PZ2012D600-3R0TF

Sunlord Specifications for Multi-layer Chip Ferrite Beads Page 1 of 10 Sunlord S P E C I F I C AT I O N S Customer Product Name Multi-layer Chip Ferrite Beads Sunlord Part Number PZ2012D600-3R0TF Customer Part Number [ New Released, Revised] SPEC No.: PZ201260 Rev. Effective Date Changed Contents Change reasons Approved By 01 / New release / Hai Guo 【 This SPEC is total 10 pages.】 【RoHS Compliant Parts】 Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address:Sunlord Industrial Park,Dafuyuan Industrial Zone,Guanlan,Shenzhen,China 518110 Tel: 0086-755-82400574 Fax:0086-755-82269029 E-Mail:sunlord@sunlordinc.com 【For Customer approval Only】 Qualification Status: Full Approved By Comments: Verified By Date: Restricted Rejected Re-checked By Checked By Sunlord Specifications for Multi-layer Chip Ferrite Beads Page 2 of 10 Table of Contents 1. Scope 2. Reference Documents 3 3 3. Product Descriptions and Identification (Part Number) 3 4. Electrical Characteristics 3 5. Shape and Dimensions 4 6. Test and Measurement Procedures 4~6 6.1 Test Conditions 6.2 Visual Examination 6.3 Electrical Test 6.3.1 DC Resistance 6.3.2 Impedance 6.3.3 Rated Current 6.4 Reliability Test 7. 6.4.1 Teminal Strength 6.4.2 Resistance to Flexure 6.4.3 Vibration 6.4.4 Dropping 6.4.5 Temperature Characteristics 6.4.6 Solderability 6.4.7 Resistance to Soldering Heat 6.4.8 Thermal Shock 6.4.9 Resistance to Low Temperature 6.4.10 Resistance to High Temperature 6.4.11 Damp Heat (Steady State) 6.4.12 Loading Under Dampe Heat 6.4.13 Loading at High Temperature(Life Test) Packaging Storage and Transportation 7.1 Packaging 7.2 Storage 7.3 Transportation 7.4 General Handing Precautions 7.5 Precautions on Use 8. Packaging Documents and Marking 8.1 Packaging Documents 8.2 Marking 9. Recommended Soldering Technologies 9.1 RE-flowing Profile 9.2 Iron Soldering Profile 9.3 Solder Volume 9.4 Attention Regarding PCB Bending 9.5 Cleaning 10. Supplier Information 4 4 4~5 4 4 5 5~6 5 5 5 5 5 5 6 6 6 6 6 6 6 6~8 6~7 8 8 8 8 8~9 8 8~9 9~10 9 9 9 10 10 10 Sunlord 1. 2. 3. Specifications for Multi-layer Chip Ferrite Beads ① ② Type PZ ③ External Dimensions（L X W） [mm] For Large current 2012 [0805] ④ Material Code D ⑤ 2.0 X 1.25 Nominal Impedance Example Nominal Value 600 60 Ω Rate Current 3R0 ⑦ 3.0 A ⑥ Packing HSF Products Hazardous Substance Free Products 4. Page 3 of 10 Scope This specification applies to PZ2012D600-3R0TF multi-layer ferrite chip beads. Applied Documents EIA/IS-759 Multi-layer Chip Bead Qualification Specification. MIL-STD-202 Test Methods for Electronic and Electrical Chip Parts. IEC-68 Test Methods for Environmental Testing. Product Description and Identification (Part Number) 1) Description: Ferrite Bead,2012,60Ohm@ 100MHz,0.02Ohm RDC,3000mA 2) Product Identification (Part Number) PZ 2012 D 600 -3R0 T F ① ② ③ ④ ⑤ ⑥ ⑦ B Bulk Package T Tape Carrier Package Electrical Characteristics Part Number Impedance (Ω) PZ2012D600 60±25% Z Test Freq.(MHz) DCR (Ω) Max. 100 Ir (mA) Max. 0.02 3000 Impedance Frequency Characteristics PZ2012D600 150 Impedance(Ω) 120 90 Z R 60 30 X 0 1 10 100 1000 Frequency(MHz) 1) 2) Operating and storage temperature range (individual chip without packing):：-40℃ to +85℃ Storage temperature range (packaging conditions):-10℃~+40℃ and RH 70% (Max.) Sunlord 5. Specifications for Multi-layer Chip Ferrite Beads Page 4 of 10 Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.5-1, Fig.5-2 and Table 5-1 2) Structure: See Fig. 5-3 and Fig. 5-4 Chip Bead Solder-resist C Land pattern B Fig. 5-1 [Table 5-1] T Type L W 2012 [0805] 2.0 (+0.3, -0.1) [0.079 (+0.012, -0.004)] 1.25±0.2 [0.049±0.008] ② ③ Fig. 5-3 ④ 0.80~ 0.80~ 0.90~ 1.20 1.20 1.60 ① Ferrite for Bead Series Ferrite Sn W ① 0.5±0.3 [0.020±0.012] ④-2 Ni ④-1 Ag ③ Pull out electrode( Ag) ④-1 Terminal electrode :Inside (Ag) ④-2 Outside (Electro-plating Ni-Sn) Fig. 5-4 Material Information 6. C ② Internal electrode (Ag) T a Unit: mm [inch] A B a Structure of Electro-plating T L a 0.85±0.2 [0.033±0.008] A B Fig. 5-2 Code Part Name Material Name ① ② ③ Ferrite Body Inner Coils Pull-out Electrode (Ag) Ferrite Powder Silver Paste Silver Paste Termination Silver Composition Plating Chemicals ④-1 Terminal Electrode: Inside Ag ④-2 Electro-Plating: Ni/Sn plating Test and Measurement Procedures 6.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 20±15℃ b. Relative Humidity: 65±20% c. Air Pressure: 86 KPa to 106 KPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 20±2℃ b. Relative Humidity: 65±5% c. Air Pressure: 86KPa to 106 KPa 6.2 Visual Examination a. Inspection Equipment: 20 X magnifier 6.3 Electrical Test 6.3.1 DC Resistance (DCR) a. Refer to Item 4. b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B 6.3.2 Impedance (Z) a. Refer to Item 4. b. Test equipment:High Accuracy RF Impedance /Material Analyzer-HP4291B+16192A c. Test signal: -20dBm or 50mV d. Test frequency refers to Item 4. Sunlord Specifications for Multi-layer Chip Ferrite Beads Page 5 of 10 6.3.3 Rated Current a. Refer to Item 4. b. Test equipment (see Fig.6.3.3-1): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig. 6.3.3-1): 1. Set test current to be 0 mA. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. d. Definition of Rated Current(IDC): IDC is direct electric current as chip surface temperature rose just 20℃ against chip initial surface temperature(Ta). (see Fig. 6.3.3-2): Thermometer Electric Power +20 Electric Ta Current Meter Chip 0 R Rated current Requirements Test Methods and Remarks No removal or split of the termination or other defects shall occur. Chip F Mounting Pad 6.4.2 Resistance to Flexure Glass Epoxy Board Fig.6.4.1-1 No visible mechanical damage. Unit: mm [inch] Type 2012[0805] a 1.2 b c 4.0 1.65 b 100 Fig.6.4.2-1 ① No visible mechanical damage. ② Impedance change: within ±20% Cu pad ① Solder the bead to the test jig (glass epoxy board shown in Fig.6.4.2-1) Using a eutectic solder. Then apply a force in the direction shown Fig. 6.4.2-2. ② Flexure: 2mm ③ Pressurizing Speed: 0.5mm/sec. ④ Keep time: 30 sec. 20 10 Φ4.5 c a 6.4.3 Vibration ① Solder the bead to the testing jig (glass epoxy board shown in Fig.6.4.1-1) using eutectic solder. Then apply a force in the direction of the arrow. ② 10N force for 2012 series. ③ Keep time: 10±1s ④ Speed:1.0mm/s. Solder mask 6.4.4 Dropping Glass Epoxy Board Fig. 6.4.3-1 ① No visible mechanical damage. ② Impedance change: within ±20% 6.4.5 Temperature 6.4.6 Solderability Impedance change should be within ±20% of initial value measuring at 20℃. ① No visible mechanical damage. ② Wetting shall exceed 95% coverage. R230 40 Items 6.4.1 Terminal Strength Fig. 6.3.3-2 Fig. 6.3.3-1 6.4 Reliability Test IDC (mA) Flexure 45[1.772] 45[1.772] Fig.6.4.2-2 ① Solder the bead to the testing jig (glass epoxy board shown in Fig.6.4.3-1) using eutectic solder. ② The bead shall be subjected to a simple harmonic motion having total amplitude of 1.5mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. ③ The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours) Drop chip bead 10 times on a concrete floor from a height of 100 cm. Temperature range:-40℃ to +85℃ Reference temperature: +20℃ ① Solder temperture:240±2℃ ② Duration: 3 sec. ③ Solder: Sn/3.0Ag/0.5Cu ④ Flux: 25% Resin and 75% ethanol in weight. Sunlord 6.4.7 Resistance to Soldering Heat 6.4.8 Thermal Shock Specifications for Multi-layer Chip Ferrite Beads ① ② ③ ① ② No visible mechanical damage. Wetting shall exceed 95% coverage. Impedance change: within ±20% No mechanical damage. Impedance change: Within ±20% +85℃ 30 min. 30 min. ① ② ③ ④ ⑤ ① ② ③ ④ Ambient Temperature -40℃ Page 6 of 10 Solder temperature :260±3℃ Duration: 5 sec. The chip shall be stabilized at normal condition for 1~2hours before measuring. Solder: Sn/3.0Ag/0.5Cu Flux: 25% Resin and 75% ethanol in weight Temperature, Time: (See Fig.6.4.8-1). -40℃for 30±3 min →+85℃ for 30±3min Transforming interval: Max. 20 sec. Tested cycle: 100 cycles The chip shall be stabilized at normal condition for 1~2 hours before measuring. 30 min. Fig. 6.4.8-1 20sec. (max.) 6.4.9 Resistance to Low Temperature ① ② No mechanical damage. Impedance change: within ±20% ① ② ③ Temperature: -40±2℃ Duration: 1000+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. 6.4.10 Resistance to High Temperature 6.4.11 Damp Heat (Steady States) ① ② No mechanical damage. Impedance change: within ±20% ① ② ③ ① No visible mechanical damage. ② Impedance change: within ±20% ① ② ③ ④ Temperature: 85±2℃ Duration: 1000+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. Temperature: 55±2℃ Humidity: 90% to 95% RH Duration: 1000+24 hours The chip shall be stabilized at normal condition for 1~2 hours before measuring. 6.4.12 Loading Under Damp Heat ① No visible mechanical damage. ② Impedance change: within ±20% ① ② ③ ④ ⑤ Temperature: 55±2℃ Humidity: 90% to 95% RH Duration: 1000+24 hours Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. 6.4.13 Loading at High Temperature (Life Test) ① ② ① ② ③ ④ Temperature:+85±2℃ Duration: 1000+24 hours Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2hours before measuring. 7. No visible mechanical damage. Impedance change: within ±20% Packaging, Storage and Transportation 7.1 Packaging There are two types of packaging for the chip beads. Please specify the packing code when ordering. 7.1.1 Bulk Packaging: Packaging code: B, The quantity of each bag is integral multiple of 1000. Remark: The actual quantity in a package may change sometimes. 7.1.2 Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig.7.1-1~4 b. Tape carrier packaging quantity please see the following table: c. d. e. Type 2012[0805] T(mm) 0.85±0.2 Tape Paper Tape Quantity 4K Reel shall be packaged in vinyl bag. Maximum of 5 or 10 reels bags shall be packaged in an inner box. Maximum of 6 or 10 inner boxes shall be packaged in an outer case. Sunlord Specifications for Multi-layer Chip Ferrite Beads Page 7 of 10 (1) Taping Drawings (Unit: mm) Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity Fig 7.1-1 Remark: The sprocket holes are to the right as the tape is pulled toward the user. (2) Taping Dimensions (Unit: mm) Sprocket Hole Φ1.5 (+0.1,0) Chip Cavity 8.0±0.3 3.5±0.05 A Paper Tape 1.75±0.1 B P 4.0±0.1 Type A B P T max 2012 [0805] 1.5±0.2 2.3±0.2 4.0±0.1 1.1 T Fig 7.1-2 Direction of Feed 4.3±0.2mm (3) Reel Dimensions (Unit: mm) 9.0±1.0mm 2.45±0.1mm 4.0±0.1mm 5.0±0.1mm 58±0.3mm 13.5±0.1mm 3.0±0.1mm (4) Leader and Blank Portion Chip Cavity Blank Portions Fig. 7.1-3 178±2.0mm 40 Min. Fig. 7.1-4 Blank Portions Leader 40 Min. 210 to 250 mm Direction of Feed (5) Missing beads number within 0.1% of the number per reel or 1 pcs, whichever is greater, and are not continuous. (6) The top tape and bottom tape shall