PSMN0R9-30ULD
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET
in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
23 May 2018
Product data sheet
1. General description
SOT1023A with improved creepage and clearance to meet UL2595 requirements. 300 Amp logic
level gate drive N-channel enhancement mode MOSFET in LFPAK56 package. NextPowerS3
portfolio utilising Nexperia’s unique “SchottkyPlus” technology delivers high efficiency, low spiking
performance usually associated with MOSFETs with an integrated Schottky or Schottky-like diode
but without problematic high leakage current. NextPowerS3 is particularly suited to high efficiency
applications at high switching frequencies.
2. Features and benefits
•
•
•
•
•
•
•
•
•
•
•
Improved creepage and clearance – meets the requirements of UL2595
300 A capability
Avalanche rated, 100% tested at IAS = 190 A
Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching
frequencies
Superfast switching with soft-recovery; s-factor > 1
Low spiking and ringing for low EMI designs
Unique “SchottkyPlus” technology; Schottky-like performance with < 1 μA leakage at 25 °C
Optimised for 4.5 V gate drive
Low parasitic inductance and resistance
High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds,
qualified to 150 °C
Wave solderable; exposed leads for optimal visual solder inspection
3. Applications
•
•
•
Brushed and brushless motor control
Battery powered appliances where enhanced creepage and clearance is required to meet
UL2595
For non-UL2595 applications please use PSMN0R9-30YLD
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 150 °C
-
-
30
V
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
-
300
A
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
-
-
227
W
Tj
junction temperature
-55
-
150
°C
[1]
PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VGS = 4.5 V; ID = 25 A; Tj = 25 °C;
Fig. 10
-
0.79
1.09
mΩ
VGS = 10 V; ID = 25 A; Tj = 25 °C;
Fig. 10
-
0.65
0.87
mΩ
Static characteristics
RDSon
drain-source on-state
resistance
Dynamic characteristics
QGD
gate-drain charge
ID = 25 A; VDS = 15 V; VGS = 4.5 V;
Fig. 12; Fig. 13
-
13.5
-
nC
QG(tot)
total gate charge
ID = 25 A; VDS = 15 V; VGS = 10 V;
Fig. 12; Fig. 13
-
109
-
nC
IS = 25 A; dIS/dt = -100 A/µs; VGS = 0 V;
VDS = 15 V; Fig. 16
-
0.9
-
Source-drain diode
S
[1]
softness factor
300A Continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
5. Pinning information
Table 2. Pinning information
Pin
Symbol Description
Simplified outline
1
S
source
2
S
source
3
S
source
4
G
gate
mb
D
mounting base; connected to
drain
Graphic symbol
D
G
mbb076
1
2
3
S
4
sot1023a_sv
LFPAK56-UL2595
(SOT1023A)
6. Ordering information
Table 3. Ordering information
Type number
PSMN0R9-30ULD
PSMN0R9-30ULD
Product data sheet
Package
Name
Description
Version
LFPAK56-UL
2595
plastic, single-ended surface-mounted package (LFPAK56); 4
leads; 1.27 mm pitch
SOT1023A
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
7. Marking
Table 4. Marking codes
Type number
Marking code
PSMN0R9-30ULD
0D93UL
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 150 °C
-
30
V
VDGR
drain-gate voltage
25 °C ≤ Tj ≤ 150 °C; RGS = 20 kΩ
-
30
V
VGS
gate-source voltage
-20
20
V
Ptot
total power dissipation
Tmb = 25 °C; Fig. 1
-
227
W
ID
drain current
VGS = 10 V; Tmb = 25 °C; Fig. 2
-
300
A
VGS = 10 V; Tmb = 100 °C; Fig. 2
-
284
A
pulsed; tp ≤ 10 µs; Tmb = 25 °C; Fig. 3
-
1592
A
[1]
IDM
peak drain current
Tstg
storage temperature
-55
150
°C
Tj
junction temperature
-55
150
°C
Tsld(M)
peak soldering
temperature
-
260
°C
VESD
electrostatic discharge
voltage
HBM
2
-
kV
Source-drain diode
IS
source current
Tmb = 25 °C
-
242
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tmb = 25 °C
-
1800
A
[2]
-
2575
mJ
[2]
-
190
A
Avalanche ruggedness
EDS(AL)S
non-repetitive drainsource avalanche
energy
IAS
non-repetitive avalanche Vsup ≤ 30 V; VGS = 10 V; Tj(init) = 25 °C;
current
RGS = 50 Ω
[1]
[2]
ID = 25 A; Vsup ≤ 30 V; RGS = 50 Ω;
VGS = 10 V; Tj(init) = 25 °C; unclamped;
tp = 6.1 ms
300A Continuous current has been successfully demonstrated during application tests. Practically the current will be limited by PCB,
thermal design and operating temperature.
Protected by 100% test
PSMN0R9-30ULD
Product data sheet
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
03ne36
120
aaa-020460
500
ID
(A)
Pder
(%)
400
80
300
(1)
200
40
100
0
Fig. 1.
0
50
100
150
Tmb (° C)
0
200
25
50
75
100
125
150 175
Tmb (°C)
200
(1) 300A continuous current has been successfully
demonstrated during application tests. Practically
the current will be limited by PCB, thermal design
and operating temperature
Normalized total power dissipation as a
function of mounting base temperature
Fig. 2.
ID
(A)
0
Continuous drain current as a function of
mounting base temperature
aaa-027871
104
103
Limit RDSon = VDS / ID
tp = 10 µs
102
100 µs
DC
10
1 ms
10 ms
100 ms
1
10-1
1
10
VDS (V)
102
Tmb = 25 °C; IDM is a single pulse
Fig. 3.
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
PSMN0R9-30ULD
Product data sheet
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-mb)
thermal resistance
from junction to
mounting base
Fig. 4
-
0.45
0.55
K/W
Rth(j-a)
thermal resistance
from junction to
ambient
Fig. 5
-
50
-
K/W
Fig. 6
-
125
-
K/W
aaa-027870
1
Zth(j-mb)
(K/W)
δ = 0.5
10-1 0.2
0.1
0.05
0.02
10-2
single shot
P
δ=
Fig. 4.
10-5
10-4
10-3
10-2
T
10-1
tp (s)
1
Transient thermal impedance from junction to mounting base as a function of pulse duration
aaa-005751
aaa-005750
Fig. 5.
T
t
tp
10-3
10-6
tp
PCB layout for thermal resistance junction to
ambient 1” square pad; FR4 Board; 2oz copper
PSMN0R9-30ULD
Product data sheet
Fig. 6.
PCB layout for thermal resistance junction to
ambient minimum footprint;FR4 board; 2oz
copper
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
drain-source
breakdown voltage
ID = 250 µA; VGS = 0 V; Tj = 25 °C
30
-
-
V
ID = 250 µA; VGS = 0 V; Tj = -55 °C
27
-
-
V
VGS(th)
gate-source threshold
voltage
ID = 1 mA; VDS=VGS; Tj = 25 °C
1.2
1.5
2.2
V
ΔVGS(th)/ΔT
gate-source threshold
voltage variation with
temperature
25 °C ≤ Tj ≤ 150 °C
-
-4.5
-
mV/K
IDSS
drain leakage current
VDS = 24 V; VGS = 0 V; Tj = 25 °C
-
-
1
µA
VDS = 24 V; VGS = 0 V; Tj = 125 °C
-
3.7
-
µA
VGS = 16 V; VDS = 0 V; Tj = 25 °C
-
-
100
nA
VGS = -16 V; VDS = 0 V; Tj = 25 °C
-
-
100
nA
VGS = 4.5 V; ID = 25 A; Tj = 25 °C;
Fig. 10
-
0.79
1.09
mΩ
VGS = 4.5 V; ID = 25 A; Tj = 150 °C;
Fig. 10; Fig. 11
-
-
1.8
mΩ
VGS = 10 V; ID = 25 A; Tj = 25 °C;
Fig. 10
-
0.65
0.87
mΩ
VGS = 10 V; ID = 25 A; Tj = 150 °C;
Fig. 10; Fig. 11
-
-
1.44
mΩ
f = 1 MHz
-
1.4
-
Ω
ID = 25 A; VDS = 15 V; VGS = 10 V;
Fig. 12; Fig. 13
-
109
-
nC
ID = 25 A; VDS = 15 V; VGS = 4.5 V;
Fig. 12; Fig. 13
-
51
-
nC
ID = 0 A; VDS = 0 V; VGS = 0 V
-
99
-
nC
ID = 25 A; VDS = 15 V; VGS = 4.5 V;
Fig. 12; Fig. 13
-
15.3
-
nC
-
10.5
-
nC
Static characteristics
V(BR)DSS
IGSS
RDSon
RG
gate leakage current
drain-source on-state
resistance
gate resistance
Dynamic characteristics
QG(tot)
total gate charge
QGS
gate-source charge
QGS(th)
pre-threshold gatesource charge
QGS(th-pl)
post-threshold gatesource charge
-
4.8
-
nC
QGD
gate-drain charge
-
13.5
-
nC
VGS(pl)
gate-source plateau
voltage
ID = 25 A; VDS = 15 V; Fig. 12; Fig. 13
-
2.4
-
V
Ciss
input capacitance
-
7668
-
pF
Coss
output capacitance
VDS = 15 V; VGS = 0 V; f = 1 MHz;
Tj = 25 °C; Fig. 14
-
2914
-
pF
Crss
reverse transfer
capacitance
-
445
-
pF
PSMN0R9-30ULD
Product data sheet
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
td(on)
turn-on delay time
-
38.1
-
ns
tr
rise time
VDS = 15 V; RL = 0.6 Ω; VGS = 4.5 V;
RG(ext) = 5 Ω
-
49.8
-
ns
td(off)
turn-off delay time
-
63
-
ns
tf
fall time
-
42.6
-
ns
Qoss
output charge
VGS = 0 V; VDS = 15 V; f = 1 MHz;
Tj = 25 °C
-
83.11
-
nC
Source-drain diode
VSD
source-drain voltage
IS = 25 A; VGS = 0 V; Tj = 25 °C; Fig. 15
-
0.76
1.2
V
trr
reverse recovery time
-
52
-
ns
Qr
recovered charge
IS = 25 A; dIS/dt = -100 A/µs; VGS = 0 V;
VDS = 15 V; Fig. 16
-
67
-
nC
ta
reverse recovery rise
time
-
27.4
-
ns
tb
reverse recovery fall
time
-
24.7
-
ns
S
softness factor
-
0.9
-
[1]
[1]
includes capacitive recovery
aaa-011698
180
ID
(A)
10 V
VGS = 3 V
2.8 V
RDSon
(mΩ)
aaa-011700
6
5
135
4
2.6 V
90
3
2
45
2.4 V
1
2.2 V
0
Fig. 7.
0
0.5
1
1.5
2
VDS (V)
0
2.5
Output characteristics; drain current as a
Fig. 8.
function of drain-source voltage; typical values
PSMN0R9-30ULD
Product data sheet
0
2
6
8
10
12
14
VGS (V)
16
Drain-source on-state resistance as a function
of gate-source voltage; typical values
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
aaa-011701
200
ID
(A)
aaa-011702
12
RDSon
(mΩ)
160
2.4 V
2.6 V
2.8 V
9
120
6
80
40
150°C
3
Tj = 25°C
3V
4.5 V
0
Fig. 9.
