TPC817 SERIES
Taiwan Semiconductor
200mW, 4 PIN DIP Phototransistor Photocoupler
FEATURES
KEY PARAMETERS
● Current transfer ratio
(CTR: MIN.80% at IF=5mA, VCE=5V)
● High isolation voltage between input and output
(Viso=5000V rms)
● Creepage distance>7.62mm
● UL Recognized File # E478892
● Compliant to RoHS directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
VALUE
UNIT
CTR
80-600
%
VCEO
80
V
Ptot
200
mW
IC
50
mA
Viso
Package
APPLICATIONS
●
●
●
●
●
PARAMETER
Configuration
5000
Vrms
DIP-4
DIP-4M
SOP-4
Single Dice
Programmable controllers
System appliances, measuring instruments
Telecommunication equipments
Home appliances,such as fan heaters,etc
Signal transmission between circuits of different potentials
and impedances
MECHANICAL DATA
● Case: DIP-4 , DIP-4M , SOP-4
● Molding compound: UL flammability classification
rating 94V-0
● Moisture sensitivity level: level 1, per J-STD-020
● Packing code with suffix "G" means green compound
(halogen-free)
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 1A whisker test
● Polarity: Indicated by cathode band
1
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
Input
PART NUMBER
50
UNIT
Forward current
SYMBOL
IF
Reverse voltage
VR
6
V
Power dissipation
mA
P
70
mW
Collector-emitter voltage
VCEO
80
V
Emitter-collector voltage
VECO
6
V
Collector current
IC
50
mA
Collector power dissipation
PC
150
mW
Total power dissipation
Ptot
200
mW
Isolation voltage
Viso
5000
Vrms
Rated impulse isolation voltage
VIOTM
6000
V
Rated repetitive peak isolation voltage
Output
VIORM
630
V
Operating temperature
Topr
-40 to +100
°C
Storage temperature
Tstg
-55 to +125
°C
Soldering temperature
Tsol
260
°C
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
Input
CONDITIONS
Forward voltage
IF=20mA
VF
Reverse current
VR=4V
IR
Terminal capacitance
V=0, f=1kHz
Ct
Collector dark current
Collector-emitter
Output
breakdown voltage
Emitter-collector
breakdown voltage
Current transfer
saturation voltage
Isolation resistance
Characteristics
Floating capacitance
Cut-off frequency
TYP
MAX
UNIT
1.2
1.4
V
10
μA
250
pF
30
-7
ICEO
IC=0.1mA, IF=0
BVCEO
80
V
IE=10μA, IF=0
BVECO
6
V
IC
2.5
30
mA
CTR
80
600
%
0.2
V
IF=5mA, VCE=5V
ration(Note 1)
Collector-emitter
MIN
VCE=20V,IF=0
Collector current
Transfer
SYMBOL
IF=20mA, IC=1mA
DC500V,
40 to 60%RH
V=0, f=1MHz
VCE=5V, IC=2mA,
RL=100Ω, -3dB
10
0.1
VCE(sat)
RISO
10
5x10
11
Ω
10
Cf
0.6
fc
80
A
1.0
pF
KHz
Response
Rise time
VCE=2V, IC=2mA,
tr
4
18
μs
time
Fall time
RL=100Ω
tf
3
18
μs
Notes:
1. Classification table of current transfer ratio is shown below
2
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
RANK TABLE OF CURRENT TRANSFER RATIO, CTR
RANK MARK
MIN (%)
MAX (%)
A
80
160
B
130
260
C
200
400
D
300
600
ORDERING INFORMATION
PART NO.
(Note 1&2)
PACKING
PACKING CODE
CODE
SUFFIX
TPC817x
C9
TPC817Mx
C9
TPC817S1x
RA
PACKAGE
PACKING
DIP-4
100 / TUBE
DIP-4M
G
(Leads with 0.4" spacing)
SOP-4
100 / TUBE
2K / 13" Reel
Notes:
1. “x” defines CTR rank from “A” to “D”
2. Whole series with green compound
EXAMPLE
EXAMPLE P/N
PART NO.
PACKING CODE
TPC817A C9G
TPC817A
C9
PACKING CODE
SUFFIX
G
3
DESCRIPTION
Green compound
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig. 1 Forward Current vs.
Fig.2 Collector Power Dissipation vs.
