CMBZ0603-601T04

深圳市华锐达电子有限公司 产 品 承 认 书 SPECIFICATION FOR APPROVAL 编号：202068Mon162522 户： 锐 达 客 日 期: CMBZ0603-601T04 DA 号： 2020/06/08 客户承认栏 DRAWN CHECKED APPROVED APPROVED FOR CUSTOMER (制图) (检查) (确认) 许丽琳 甘元培 胡林立 CO IL RI 料 华 客户料号： 确认无误后敬请签回（Please Return After Approved） 地 址：中国广东省深圳市宝安区石岩水田金凯进工业区B栋2楼 电 话：86 0755 29485625 公司主页：http://www.coil-rida.com 传 真：86 0755 29485623 邮 箱：coilrida@coil-rida.com.cn 深圳市华锐达电子有限公司 SPECIFICATION FOR APPROVAL CUSTOME（客户）： PAGE：2 FO 9 ITEM：CMBZ0603-601T04 Customer’s ITEM： 变更次数 变更项目 变更前内容 变更后内容 变更日期 1 2 CO IL RI DA 华 锐 达 3 CUSTOMER APPROVED(客户确认栏) APPROVED(确认) CHECKED（检查） DRAWN（制图） 胡林立 甘元培 许丽琳 华锐达样品承认书 SPECIFICATION FOR APPROVAL CUSTOMER（客户）： PAGE： ITEM：CMBZ0603-601T04 Customer’s ITEM： A(mm) B(mm) C(mm) 1.6±0.15 0.8±0.15 0.8±0.15 2、ELECTRICAL CHRACTERISTICS（电特性要求）： Specifications （规格值） 600Ω±25% 600Ω Test Freq. 100MHz 60mV DCR 0.5 oHM MAX IDC 400mA Ope.Temp. -40℃ TO 125℃ 0.3±0.2 Testequipments (测试仪器) HP4291B LCR METER DA L Typ. （参考值） D(mm) 华 ITEM (项目） 锐 达 1. EXTERNAL DIMENSIONS(外观尺寸): RI 0.38 oHM HP4291B LCR METER CH502A LCR METER HP42841A HC-D3M TEMP.&HUMIDITY CHAMBER 英寸制 毫米制 100505 1206 321611 160808 1206A 321613 0805 201209 1210 322013 0805T 201212 1812 453215 1008 252012 1812A 451616 1008A 252010 2220 575018 0402 0603 毫米制 CO 英寸制 IL 3、Product size specification reference table(产品尺寸规格对照表) CUSTOMER APPROVED(客户确认栏) APPROVED(确认) 胡林立 ISSUED DATE（出版日期）：2020/06/08 CHECKED（检查） 甘元培 DRAWN（制图） 许丽琳 版次：1.0 4. Reliability and Test Condition Item Performance Test Condition Series No. HLLB Operating -40~+125℃ (Including self-temperature rise) -40~+105℃ (Including self-temperature rise) -40~+125℃ (on board) -40~+105℃ (on board) Temperature Transportation Storage Temperature --- For long storage conditions, please see the Application Notice Impedance (Z) Agilent4291 Inductance (Ls) Agilent E4991 Agilent4287 Q Factor Agilent16192 Refer to standard electrical characteristics list DC Resistance Agilent 4338 DC Power Supply Over Rated Current requirements, there will be some risk Rated Current Soldering Heat to Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value More than 95% of the terminal electrode should be covered with 150¢X C solder. 60 second 4∮1 second IL Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value CO Terminal strength Preheating Dipping Natural cooling 245¢X C RI Solderability Bending Vibration Test Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder temperature: 260±5℃ Flux for lead free: Rosin. 9.5% Temperature ramp/immersion and immersion rate: 25±6 mm/s Dip time: 10±1sec. Depth: completely cover the termination. 锐 达 Resistance 华 Test 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rise Rated Current < 1A ΔT 20℃Max Rated Current ≧ 1A ΔT 40℃Max DA Temperature Preheating Dipping Natural cooling 260¢X C 150¢X C 60 second 10∮1.0 second Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder temperature: 245±5℃ Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a force (>0805:1kg =0805:40x100x1.2mm =0805:1.2mm 1GΩ **Derating Curve 5-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) FHI FCH HCI 0.15± 0.80 0.30 0.30 0.50± 0.25± 1.50 0.40 0.55 1608 1.6±0.15 0.80±0.15 0.80± 0.30± 2.60 0.60 0.80 2.0±0.20 1.25±0.20 0.85± 0.50± 2.0±0.20 1.25±0.20 1.25± 0.50± 3.00 