0
0.5
1
1.5
2
2.5
3
VGS (V)
0
3.5
Transfer characteristics; drain current as a
function of gate-source voltage; typical values
25
50
75
100
125
150 175
ID (A)
200
Fig. 10. Drain-source on-state resistance as a function
of drain current; typical values
VDS
ID
10 V
1.6
VGS(pl)
1.2
VGS(th)
VGS = 4.5 V
0.8
VGS
QGS2
QGS1
0.4
0
-60
0
003aal037
2
a
VGS = 10 V
-30
0
30
60
90
120 150
Tj (°C)
QGS
QGD
QG(tot)
003aaa508
Fig. 12. Gate charge waveform definitions
180
Fig. 11. Normalized drain-source on-state resistance
factor as a function of junction temperature
PSMN0R9-30ULD
Product data sheet
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
VGS
(V)
aaa-011703
10
aaa-011705
105
C
(pF)
8
104
Ciss
6
24 V
Coss
15 V
4
103
VDS = 6 V
Crss
2
0
0
20
40
60
80
100
QG (nC)
102
10-1
120
10
VDS (V)
003aal160
aaa-011706
103
102
Fig. 14. Input, output and reverse transfer capacitances
as a function of drain-source voltage; typical
values
Fig. 13. Gate-source voltage as a function of gate
charge; typical values
IS
(A)
1
ID
(A)
102
trr
ta
0.25 IRM
1
10-1
tb
0
10
150°C
0
0.2
Tj = 25°C
0.4
0.6
0.8
IRM
1
VSD (V)
t (s)
1.2
Fig. 16. Reverse recovery timing definition
Fig. 15. Source current as a function of source-drain
voltage; typical values
PSMN0R9-30ULD
Product data sheet
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9 / 13
PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
11. Package outline
Plastic single-ended surface-mounted package (LFPAK56); 4 leads
E
A
SOT1023A
E1
A
b1
b2
(3x)
c1
mounting
base
D1
D
H
L (4x)
1
2
3
4
b
(4x)
e
(3x)
C
w
X
c
A
A1
A2
Lp
detail X
0
2.5
θ
y C
5 mm
scale
Dimensions
Unit
mm
A
A1
A2
b
b1
b2
c
c1
D(1) D1(1) E(1) E1(1)
max 1.10 0.15
0.50 4.41
0.25 0.30 4.70
nom
0.25
0.85
min 0.95 0.00
0.35 3.62
0.19 0.24 4.45
3.8
5.30
3.7
3.6
4.95
3.5
e
1.27
H
L
Lp
6.2
1.3
0.85
5.9
0.8
0.40
w
y
0.25
0.1
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
Outline
version
SOT1023A
JEDEC
8°
0°
sot1023a_po
References
IEC
θ
JEITA
European
projection
Issue date
17-05-29
17-06-02
---
Fig. 17. Package outline LFPAK56-UL2595 (SOT1023A)
PSMN0R9-30ULD
Product data sheet
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Suitability for use — Nexperia products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction
of an Nexperia product can reasonably be expected to result in personal
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
12. Legal information
Data sheet status
Document status
[1][2]
Product
status [3]
Definition
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Nexperia and its customer, unless Nexperia and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be
valid in which the Nexperia product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. Nexperia takes no responsibility
for the content in this document if provided by an information source outside
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special or consequential damages (including - without limitation - lost
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damages are based on tort (including negligence), warranty, breach of
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Notwithstanding any damages that customer might incur for any reason
whatsoever, Nexperia’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Nexperia.
Right to make changes — Nexperia reserves the right to make changes
to information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
PSMN0R9-30ULD
Product data sheet
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Nexperia product is suitable
and fit for the customer’s applications and products planned, as well as
for the planned application and use of customer’s third party customer(s).
Customers should provide appropriate design and operating safeguards to
minimize the risks associated with their applications and products.
Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Nexperia products in order to
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liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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23 May 2018
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PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
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between the translated and English versions.
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PSMN0R9-30ULD
Product data sheet
All information provided in this document is subject to legal disclaimers.
23 May 2018
©
Nexperia B.V. 2018. All rights reserved
12 / 13
PSMN0R9-30ULD
Nexperia
N-channel 30 V, 0.87 mΩ, 300 A logic level MOSFET in SOT1023A enhanced package for UL2595, using
NextPowerS3 Schottky-Plus Technology
Contents
1. General description......................................................1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 3
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 5
10. Characteristics............................................................ 6
11. Package outline........................................................ 10
12. Legal information.......................................................11
©
Nexperia B.V. 2018. All rights reserved
For more information, please visit: http://www.nexperia.com
For sales office addresses, please send an email to: salesaddresses@nexperia.com
Date of release: 23 May 2018
PSMN0R9-30ULD
Product data sheet
All information provided in this document is subject to legal disclaimers.
23 May 2018
©
Nexperia B.V. 2018. All rights reserved
13 / 13