PESD3USB3S/CX

PESDxUSB3S series ESD protection for differential data lines Rev. 4 — 30 January 2019 Product data sheet 1. Product profile 1.1. General description The devices are ElectroStatic Discharge (ESD) protection for one, two and three differential channels. The devices are footprint compatible to PCMFxUSB3S common mode filters with ESD protection. Diodes provide protection to downstream components from ESD voltages up to ±15 kV on each signal line. Table 1. Product overview Type number Number of channels Package Name PESD1USB3S 1 WLCSP5 PESD2USB3S 2 WLCSP10 PESD3USB3S 3 WLCSP15 1.2. Features and benefits • • • • Allows switching between PCMFxUSB3S common mode filters with ESD protection and PESDxUSB3S ESD protection in the same footprint TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs) ESD protection for one, two and three differential channels up to ±15 kV contact discharge according to IEC 61000-4-2 Industry-standard WLCSP5, 10 and 15 packages for smallest footprint 1.3. Applications • • • • • Smartphone, cellular and cordless phone USB3.1, USB2.0, HDMI2.0, HDMI1.4 General-purpose downstream ESD protection for differential data lines Tablet PC and Mobile Internet Device (MID) MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI) PESDxUSB3S series Nexperia ESD protection for differential data lines 2. Pinning information Table 2. Pinning Pin Symbol Description Simplified outline Graphic symbol PESD1USB3S (WLCSP5_2-1-2) A1 CH1_IN+ channel 1+, external A2 CH1_IN- channel 1-, external B1 GND_CH1 ground channel 1 C1 CH1_OUT+ channel 1+, internal C2 CH1_OUT- channel 1-, internal 2 B1 A1 C1 A2 C2 1 A B C Transparent top view WLCSP5_2-1-2 B1 aaa-021381 PESD2USB3S (WLCSP10_4-2-4) A1 CH1_IN+ channel 1+, external A2 CH1_IN- channel 1-, external A3 CH2_IN+ channel 2+, external A4 CH2_IN- channel 2-, external B1 GND_CH1 ground channel 1 B2 GND_CH2 ground channel 2 C1 CH1_OUT+ channel 1+, internal C2 CH1_OUT- channel 1-, internal C3 CH2_OUT+ channel 2+, internal C4 CH2_OUT- channel 2-, internal 4 B2 A1, 3 C1, 3 A2, 4 C2, 4 3 2 B1 1 B1, B2 - no internal connection A B C aaa-021384 Transparent top view WLCSP10_4-2-4 PESD3USB3S (WLCSP15_6-3-6) A1 CH1_IN+ channel 1+, external A2 CH1_IN- channel 1-, external A3 CH2_IN+ channel 2+, external A4 CH2_IN- channel 2-, external A5 CH3_IN+ channel 3+, external A6 CH3_IN- channel 3-, external B1 GND_CH1 ground channel 1 B2 GND_CH2 ground channel 2 B3 GND_CH3 ground channel 3 C1 CH1_OUT+ channel 1+, internal C2 CH1_OUT- channel 1-, internal C3 CH2_OUT+ channel 2+, internal C4 CH2_OUT- channel 2-, internal C5 CH3_OUT+ channel 3+, internal C6 CH3_OUT- channel 3-, internal PESDXUSB3S_SER Product data sheet 6 B3 A1, 3, 5 C1, 3, 5 A2, 4, 6 C2, 4, 6 5 4 B2 3 B1, B2, B3 - no internal connection aaa-021385 2 B1 1 A B C Transparent top view WLCSP15_6-3-6 All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 2 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines 3. Ordering information Table 3. Ordering information Type number Package Name Description PESD1USB3S WLCSP5 wafer level chip-size package; 5 bumps (2-1-2) PESD2USB3S WLCSP10 wafer level chip-size package; 10 bumps (4-2-4) PESD3USB3S WLCSP15 wafer level chip-size package; 15 bumps (6-3-6) 4. Marking Table 4. Marking codes Type number Marking code PESD1USB3S PD1S PESD2USB3S PD2S PESD3USB3S PD3S 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VI input voltage Conditions VESD electrostatic discharge voltage Min Max Unit -0.5 5 V IEC 61000-4-2, level 4; all input pins to ground • contact discharge -15 15 kV • air discharge -15 15 kV IEC 61000-4-2, level 4; all output pins to ground PESDXUSB3S_SER Product data sheet • contact discharge -2 2 kV • air discharge -2 2 kV -8 8 A IPPM rated peak-pulse current tp = 8/20 μs Tstg storage temperature -40 +125 °C Tamb ambient temperature -40 +125 °C All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 3 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines 6. Characteristics 6.1. Channel characteristics Table 6. Channel characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Cd diode capacitance f = 1 MHz; VI = 2.5 V IRM reverse leakage current per line; VI = 5 V VBR breakdown voltage IR = 1 mA VF forward voltage IF = 10 mA Rdyn dynamic resistance TLP Min Max Unit 0.45 - pF - 1 100 nA 6 9 - V - 0.8 - V [1] - [2] • positive transient - 0.16 - Ω • negative transient - 0.16 - Ω surge [1] [2] [3] Typ [3] • positive transient - 0.25 - Ω • negative transient - 0.25 - Ω Min Typ Max Unit 17 - GHz This parameter is guaranteed by design. 100 ns Transmission Line Pulse (TLP); 50 Ω; pulser at 70 to 90 ns. According to IEC 61000-4-5 (8/20 μs). 6.2. Frequency characteristics Table 7. Frequency characteristics Tamb = 25 °C unless otherwise specified. Symbol Parameter Conditions Differential mode: Sdd21 f-3dB [1] cut-off frequency [1] - Normalized to attenuation at 1 MHz. aaa-021319 1 Sdd21 (dB) aaa-021320 0 Sdd21 (dB) -1 -20 Sdd21 A3-A4 > C1-C2 -3 -40 -5 -60 Sdd21 pin 1 - 2 Sdd21 A5-A6 > C1-C2 Sdd21 pin 5 - 6 -7 107 Fig. 1. 108 109 1010 f (Hz) Differential mode insertion loss; typical values PESDXUSB3S_SER Product data sheet -80 108 1011 Fig. 2. 109 1010 f (Hz) 1011 Differential cross-talk; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 4 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines aaa-021321 115 Zdif (Ω) 105 Z reference 95 Z DUT 85 40.70 40.90 40.11 t (ns) 4.13 tr = 200 ps Fig. 3. Differential Time Domain Reflectometer (TDR) plot; typical values aaa-021322 Fig. 4. USB3.1 eye diagram 10 Gbps, test board with PESD3USB3S; typical values aaa-021323 Fig. 5. USB3.1 eye diagram 10 Gbps, test board without device; typical values PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 5 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines aaa-021324 Fig. 6. HDMI 2.0 eye diagram TP1, test board with PESD3USB3S; typical values aaa-021325 Fig. 7. HDMI 2.0 eye diagram TP1, test board without device; typical values aaa-021326 25 I (A) I (A) 20 -5 15 -10 10 -15 5 -20 0 0 5 10 15 20 VCL (V) -25 -25 25 Transmission Line Pulse (TLP) = 100 ns Fig. 8. aaa-021327 0 Product data sheet -15 -10 -5 VCL (V) 0 Transmission Line Pulse (TLP) = 100 ns Dynamic resistance with positive clamping; typical values PESDXUSB3S_SER -20 Fig. 9. Dynamic resistance with negative; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 6 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines aaa-021328 25 I (A) aaa-021329 0 I (A) 20 -5 15 -10 10 -15 5 -20 0 0 5 10 15 20 VCL (V) 25 -25 -25 -20 -15 -10 -5 VCL (V) 0 Transmission Line Pulse (TLP) = 5 ns Transmission Line Pulse (TLP) = 5 ns Fig. 10. Dynamic resistance with positive clamping; typical values Fig. 11. Dynamic resistance with negative clamping; typical values The device uses an advanced clamping structure showing a negative dynamic resistance. This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage (due to an ESD pulse for instance). aaa-021330 10 I (A) aaa-021331 0 I (A) 8 -2 6 -4 4 -6 2 -8 0 0 2 4 6 8 VCL (V) 10 IEC61000-4-5; tp = 8/20 μs; positive pulse Fig. 12. Dynamic resistance with positive clamping; typical values PESDXUSB3S_SER Product data sheet -10 -10 -8 -6 -4 -2 VCL (V) 0 IEC61000-4-5; tp = 8/20 μs; negative pulse Fig. 13. Dynamic resistance with negative clamping; typical values All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 7 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines 7. Application information The device is designed to provide high-level ESD protection for differential high-speed data line pairs such as: • • • • • • USB 3.2 HDMI 2.0 Transition-Minimized Differential Signaling (TMDS) DisplayPort external Serial Advanced Technology Attachment (eSATA) Low Voltage Differential Signaling (LVDS) When designing the Printed-Circuit Board (PCB), give careful consideration to impedance matching and signal coupling. Do not connect the protected signal lines to unlimited current sources like, for example, a battery. Fig. 14. Application diagram: protecting the differential data lines of a USB Type-C connector evaluation dongle with PESD1USB3S Since the SuperSpeed TX/RX lines are separated by GND or VBUS from the Hi-Speed lines, PESD1USB3S makes it easy to achieve same signal lengths, straight routing, and optimal positioning for ESD protection directly at the connector. PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 8 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines 8. Package outline WLCSP5: wafer level chip-size package; 5 bumps (2-1-2) PESD1USB3S D bump A1 index area A1 E A detail X e 1/2 e b C e1 B1 B e2 A bump A1 index area 1 2 X 0 1 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b D E e e1 e2 max 0.60 0.38 0.31 0.82 1.22 nom 0.57 0.37 0.26 0.77 1.17 0.40 0.40 0.80 min 0.54 0.36 0.21 0.72 1.12 pesd1usb3s_po Outline version References IEC JEDEC JEITA European projection Issue date 15-12-11 PESD1USB3S Fig. 15. Package outline WLCSP5 PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 9 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines WLCSP10: wafer level chip-size package; 10 bumps (4-2-4) PESD2USB3S D bump A1 index area A1 E A detail X e b C e1 B1 B B2 e2 A bump A1 index area 1 2 3 4 e3 X 1/2 e 0 1 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b D E e e1 e2 max 0.60 0.38 0.31 1.62 1.22 nom 0.57 0.37 0.26 1.57 1.17 0.40 0.40 0.80 min 0.54 0.36 0.21 1.52 1.12 e3 0.80 pesd2usb3s_po Outline version References IEC JEDEC JEITA European projection Issue date 15-12-11 PESD2USB3S Fig. 16. Package outline WLCSP10 PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 10 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines WLCSP15: wafer level chip-size package; 15 bumps (6-3-6) PESD3USB3S D bump A1 index area A1 E A detail X e 1/2 e b C B1 B B2 e1 B3 e2 A 1 bump A1 index area 2 3 4 5 6 e3 X 0 1 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b D E e e1 e2 e3 max 0.60 0.38 0.31 2.42 1.22 nom 0.57 0.37 0.26 2.37 1.17 0.40 0.40 0.80 0.80 min 0.54 0.36 0.21 2.32 1.12 pesd3usb3s_po Outline version References IEC JEDEC JEITA European projection Issue date 15-12-11 PESD3USB3S Fig. 17. Package outline WLCSP15 PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 11 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines 9. Soldering WLCSP5: Solder footprint and stencil aperture PESD1USB3S Hx P see detail X P solder land (SL) Hy solder paste deposit (SP) solder land plus solder paste SL = SP solder resist opening (SR) SR occupied area detail X Dimensions in mm P SL SP SR Hx recommend stencil thickness: 0.1 mm Hy 15-12-11 0.40 0.25 0.25 0.325 1.00 1.40 pesd1usb3s_fr Fig. 18. Soldering footprint WLCSP5 (PESD1USB3S) WLCSP10: Solder footprint and stencil aperture PESD2USB3S Hx P see detail X P solder land (SL) Hy solder paste deposit (SP) solder land plus solder paste SL = SP solder resist opening (SR) SR occupied area P1 Dimensions in mm P P1 SL SP SR Hx Hy detail X recommend stencil thickness: 0.1 mm 15-12-14 15-12-16 0.40 0.80 0.25 0.25 0.325 1.80 1.40 pesd2usb3s_fr Fig. 19. Soldering footprint WLCSP10 (PESD2USB3S) PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 12 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines WLCSP15: Solder footprint and stencil aperture PESD3USB3S Hx P see detail X P solder land (SL) Hy solder paste deposit (SP) solder land plus solder paste SL = SP solder resist opening (SR) SR occupied area P1 Dimensions in mm P P1 SL SP SR Hx Hy detail X recommend stencil thickness: 0.1 mm 15-12-14 15-12-16 0.40 0.80 0.25 0.25 0.325 2.60 1.40 pesd3usb3s_fr Fig. 20. Soldering footprint WLCSP15 (PESD3USB3S) PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 13 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines 10. Revision history Table 8. Revision history Document ID Release date Data sheet status Change notice Supersedes PESDXUSB3S_SER v.4 20190130 Product data sheet - PESDXUSB3S_SER v.3 Modifications: • • PESDXUSB3S_SER v.3 20160426 Product data sheet - PESDXUSB3S_SER v.2 PESDXUSB3S_SER v.2 20160127 Product data sheet - PESDXUSB3S_SER v.1 PESDXUSB3S_SER v.1 20151216 PESDXUSB3S_SER Product data sheet Limiting values: maximum value for Tamb updated Frequency characteristics: table and Fig 2 + 3: S21dd changed to Sdd21 All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 14 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines equipment, nor in applications where failure or malfunction of an Nexperia product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Nexperia and its suppliers accept no liability for inclusion and/or use of Nexperia products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. 11. Legal information Data sheet status Document status [1][2] Product status [3] Definition Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Applications — Applications that are described herein for any of these products are for illustrative purposes only. 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This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This Nexperia product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 15 / 16 PESDxUSB3S series Nexperia ESD protection for differential data lines Contents 1. Product profile.............................................................. 1 1.1. General description......................................................1 1.2. Features and benefits..................................................1 1.3. Applications................................................................. 1 2. Pinning information......................................................2 3. Ordering information....................................................3 4. Marking.......................................................................... 3 5. Limiting values............................................................. 3 6. Characteristics.............................................................. 4 6.1. Channel characteristics............................................... 4 6.2. Frequency characteristics............................................4 7. Application information............................................... 8 8. Package outline............................................................ 9 9. Soldering..................................................................... 12 10. Revision history........................................................14 11. Legal information......................................................15 © Nexperia B.V. 2019. All rights reserved For more information, please visit: http://www.nexperia.com For sales office addresses, please send an email to: salesaddresses@nexperia.com Date of release: 30 January 2019 PESDXUSB3S_SER Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 30 January 2019 © Nexperia B.V. 2019. All rights reserved 16 / 16