MYD-C3358-256N256D-100-I

MYD-C335X-GW Development Board ➢ ➢ ➢ ➢ ➢ ➢ ➢ ➢ MYC-C335X-GW CPU Module as Controller Board Up to 1GHz TI AM335x ARM Cortex-A8 Processors (800MHz AM3354 by Default) 256MB/512MB DDR3L, 256MB Nand Flash/4GB eMMC, 256Kbit EEPROM RS232, RS485, USB Host, Micro SD Card Slot, LVDS and LCD Interfaces 2 x Gigabit Ethernet (or 1 x Gigabit Ethernet and 1 x SFP), WiFi/Bluetooth Module Mini-PCIe Slot for Optional USB based 4G LTE Module Ready to Run Linux 4.14.67 Supports -40 to +85 Celsius Extended Temperature Operation for Industrial Applications Figure 1-1 MYD-C335X-GW Development Board The MYD-C335X-GW Development Board consists of a high-performance CPU Module MYC-C335X-GW and a base board designed especially for gateway applications. It’s a complete development platform for both evaluation and application development purposes based on TI AM335x ARM Cortex-A8 processors. As a controller board of the MYD-C335X-GW, the MYC-C335X-GW CPU Module integrates an up to 1GHz AM335x processor (15x15mm ZCZ package, 800MHz AM3354 by default), 256MB/512MB DDR3L, 4GB eMMC Flash/256MB Nand Flash, 256Kbit EEPROM and PMIC. It is mounted on the top of the base board via two 0.8mm pitch 80-pin Board-to-Board expansion connectors. The base board provides a good showcase of the CPU Module’s connectivity features and performance, rich peripherals are routed out including RS232, RS485, USB 2.0 Host, 2 x Ethernet (or 1 x Ethernet and 1 x SFP interface), Micro SD card, WiFi/Bluetooth module, LVDS, LCD and JTAG as well as one Mini PCIe interface for USB based 4G LTE module. The MYD-C335X-GW is ready to run Linux. MYIR provides rich software resources to help accelerate users’ designs. The board is delivered with necessary cable accessories. Optional Camera Module and LCD modules are also available for the board. 1 / 9 Figure 1-2 MYC-C335X-GW CPU Module Figure 1-3 MYD-C335X-GW Development Board 2 / 9 Hardware Specification The TI AM335x microprocessors, based on the ARM Cortex-A8, operating at up to 1GHz, are enhanced with image, graphics processing, peripherals and industrial interface options such as EtherCAT and PROFIBUS. The device supports the following high-level operating systems (HLOSs) that are available free of charge from TI: • Linux®, Android™ The AM335x microprocessor contains these subsystems: • Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor. • POWERVR SGX™ Graphics Accelerator subsystem for 3D graphics acceleration to support display and gaming effects. • The Programmable Real-Time Unit and Industrial Communication Subsystem (PRU-ICSS) is separate from the ARM core, allowing independent operation and clocking for greater efficiency and flexibility. The PRU-ICSS enables additional peripheral interfaces and real-time protocols such as EtherCAT, PROFINET, EtherNet/IP, PROFIBUS, Ethernet Powerlink, Sercos, and others. AM335x ARM Cortex™-A8 Processors Core Feature AM3352 AM3354 AM3356 Package CPU Speed (MHz) AM3357 AM3358 AM3359 600, 800,1000 800 15x15mm, 0.8mm (ZCZ) 300, 600, 600, 800,1000 300, 600,800 300, 600,800 800, 1000 Core Internal Memory 64KB SRAM shared w/ Data 32KB Cache, Programmable 32KB Cache On-chip L2 (KB) 256 