Ambient Temperature
Ambient Temperature
200
Collector Power Dissipation, Pc (mW)
IF, Instantaneous Forward Current (mA)
60
50
40
30
20
10
150
100
50
0
0
-30 -15
0
15
30
45
60
75
-30 -15
90 105 120 135
0
30
45
60
75
90 105 120 135
Ambient Temperature, Ta (°C)
Ambient Temperature, Ta (°C)
Fig.3 Collector-Emitter Saturation Voltage vs
Fig.4 Forward Current vs.
Forward Current
Forward Voltage
6
1000
5
75°C
4
Forward Current IF(mA)
Collector-Emitter Saturation Voltage VCE(sat)
15
7mA
5mA
3
3mA
2
1mA
1
100
50°C
25°C
0°C
10
-25°C
IC=0.5mA
1
0
0
5
10
0
15
0.5
1
1.5
2
2.5
3
Forward Voltage VF (V)
Forward Current IF(mA)
4
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig. 5 Current Transfer Ratio vs.
Fig.6 Collector Current vs.
Forward Current
Collector-Emitter Voltage
200
30
IF=30mA
160
Collector Current Ic(mA)
Current Transfer Ratio (%)
180
140
120
100
80
60
40
VCE=5V
Pc(max)
20mA
20
10
10mA
20
5mA
0
0
1
10
Forward Current IF(mA)
0
100
2
3
4
5
6
7
8
9
Collector-Emitter Voltage VCE(V)
Fig.7 Relative Current Transfer Ratio vs.
Fig.8 Collector-emitter Saturation Voltage vs
Ambient Temperature
Ambient Temperature
0.16
150
0.14
IF=5mA
VCE=5V
Collector-Emitter Saturation
Voltage VCE(sat) (A)
Relative Current Transfer Ratio (%)
1
100
50
IF=20mA
IC=1mA
0.12
0.1
0.08
0.06
0.04
0.02
0
0
-30
0
30
60
90
120
-30
0
30
60
90
120
Ambient Temperature Ta(°C)
Ambient Temperature Ta(°C)
5
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig. 9 Collector Dark Current vs.
Fig.10 Response Time vs.
Ambient Temperature
Load Resistance
1000
VCE=20V
1.E-06
Response Time (μs)
Collector Dark Current ICEO(A)
1.E-05
1.E-07
1.E-08
IC=2mA
VCE=2V
100
tf
tr
10
td
1
1.E-09
ts
0.1
1.E-10
-30
0
30
60
0.01
90
Ambient Temperature Ta(°C)
0.1
1
10
100
Load Resistance RL(kΩ)
Voltage Gain Av(dB)
Fig.11 Frequency Response
4
2
0
-2
-4
-6
-8
-10
-12
-14
-16
-18
-20
-22
-24
IC=2mA
VCE=5V
100Ω
1kΩ
RL=10kΩ
0.1
1
10
100
1000
Frequency f(kHz)
6
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
TEST CIRCUIT RESPONSE TIME
TEST CIRCUIT FOR FREQUENCY RESPONSE
7
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSION
DIP-4
DIM.
Min
Max
A
6.40
6.60
B
4.50
4.70
C
7.90
8.30
D
3.28
3.68
E
2∘
8∘
F
2.70
2.90
J
0.23
0.26
K
8.86
9.31
L
N
DIM.
0.50 typ.
2.44
2.64
0.40 typ.
Unit(mm)
Min
Max
A
6.40
6.60
B
4.50
4.70
C
7.90
8.30
D
3.28
3.68
F
1.25 typ.
G
0.40 typ.
J
0.23
0.26
K
9.86
10.46
L
8
1.25 typ.
H
M
DIP-4M (Leads with 0.4" spacing)
Unit(mm)
0.50 typ.
M
2.44
2.64
N
2.40
2.90
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSION
SOP-4
DIM.
Unit(mm)
Min
Max
A
6.40
6.60
B
4.50
4.70
C
7.90
8.30
D
3.28
3.68
F
G
1.25 typ.
0.40 typ.
H
0.00
0.20
J
0.90
1.20
K
9.80
10.30
L
M
1.25 typ.
2.49
2.69
MARKING
Notes:
817: Product type
B: CTR rank mark
YWW: Date code
9
Version:C1612
TPC817 SERIES
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
10
Version:C1612
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