PMF370XN
N-channel TrenchMOS extremely low level FET
5 July 2019
Product data sheet
1. General description
Extremely low level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic
package using TrenchMOS technology. This product is designed and qualified for use in
computing, communications, consumer and industrial applications only.
2. Features and benefits
•
•
•
•
•
Low conduction losses due to low on-state resistance
Low threshold voltage
Saves PCB space due to small footprint (40 % smaller than SOT23)
Suitable for low gate drive sources
Surface-mounted package
3. Applications
•
•
Driver circuits
Switching in portable appliances
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 150 °C
-
-
30
V
ID
drain current
VGS = 4.5 V; Tsp = 25 °C
-
-
0.87
A
Ptot
total power dissipation
Tsp = 25 °C
-
-
0.56
W
VGS = 4.5 V; ID = 0.2 A; Tj = 25 °C
-
370
440
mΩ
Static characteristics
RDSon
drain-source on-state
resistance
PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
G
gate
2
S
source
3
D
drain
Simplified outline
Graphic symbol
3
D
G
mbb076
1
S
2
SC-70 (SOT323)
6. Ordering information
Table 3. Ordering information
Type number
Package
PMF370XN
Name
Description
Version
SC-70
plastic surface-mounted package; 3 leads
SOT323
7. Marking
Table 4. Marking codes
Type number
Marking code[1]
PMF370XN
F6%
[1]
% = placeholder for manufacturing site code
PMF370XN
Product data sheet
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134)
Symbol
Parameter
Conditions
Min
Max
Unit
VDS
drain-source voltage
25 °C ≤ Tj ≤ 150 °C
-
30
V
VDGR
drain-gate voltage
25 °C ≤ Tj ≤ 150 °C; RGS = 20 kΩ
-
30
V
VGS
gate-source voltage
ID
drain current
-12
12
V
VGS = 4.5 V; Tsp = 25 °C
-
0.87
A
VGS = 4.5 V; Tsp = 100 °C
-
0.55
A
IDM
peak drain current
Tsp = 25 °C; pulsed; tp ≤ 10 µs
-
1.74
A
Ptot
total power dissipation
Tsp = 25 °C
-
0.56
W
Tj
junction temperature
-55
150
°C
Tstg
storage temperature
-55
150
°C
IS
source current
Tsp = 25 °C
-
0.47
A
ISM
peak source current
pulsed; tp ≤ 10 µs; Tsp = 25 °C
-
0.94
A
03aa25
120
Ider
(%)
Pder
(%)
80
80
40
40
0
Fig. 1.
03aa17
120
0
50
100
150
Tsp (°C)
Normalized continuous drain current as a
function of solder point temperature
PMF370XN
Product data sheet
0
200
Fig. 2.
0
100
150
Tsp (°C)
200
Normalized total power dissipation as a
function of solder point temperature
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
03an15
10
ID
(A)
Limit RDSon = VDS / ID
tp = 10 µ s
1
100 µ s
1 ms
10-1
DC
10 ms
100 ms
10-2
10-1
Fig. 3.
1
10
102
V DS (V)
Safe operating area; continuous and peak drain currents as a function of drain-source voltage
PMF370XN
Product data sheet
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Rth(j-sp)
Conditions
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
-
-
220
K/W
03an27
103
Zth(j-sp)
(K/W)
δ = 0.5
102
0.2
10
0.1
0.05
0.02
P
single pulse
δ=
tp
1
10-4
Fig. 4.
10-3
10-2
10-1
1
tp
T
t
T
tp (s)
10
Transient thermal impedance from junction to solder point as a function of pulse duration
PMF370XN
Product data sheet
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
drain-source
breakdown voltage
ID = 250 µA; VGS = 0 V; Tj = -55 °C
27
-
-
V
ID = 250 µA; VGS = 0 V; Tj = 25 °C
30
-
-
V
gate-source threshold
voltage
ID = 250 µA; VDS = VGS; Tj = -55 °C
-
-
1.8
V
ID = 250 µA; VDS = VGS; Tj = 150 °C
0.35
-
-
V
ID = 250 µA; VDS = VGS; Tj = 25 °C
0.5
1
1.5
V
VDS = 30 V; VGS = 0 V; Tj = 25 °C
-
-
1
µA
VDS = 30 V; VGS = 0 V; Tj = 70 °C
-
-
2
µA
VDS = 30 V; VGS = 0 V; Tj = 150 °C
-
-
10
µA
VGS = 12 V; VDS = 0 V; Tj = 25 °C
-
10
100
nA
VGS = -12 V; VDS = 0 V; Tj = 25 °C
-
10
100
nA
VGS = 2.5 V; ID = 0.1 A; Tj = 25 °C
-
550
650
mΩ
VGS = 4.5 V; ID = 0.2 A; Tj = 150 °C
-
629
748
mΩ
VGS = 4.5 V; ID = 0.2 A; Tj = 25 °C
-
370
440
mΩ
VDS = 15 V; ID = 1 A; VGS = 4.5 V;
Tj = 25 °C
-
0.65
-
nC
-
0.14
-
nC
-
0.18
-
nC
-
37
-
pF
-
8.5
-
pF
-
5.5
-
pF
-
6.5
-
ns
-
9.5
-
ns
Static characteristics
V(BR)DSS
VGSth
IDSS
IGSS
RDSon
drain leakage current
gate leakage current
drain-source on-state
resistance
Dynamic characteristics
QG(tot)
total gate charge
QGS
gate-source charge
QGD
gate-drain charge
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer
capacitance
td(on)
turn-on delay time
tr
rise time
td(off)
turn-off delay time
-
14
-
ns
tf
fall time
-
5.5
-
ns
-
0.81
1.2
V
VDS = 25 V; f = 1 MHz; VGS = 0 V;
Tj = 25 °C
VDS = 15 V; RL = 15 Ω; VGS = 4.5 V;
RG(ext) = 6 Ω; Tj = 25 °C
Source-drain diode
VSD
source-drain voltage
PMF370XN
Product data sheet
IS = 0.3 A; VGS = 0 V; Tj = 25 °C
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
03ao00
2.5
ID
(A)
ID
(A)
2
3
1
2.5
1
0.5
2
0.5
0
0.5
1
1.5
VDS (V)
0
2
0
1
2
3
4
VGS (V)
5
Tj = 25 °C
Tj = 25 °C and 150 °C; VDS > ID × RDSon
Fig. 6.
Output characteristics: drain current as a
function of drain-source voltage; typical values
Transfer characteristics: drain current as a
function of gate-source voltage; typical values
03al82
2
03an65
10- 3
VGS (th)
(V)
ID
(A)
1.5
max
1
10- 4
typ
min
10- 5
0
- 60
0
60
120
Tj (°C)
10- 6
180
Gate-source threshold voltage as a function of
junction temperature
PMF370XN
Product data sheet
typ
max
min
0.5
Fig. 7.
Tj = 150 °C
1.5
1.8
Fig. 5.
25 °C
2
1.5
0
03ao02
2.5
3.5
VGS (V) = 4.5
Fig. 8.
0
0.8
1.2
VGS (V)
1.6
Subthreshold drain current as a function of
gate-source voltage
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
03ao01
1
VGS (V) = 2.5
RDSon
(Ω)
03al00
1.8
3
a
0.8
3.5
1.2
0.6
4.5
0.4
0.6
0.2
0
Fig. 9.
0
0.5
1
1.5
2
ID (A)
0
- 60
2.5
Drain-source on-state resistance as a function
of drain current; typical values
0
60
120
03ao05
VGS
(V)
ID
180
Fig. 10. Normalized drain-source on-state resistance
factor as a function of junction temperature
5
VDS
Tj (°C)
ID = 1 A
Tj = 25 °C
4
VGS(pl)
VDS = 15 V
3
VGS(th)
VGS
2
QGS2
QGS1
QGS
QGD
QG(tot)
1
003aaa508
Fig. 11. Gate charge waveform definitions
0
0
0.2
0.4
0.6
QG (nC)
0.8
Fig. 12. Gate-source voltage as a function of gate
charge; typical values
PMF370XN
Product data sheet
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
03ao04
102
03ao03
1
VGS = 0 V
IS
(A)
0.8
Ciss
C
(pF)
0.6
10
Coss
0.4
Crss
0.2
1
10- 1
1
10
VDS (V)
0
102
150 °C
0
0.2
0.4
Tj = 25 °C
0.6
0.8
1
VSD (V)
Tj = 25 °C and 150 °C; VGS = 0 V
VGS = 0 V; 1 MHz
Fig. 13. Input, output and reverse transfer capacitances Fig. 14. Source current as a function of source-drain
voltage; typical values
as a function of drain-source voltage; typical
values
PMF370XN
Product data sheet
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
11. Package outline
Plastic surface-mounted package; 3 leads
SOT323
D
B
E
A
X
HE
y
v M A
3
Q
A
A1
1
c
2
e1
bp
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
mm
1.1
0.8
0.1
0.4
0.3
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT323
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
SC-70
Fig. 15. Package outline SC-70 (SOT323)
PMF370XN
Product data sheet
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
12. Soldering
2.65
1.85
1.325
solder lands
solder resist
2
2.35
0.6
(3×)
3
solder paste
1.3
occupied area
0.5
(3×)
1
Dimensions in mm
0.55
(3×)
sot323_fr
Fig. 16. Reflow soldering footprint for SC-70 (SOT323)
4.6
2.575
1.425
(3×)
solder lands
solder resist
occupied area
1.8
3.65 2.1
09
(2×)
Dimensions in mm
preferred transport
direction during soldering
sot323_fw
Fig. 17. Wave soldering footprint for SC-70 (SOT323)
PMF370XN
Product data sheet
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
13. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PMF370XN v.4
20190705
Product data sheet
-
PMF370XN v.3
Modifications:
•
•
•
PMF370XN v.3
20080620
Product data sheet
-
PMF370XN v.2
PMF370XN v.2
20051206
Product data sheet
-
PMF370XN v.1
PMF370XN v.1
20040211
Product data sheet
-
-
PMF370XN
Product data sheet
Measurement conditions for V(BR)DSS revised.
Legal texts have been adapted to the new company name where appropriate.
The format of this data sheet has been redesigned to comply with the identity guidelines of
Nexperia.
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
14. Legal information
injury, death or severe property or environmental damage. Nexperia and its
suppliers accept no liability for inclusion and/or use of Nexperia products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Data sheet status
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Document status
[1][2]
Product
status [3]
Definition
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the internet at https://www.nexperia.com.
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Nexperia does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the relevant
full data sheet, which is available on request via the local Nexperia sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
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data sheet shall define the specification of the product as agreed between
Nexperia and its customer, unless Nexperia and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be
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beyond those described in the Product data sheet.
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Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, Nexperia does not give any
representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
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Notwithstanding any damages that customer might incur for any reason
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Right to make changes — Nexperia reserves the right to make changes
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warranted to be suitable for use in life support, life-critical or safety-critical
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of an Nexperia product can reasonably be expected to result in personal
PMF370XN
Product data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Nexperia products, and Nexperia accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Nexperia product is suitable
and fit for the customer’s applications and products planned, as well as
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Customers should provide appropriate design and operating safeguards to
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Nexperia does not accept any liability related to any default, damage, costs
or problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
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customer’s applications and products using Nexperia products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Nexperia does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
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sold subject to the general terms and conditions of commercial sale, as
published at http://www.nexperia.com/profile/terms, unless otherwise agreed
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Non-automotive qualified products — Unless this data sheet expressly
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In the event that customer uses the product for design-in and use in
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customer (a) shall use the product without Nexperia’s warranty of the
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Translations — A non-English (translated) version of a document is for
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Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
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PMF370XN
Nexperia
N-channel TrenchMOS extremely low level FET
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 3
9. Thermal characteristics............................................... 5
10. Characteristics............................................................ 6
11. Package outline........................................................ 10
12. Soldering................................................................... 11
13. Revision history........................................................12
14. Legal information......................................................13
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Nexperia B.V. 2019. All rights reserved
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Date of release: 5 July 2019
PMF370XN
Product data sheet
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