMFXUSB3BA_C_SER
Product data sheet
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
10. Package outline
WLCSP5: wafer level chip-size package; 5 bumps (2-1-2)
PCMF1USB3BA/C
D
bump A1
index area
A1
E
A
detail X
e
1/2 e
b
C
e1
B1
B
e2
A
bump A1
index area
1
2
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
A1
b
D
E
e
e1
e2
max 0.64 0.42 0.31 0.82 1.22
nom 0.61 0.41 0.26 0.77 1.17 0.40 0.40 0.80
min 0.58 0.40 0.21 0.72 1.12
pcmf1usb3ba-c_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
19-03-20
19-04-02
PCMF1USB3BA/C
Fig. 12. Package outline WLCSP5
PCMFXUSB3BA_C_SER
Product data sheet
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)
PCMF2USB3BA/C
D
bump A1
index area
A1
E
A
detail X
e
b
C
B1
B
e1
B2
e2
A
bump A1
index area
1
2
e3
3
4
X
1/2 e
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
A1
b
D
E
e
e1
e2
max 0.64 0.42 0.31 1.62 1.22
nom 0.61 0.41 0.26 1.57 1.17 0.40 0.40 0.80
min 0.58 0.40 0.21 1.52 1.12
e3
0.80
pcmf2usb3ba-c_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
19-03-20
19-04-02
PCMF2USB3BA/C
Fig. 13. Package outline WLCSP10
PCMFXUSB3BA_C_SER
Product data sheet
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Rev. 3 — 25 November 2019
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10 / 15
PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)
PCMF3USB3BA/C
D
bump A1
index area
A1
E
A
detail X
e
1/2 e
b
C
B1
B
B2
e1
B3
e2
A
1
bump A1
index area
2
e3
3
4
5
6
X
0
1 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
A1
b
D
E
e
e1
e2
e3
max 0.64 0.42 0.31 2.42 1.22
nom 0.61 0.41 0.26 2.37 1.17 0.40 0.40 0.80 0.80
min 0.58 0.40 0.21 2.32 1.12
pcmf3usb3ba-c_po
Outline
version
References
IEC
JEDEC
JEITA
European
projection
Issue date
19-03-20
PCMF3USB3BA/C
Fig. 14. Package outline WLCSP15
PCMFXUSB3BA_C_SER
Product data sheet
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
11. Soldering
WLCSP5: Solder footprint and stencil aperture
PCMF1USB3BA/C
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
SL = SP
solder resist opening (SR)
SR
occupied area
detail X
Dimensions in mm
P
SL
SP
SR
Hx
recommend stencil thickness: 0.1 mm
Hy
19-03-20
19-04-02
0.40 0.25 0.25 0.325 1.00 1.40
pcmf1usb3ba-c_fr
Fig. 15. Soldering footprint WLCSP5 (PCMF1USB3BA/C)
WLCSP10: Solder footprint and stencil aperture
PCMF2USB3BA/C
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
SL = SP
solder resist opening (SR)
SR
occupied area
P1
Dimensions in mm
P
P1
SL
SP
SR
Hx
Hy
detail X
recommend stencil thickness: 0.1 mm
19-03-20
19-04-02
0.40 0.80 0.25 0.25 0.325 1.80 1.40
pcmf2usb3ba-c_fr
Fig. 16. Soldering footprint WLCSP10 (PCMF2USB3BA/C)
PCMFXUSB3BA_C_SER
Product data sheet
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
WLCSP15: Solder footprint and stencil aperture
PCMF3USB3BA/C
Hx
P
see
detail X
P
solder land (SL)
Hy
solder paste deposit (SP)
solder land plus solder paste
SL = SP
solder resist opening (SR)
SR
occupied area
P1
Dimensions in mm
P
P1
SL
SP
SR
Hx
Hy
detail X
recommend stencil thickness: 0.1 mm
19-03-20
0.40 0.80 0.25 0.25 0.325 2.60 1.40
pcmf3usb3ba-c_fr
Fig. 17. Soldering footprint WLCSP15 (PCMF3USB3BA/C)
PCMFXUSB3BA_C_SER
Product data sheet
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
12. Revision history
Table 8. Revision history
Document ID
Release
date
Data sheet status
Change
notice
Supersedes
PCMFXUSB3BA_C_SER v.3
20191125
Product data sheet
-
PCMFXUSB3BA_C_SER v.2
Modifications:
•
PCMFXUSB3BA_C_SER v.2
20190814
Product data sheet
-
PCMFXUSB3BA_C_SER v.1
PCMFXUSB3BA_C_SER v.1
20190408
Objective data sheet
-
-
PCMFXUSB3BA_C_SER
Product data sheet
Figure 2: corrected y-axis label
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PCMFxUSB3BA/C series
Nexperia
Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Pinning information......................................................2
5. Ordering information....................................................3
6. Marking.......................................................................... 3
7. Limiting values............................................................. 3
8. Characteristics.............................................................. 4
8.1. Channel characteristics............................................... 4
8.2. Frequency characteristics............................................4
9. Application information............................................... 8
10. Package outline.......................................................... 9
11. Soldering................................................................... 12
12. Revision history........................................................14
©
Nexperia B.V. 2019. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 25 November 2019
PCMFXUSB3BA_C_SER
Product data sheet
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