KT6-1100SMD1206

PolySwtich Resettalbe Devices SMD1206 Series Surface-Mount Devices Rev Letter: C Rev Date: 2012-4-05 Feature  Resettable overcurrent protection  ROHS compliant  Very small size of 1206  Current rating from 0.12 to 1.50A  Fast time-to-trip  Small footprint  Low resistance Application  Computer  Industrial controls  Multimedia  Battery  Automotive  Game machines  Mobile phones  Portable electronics  Telephony and broadband Part Numbering KT × ×--× × × ×SMD1206 1206 Series Current rating Voltage Typical Electrical Characteristics for SMDI Series at 25℃ Size 3216mm/1206mils Hold Current & Trip Current (Amps) Part number Hold Trip Maximum Maximum Voltage (V) Maximum Current (A) Time-to-Trip Tripped Minimum Resistance (A) (S) (Ohms) One Hour State Post Reflow Power Resistance (Ohms) Dissipation (Watts) KT30-0120SMD1206 0.12 0.29 30 20 1.0 0.20 1.500 6.000 0.60 KT30-0160SMD1206 0.16 0.37 30 20 1.0 0.30 1.200 4.500 0.60 KT16-0200SMD1206 0.20 0.40 16 40 8.0 0.10 0.600 2.500 0.60 KT24-0200SMD1206 0.20 0.40 24 40 8.0 0.10 0.600 2.500 0.60 KT16-0250SMD1206 0.25 0.50 16 40 8.0 0.10 0.550 2.300 0.60 KT15-0350SMD1206 0.35 0.75 30 40 8.0 0.10 0.300 1.200 0.60 KT15-0500SMD1206 0.50 1.00 15 40 8.0 0.10 0.150 0.750 0.60 KT13-0750SMD1206 0.75 1.50 13.2 40 8.0 0.10 0.090 0.400 0.60 KT8-1000SMD1206 1.00 2.00 8 40 8.0 0.20 0.055 0.210 0.80 1 PolySwtich Resettalbe Devices SMD1206 Series Surface-Mount Devices Rev Letter: C Rev Date: 2012-4-05 KT6-1100SMD1206 1.10 2.20 6 40 8.0 0.20 0.040 0.180 0.80 KT8-1100SMD1206 1.10 2.20 8 40 8.0 0.20 0.040 0.180 0.80 KT6-1500SMD1206 1.50 3.00 6 40 8.0 0.30 0.040 0.120 0.80 Thermal Derating For SMD1206 series [Hold Current (A) at Ambient Temperature(℃)] Size 3216mm/1206mils Part number Maximum Ambient Temperature -40℃ -20℃ 0℃ 20℃ 25℃ 40℃ 50℃ 60℃ 70℃ 85℃ KT30-0120SMD1206 0.20 0.17 0.15 0.13 0.12 0.11 0.10 0.09 0.08 0.07 KT30-0160SMD1206 0.21 0.20 0.18 0.17 0.16 0.14 0.13 0.12 0.11 0.09 KT16-0200SMD1206 0.34 0.30 0.26 0.22 0.20 0.17 0.15 0.13 0.11 0.09 KT24-0200SMD1206 0.34 0.30 0.26 0.22 0.20 0.17 0.15 0.13 0.11 0.09 KT16-0250SMD1206 0.37 0.33 0.29 0.27 0.25 0.22 0.20 0.17 0.15 0.12 KT15-0350SMD1206 0.58 0.51 0.44 0.38 0.35 0.31 0.28 0.24 0.21 0.16 KT15-0500SMD1206 0.78 0.69 0.61 0.52 0.50 0.44 0.39 0.35 0.30 0.24 KT13-0750SMD1206 1.15 1.04 0.92 0.78 0.75 0.69 0.63 0.58 0.51 0.43 KT8-1000SMD1206 1.54 1.36 1.20 1.02 1.00 0.90 0.73 0.70 0.55 0.42 KT6-1100SMD1206 1.64 1.46 1.30 1.12 1.10 0.92 0.83 0.80 0.65 0.52 KT8-1100SMD1206 1.64 1.46 1.30 1.12 1.10 0.92 0.83 0.80 0.65 0.52 KT6-1500SMD1206 2.20 1.99 1.77 1.55 1.50 1.34 1.23 1.10 1.01 0.84 Typical Product Dimensions in Millimeters(Inches) Size 3216mm/1206mils A B C D E Figures for Max. Max. Max. Min. Min. Dimension KT30-0120SMD1206 3.45(0.136) 1.80(0.071) 0.90(0.035) 0.25(0.010) 0.076(0.003) 1 KT30-0160SMD1206 3.45(0.136) 1.80(0.071) 0.90(0.035) 0.25(0.010) 0.076(0.003) 1 KT16-0200SMD1206 3.45(0.136) 1.80(0.071) 0.90(0.035) 0.25(0.010) 0.076(0.003) 1 KT24-0200SMD1206 3.45(0.136) 1.80(0.071) 0.90(0.035) 0.25(0.010) 0.076(0.003) 1 KT16-0250SMD1206 3.45(0.136) 1.80(0.071) 0.90(0.035) 0.25(0.010) 0.076(0.003) 1 KT15-0350SMD1206 3.45(0.136) 1.80(0.071) 0.90(0.035) 0.25(0.010) 0.076(0.003) 1 KT15-0500SMD1206 3.45(0.136) 1.80(0.071) 1.00(0.040) 0.25(0.010) 0.076(0.003) 1 KT13-0750SMD1206 3.45(0.136) 1.80(0.071) 1.00(0.040) 0.25(0.010) 0.076(0.003) 1 KT8-1000SMD1206 3.45(0.136) 1.80(0.071) 1.40(0.055) 0.25(0.010) 0.076(0.003) 1 Part number 2 PolySwtich Resettalbe Devices SMD1206 Series Surface-Mount Devices Rev Letter: C Rev Date: 2012-4-05 KT6-1100SMD1206 3.45(0.136) 1.80(0.071) 1.40(0.055) 0.25(0.010) 0.076(0.003) 1 KT8-1100SMD1206 3.45(0.136) 1.80(0.071) 1.40(0.055) 0.25(0.010) 0.076(0.003) 1 KT6-1500SMD1206 3.45(0.136) 1.80(0.071) 1.80(0.071) 0.25(0.010) 0.076(0.003) 1 Figure 1 Solder Reflow Recommendation Reflow –curve Footprint(mm) * Recommended reflow methods: IR, hot air oven, Nitrogen oven. * Devices can be cleaned using standard industry methods and solvents. Note: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Caution: Operation beyond the rated voltage or current may result in rupture electrical arcing or flame. Environmental Specifications  Recommended storage conditions: 40°C max, 70%  Thermal Shock: R.H. max  Vibration: per MIL-STD-883C  Passive aging: 85°C, 1000 hours  Solder leach resistance and terminal adhesion: Per  Moisture Resistance: 85% RH,85℃,1000hrs -40℃to 85℃,30 min cycle,20 cycles. EIA-576 test Packaging Information 3 PolySwtich Resettalbe Devices SMD1206 Series Surface-Mount Devices Rev Letter: C Rev Date: 2012-4-05 Size 3216mm/1206mils Recommended Pad Layout Figures[mm(In.)] Tape & Reel Tape spc Part number Quantity code Dimension A(Nom.) Dimension B(Nom.) Dimension C(Nom.) KT30-0120SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT30-0160SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT16-0200SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT24-0200SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT16-0250SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT15-0350SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT15-0500SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT13-0750SMD1206 4000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT8-1000SMD1206 3000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT6-1100SMD1206 3000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT8-1100SMD1206 3000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) KT6-1500SMD1206 2000 1206 2.00(0.079) 1.00(0.039) 1.60(0.063) WARNING:  Operation beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.  The devices are intended for protection against occasional overcurrent or overtemperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated.  Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.  Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal and mechanical procedures for electronic components.  Operation in circuit with a large inductance can generate a circuit voltage (L di/dt) above the rated voltage of the PPTC device. 4