External Memory DDR2/DDR3/DDR3L/mDDR (LPDDR), 2x16-bit, NAND ECC Interface Graphics - OS Support 3D Graphics 3D Graphics Linux, Android, RTOS, Windows Embedded, no-OS Other Hardware Acceleration - Crypto Crypto Accelerator Accelerator 2 PRU-ICSS 2 PRU-ICSS 2 PRU-ICSS 2 PRU-ICSS Crypto Crypto Crypto Crypto Accelerator Accelerator + EtherCAT slave support slave support 2 port switch USB 2.0 OTG + PHY 2 6 UART, 2 SPI, 3 I2C, 2 McASP, 2 CAN, 8 Timers System EDMA, WDT, RTC, 3 eQEP, 3 eCAP, JTAG, ADC (8ch) Parallel 3 MMC/SD/SDIO, GPIO Table 1-1 AM335x Devices Key Features 3 / 9 Accelerator + EtherCAT 10/100/1000 EMAC Serial Ports Accelerator Mechanical Parameters • Dimensions: 112.57mm x 132mm (base board), 50mm x 40mm (CPU Module) • PCB Layers: 4-layer design (base board), 8-layer design (CPU Module) • Supply voltage: 4.75-5.25V (CPU Module) • Working temperature: -40~85 Celsius (industrial grade) The MYD-C335X-GW Controller Board (MYC-C335X-GW CPU Module) Figure 1-4 MYC-C335X-GW CPU Module Top-view Figure 1-5 MYC-C335X-GW CPU Module Bottom-view Processor • TI AM3352, AM3354, AM3356, AM3357, AM3358, AM3359 (pin-to-pin compatible, 15x15 mm, 0.8-mm ball pitch, ZCZ package) - Up to 1GHz ARM Cortex-A8 32-bit RISC MPU - NEON™ SIMD Coprocessor - 32KB/32KB of L1 Instruction/Data Cache with Single-Error Detection (parity) - 256KB of L2 Cache with Error Correcting Code (ECC) - SGX530 Graphics Engine - Programmable Real-Time Unit Subsystem Memory • 256/512MB DDR3L (supports up to 1GB) • 256MB Nand Flash (supports optional 512MB/1GB) • 4GB eMMC (alternative design with Nand Flash) • 256Kbit EEPROM Peripherals and Signals Routed to Pins • Power Management IC (TPS65217C) Two 0.8mm pitch 80-pin Board-to-Board Expansion Connectors - 2 x RGMII - 2 x USB2.0 Host or 2 x USB2.0 Device - 6 x UART - 3 x I2C - 2 x CAN - 2 x SPI 4 / 9 - 7 x ADC - 1 x SAI - 1 x RGB (supports RGB888 at up to 2048 x 2048 pixels resolution) - 2 x SDIO - 1 x JTAG - 97 x GPIOs Note: the peripheral signals brought out to the expansion interface are listed in maximum number. Some signals maybe reused. Please refer to the processor datasheet and pin-out description file. The MYD-C335X-GW Development Board Base Board • Serial ports - Debug serial port (TTL) - 1 x RS485 serial port (with isolation) - 1 x 3-wire RS232 serial port (with isolation) • 1 x USB2.0 Host ports • 1 x Mini-PCIe interface (for USB based 4G LTE Module) • 2 x Gigabit Ethernet interfaces or 1 x Gigabit Ethernet interface and 1 x SFP interface • WiFi/Bluetooth Module (complies with IEEE 802.11 b/g/n and supports Bluetooth V4.1+HS) • 1 x RGB LCD interface (J14) • 1 x LVDS LCD interface (J15, 40-pin FPC connector) • Battery backed RTC (on the back of the board) • 1 x JTAG interface (2.54mm pitch 2*7-pin header) • 1 x ADC interface • 1 x TF card slot • 1 x SIM card slot • 2 x external antenna connector (one for WiFi module and one for 4G LTE module) • 1 x 2.54mm 2*10-pin male expansion header (J22) Figure 1-6 MYD-C335X-G Development Board Function Block Diagram 5 / 9 Figure 1-7 MYC-C335X-GW Dimensions Chart Figure 1-8 MYD-C335X-G Dimensions Chart 6 / 9 Software Features The MYD-C335X-GW is provided with software package. The software features are summarized as below: Item Features Description Source Code Bootstrap program U-boot The primary bootstrap YES Linux kernel Linux 4.14.67 Customized kernel for MYD-C335X-GW YES LCD LCD driver (source code, supports 4.3- / 7-inch LCD) YES Touch Resistive and Capacitive touch screen driver YES USB Host USB Host driver YES I2C I2C Bus driver YES SPI SPI Bus driver YES ADC ADC driver YES Ethernet 10/100/1000M Ethernet driver YES MMC/SD MMC/SD card driver YES eMMC eMMC driver YES NAND NAND Flash driver YES RTC Internal RTC driver YES RX-8025T External RTC driver YES UART UART driver YES RS485 RS485 drive YES RS232 RS232 drive YES 4G LTE Module Supports Quectel’s EC20 using USB driver YES WiFi & BT AP6212 driver YES GPS GPS driver YES Fiber SFP driver YES GPIO-LED GPIO-LED driver YES PMU PMU driver YES rootfs customized file system based on buildroot Rootfs-qt Customized MEasy IoT file system Based on buildroot UBI NAND Flash ubi file system Ramdisk.gz SD card Ramdisk file system sdcard.img SD card ext4 file system QT QT environment validation demo YES GPIO-LED GPIO-LED example YES NET TCP/IP Socket C/S example YES RTC RTC example YES RS232/RS485 RS232/RS485 example YES LCD LCD example YES NAND Flash NAND Flash example YES Compiler Tool Chain Cross compiler gcc version 7.4.0 \ (Buildroot 2019.02.2-gb4331a8dirty\) BINARY Cross Compiler Tool Chain Cross compiler gcc version 7.2.1 20171127 \ (Linaro GCC 7.22017.11\) BINARY Drivers File System Application Programs Table 1-2 Software Features of MYD-C335X-GW 7 / 9 Image The MYD-C335X-GW runs Linux OS and is provided with software packages. Based on Linux 4.14.67 kernel, MYIR has provided abundant software resources including kernel and driver source code as well as MYIR’ s MEasy IOT Demo to allow customer to get a good experience and development reference. Figure 1-9 MEasy-IOT System Structure 8 / 9 Order Information Product Item MYD-C335X-GW Development Board Part No. MYD-C3354-4E512D-80-I-GW MYD-C3354-256N256D-80-I-GW MYC-C3354-4E512D-80-I-GW MYC-C335X-GW CPU Module Packing List ➢ ➢ ➢ ➢ ➢ ➢ One MYD-C335X-GW Board One 12V/1.5A Power adapter One WiFi/Bluetooth Antenna One 4G LTE Antenna One Quick Start Guide One Product Disk MYC-C3354-256N256D-80-I-GW MY-CAM002U USB Camera Module MY-CAM002U MY-LCD43TP 4.3-inch LCD Module with Resistive Touch screen MY-TFT043RV2 MY-LCD70TP 7-inch LCD Module with Resistive Touch screen MY-TFT070RV2 MY-LCD70TP-C 7-inch LCD Module with capacitive touch screen MY-TFT070CV2 Add-on Options ➢ MYC-C335X-GW CPU Module ➢ MY-LCD43TP 4.3-inch LCD Module ➢ MY-LCD70TP 7-inch LCD Module ➢ MY-LCD70TP-C 7-inch LCD Module ➢ MY-CAM002U Camera Module Note: 1. Please note the WiFi/BT on MYD-C335X-GW Development Board can only support -30 to 85 Celsius Working temperature. 2. We accept custom design based on the MYD-C335X-GW, whether reducing, adding or modifying the existing hardware according to customer’s requirement. MYIR Tech Limited Room 04, 6th Floor, Building No.2, Fada Road, Yunli Smart Park, Bantian, Longgang District, Shenzhen, Guangdong, China 518129 E-mail: sales@myirtech.com Phone: +86-755-22984836 Fax: +86-755-25532724 Website: http://www.myirtech.com 9 / 9