1.00 1.00 3216 3.2±0.20 1.60±0.20 1.10± 0.50± 4.40 2.20 1.40 3225 3.2±0.20 2.50±0.20 1.30± 0.50± 4.40 2.20 3.40 4516 4.5±0.20 1.60±0.20 1.60± 0.50± 5.70 2.70 1.40 4532 4.5±0.20 3.20±0.20 1.50± 0.50± 5.90 2.57 4.22 2012 Land Solder Resist 2.8 0.8 0.30± 1.0±0.10 0.50±0.10 FCA3216 2.2-2.6 FCI 0.6±0.03 0.30±0.03 1005 0.8 Pitch 0.4 L PC board should be designed so that products can prevent damage from mechanical stress when warping the board. H GHB 0603 CO HLLB Type IL Chip Size Series RI 5.Soldering and Mounting DA 华 For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85 ℃ , the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 锐 达 Thermal shock G P5. 5-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 5-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) 5-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. 锐 达 ‧Preheat circuit and products to 150℃ ‧350℃ tip temperature (max) R e flo w S o ld e rin g Iro n S o ld e rin g NATURAL C O O L IN G S O L D E R IN G P R E -H E A T IN G TEMPERATURE(¢X C) TEMPERATURE(¢X C) tp (2 4 5 ¢X C / 2 0 ~ 4 0 s .) 217 200 150 S O L D E R IN G w ith in 4 ~ 5 s T P (2 6 0 ℃ / 1 0 s m a x .) 60~150s 60~180s NATURAL C O O L IN G 350 150 G ra d u a l c o o lin g O ver 60s 480s m ax. T IM E (s e c .) 25 华 P R E -H E A T IN G T IM E ( s e c .) Iron Soldering times：1 times max Hand Soldering RI DA Reflow times: 3 times max 5-2.3 Solder Volume U p p e r lim it R e co m m e n d a b le t CO IL Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height 6.Packaging Information 6-1. Reel Dimension A Type 0.5 R1 C B D 13 .5 ∮0 .5 2∮0.5 R1 .9 R0.5 A(mm) B(mm) C(mm) D(mm) 7”x8mm 9.0±0.5 60±2 13.5±0.5 178±2 7”x12mm 13.5±0.5 60±2 13.5±0.5 178±2 120¢X 7"x8mm 7"x12mm 6-2.1 Tape Dimension / 8mm ■Material of taping is paper 5+ 0 .1 -0 .0 t Size F:3.5∮0.05 P A0 W:8.0∮0.3 1. D: B0 E:1.75∮0.1 P 0 :4 ∮0 .1 Ko P(mm) t(mm) 060303 Bo(mm) Ao(mm) Ko(mm) 0.68± 0.38± 0.50max 2.0±0.05 0.50max 100505 1.12± 0.62± 0.60± 2.0±0.05 0.60± P6. ■Material of taping is plastic P 2 :2∮0.05 Po:4∮0.1 1. 5+ 0. 1 F:3.5∮0.05 D1 A :1 P Size t A Bo W:8.0∮0.1 E:1.75∮0.1 D: ∮0 Ko .1 Ao P(mm) t(mm) D1(mm) 201212 Bo(mm) Ao(mm) Ko(mm) 2.10± 1.28± 1.28± 4.0±0.10 0.22± 1.0±0.10 321611 3.35± 1.75± 1.25± 4.0±0.10 0.23± 1.0±0.10 322513 3.42± 2.77± 1.55± 4.0±0.10 0.22± 1.0±0.10 321609 3.40± 1.77± 1.04± 4.0±0.10 0.22± 1.0±0.10 SECTION A-A 6-2.2 Tape Dimension / 12mm P 2 :2 .0 ∮ 0 .0 5 Size t D 1 :1 .5 ∮ 0 .1 Bo W:12.0∮0.1 5.5∮0.05 D :1 .5 + 0 .1 Bo(mm) Ao(mm) Ko(mm) P(mm) 4.70±0.10 1.75± 1.75±0.10 4.0±0.1 0.24±0.05 1.5±0.1 453215 4.70±0.10 3.45± 1.60±0.10 8.0±0.1 0.24±0.05 1.5±0.1 Ao 6-3. Packaging Quantity 451616 322513 321611 321609 201212 1000 1000 2000 4000 4000 4000 Inner box 5000 5000 14000 28000 28000 28000 Carton 20000 20000 56000 112000 112000 112000 201209 100505 060303 4000 160808 4000 10000 15000 28000 28000 70000 105000 112000 112000 280000 420000 华 453215 Chip / Reel DA Chip Size RI 6-4. Tearing Off Force F The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165¢Xto180¢X Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 CO IL Top cover tape D1(mm) 451616 Ko P t(mm) 锐 达 1.75∮0.1 P o :4 ∮ 0 .1 Application Notice ‧Storage Conditions(component level) To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized.