UDT26A05L05
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
UDT26A05L05 is surge rated diode arrays designed to protect high
speed data interfaces. It has been specifically designed to protect
sensitive components which is connected to data and transmission
lines from overvoltage caused by electrostatic discharge (ESD), electrical
fast transients (EFT), and lightning.
The unique design of the device incorporates one surge rated, and
four data lines. Low capacitance steering diodes and a TVS diode in
a single package. The low capacitance array configuration allows the
user to protect four high speed data or transmission lines.
Features
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IEC61000-4-2 ESD 15KV Air, 8KV contact compliance
SOT23-6L surface mount package
Protects four high-speed data lines and one power line
Array of surge rated, low capacitance diodes
Working voltage: 5V
Low leakage current
Low clamping voltage
Solid-state silicon avalanche technology
Lead Free/RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270℃
Flammability rating UL 94V-0
Meets MSL level 1, per J-STD-020
Marking: B 05B or 054
Pin Configuration
Applications
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USB power and data line protection
10/100/1000 Ethernet
Video line protection
I2C bus protection
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WAN/LAN equipment
ISDN S/T interface
Microcontroller input protection
Portable electronics
Maximum Ratings
Rating
ESD voltage (Contact discharge)
ESD voltage (Air discharge)
Storage & operating temperature range
Revision:24-Mar-16
Symbol
VESD
TSTG ,TJ
Value
±8
±15
-55~+150
Unit
kV
℃
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UDT26A05L05
Electrical Characteristics (TJ=25℃)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Symbol
Condition
Min.
Typ.
VRWM
Max.
Unit
5
V
VBR
IBR=1mA
6
V
Reverse leakage current
IR
VR=5V
5
μA
Clamping voltage (tp=8/20μs)
VC
IPP=1A
9.8
V
Clamping voltage (tp=8/20μs)
VC
IPP=2A
16
V
Off state junction capacitance
CJ
0Vdc,f=1MHz
Between I/O
pins and GND
2.5
pF
Applications Information
Revision:24-Mar-16
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UDT26A05L05
ESD Protection Standards
IEC61000-4-2
Interfaces of consumer electronic equipment are widely specified according to the International Electrotechnical
Commission standard IEC61000-4-2. This standard is not targeted towards particular devices but towards general
equipment, systems and subsystems that may be involved in electrostatic discharge. consists of a 150pF capacitor
and a 330Ω series resistor representing the counterpart to the Device Under Test (DUT).
Human Body Model (HBM, MIL-883E method 3015.7)
The HBM standard simulates an ESD surge generated by human contact to electronic components.
Revision:24-Mar-16
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UDT26A05L05
Recommended Soldering Conditions
Reflow Soldering
Recommended Conditions
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3℃/second max.
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (ts)
150℃
200℃
60-180 seconds
TS max to TL
-Ramp-up Rate
3℃/second max.
Time maintained above:
-Temperature (TL)
-Time (tL)
217℃
60-150 seconds
Peak Temperature (TP)
260℃
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Revision:24-Mar-16
20-40 seconds
6℃/second max.
8 minutes max.
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UDT26A05L05
Dimensions (SOT23-6L)
Dimension
Symbol
Millimeters
Inches
Min.
Max.
Min.
Max.
A
2.80
3.00
0.110
0.118
B
2.60
3.00
0.102
0.118
C
0.93
0.97
0.037
0.038
D
0.41
0.016
E
1.50
1.70
0.059
0.067
F
0.11
0.19
0.004
0.007
G
-
0.10
-
0.004
H
0.40
-
0.016
-
J
1.00
1.20
0.393
0.047
Packaging
Tape
Reel
Symbol
Dimension (mm)
W
8.00±0.30
P0
4.00±0.10
P1
4.00±0.10
P2
2.00±0.10
D0
Φ1.55±0.10
D1
Φ1.05±0.05
E
1.75±0.10
F
3.50±0.10
A
3.40±0.10
B
3.20±0.10
K
1.30±0.10
t
0.25±0.05
D
Φ178.0±2.0
D2
Φ13.0
W1
9.5
Quantity: 3000PCS
Revision:24-Mar-16
www.brightking.com
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