not protrude beyond the edges of the tape and shall not cover sprocket hole. (7) Cumulative tolerance of sprocket holes, 10 pitches: ±0.3mm (8) Peeling off force: 10gf to 70gf in the direction show below. Top tape or cover tape 1650 to 180 0 Fig. 7.1-5 7.2 Storage Base tape a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 40℃ or less and 70% RH or less. Sunlord Specifications for Multi-layer Chip Ferrite Beads Page 8 of 10 b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H2S) c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. d. Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as possible. e. Solderability specified in Clause 6.4.6 shall be guaranteed for 3 months from the date of delivery on condition that they are stored at the environment specified in Clause 4 .For those parts, which passed more than 3 months shall be checked solder-ability before use. 7.3 Transportation The cases shall not be damaged, destroyed and rained on. 7.4 General Handling Precautions a. Always wear static control bands to protect against ESD. b. Any devices used with the beads (soldering iron, measuring instruments) should be properly grounded. c. Keep bare hands and metal conductors (i.e., metal desk) away from chip electrodes or conductive areas that lead to chip electrodes. 7.5 Precautions on Use a. Pre-heating when soldering, see detail in Clause 9 in this specification. b. When splitting the PC board after mounting beads and other components, care is required so as not to give any stress of deflection or twisting to the board. c. Don’t apply current in excess of the rated current value. It may reduce the impedance due to the temperature increase effect. d. Always wear static control bands to protect against ESD. e. Keep clear of anything that may generate magnetic fields such as speakers, coils. f. When Soldering, the impedance may be varied due to hot energy and mechanical stress. g. Mounting ships with adhesive in preliminary assembly, before the soldering stage, may lead appropriately checked; the size of land pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use. h. Mounting Density: Add special attention to radiating heat of products when mounting the beads near the products with heating. The excessive heat by other products may cause deterioration at joint of this product with substrate. 8. Packing Documents and Marking 8.1 Packing documents Packing documents include the following: a. Packaging list b. Certificate of compliance (COC) 8.2 See Fig. 8.2-2 Marking 1.Marking label information on reels includes (see Fig.8.2-1~2): a. Customer b. Customer part No. c. Customer P/O# d. Sunlord part No. e. Date code f. Lot number g. Quantity per reel h. Inspection stamp i. MFG address as ‘MADE IN CHINA’ 2.Marking label on inner box (see Fig.8.2-3~4): a. Customer b. Customer part No. c. Customer P/O# d. Sunlord part No. e. Date code f. Quantity per reel g. Manufacturer Fig. 8.2-1 Fig. 8.2-2: Marking label on reels W L Inner Box H See Fig. 8.2-4 Fig. 8.2-3 Sunlord Specifications for Multi-layer Chip Ferrite Beads Page 9 of 10 Packaging type L(cm) W(cm) H(cm) ① Inner Box-１ 18 7.5 18 ② Inner Box-２ 18 12 18 L W Fig. 8.2-4: Marking Label on inner box 3.Marking on outer case (see Fig.8.2-5~6): a. Manufacturer: Sunlord ID: “Shenzhen Sunlord Electronics Co., Ltd.” b. Packing label include the following: i) Customer ii) Manufacture iii) Date code iv) C/No. Example; “1/10” means this case is the 1st one of total 10 cases v) P/O No. ① vi) Customer P/N ② vii) Sunlord P/N viii) QT’Y(K) Sunlord See Fig. 8.2-6 Shenzhen Sunlord Electronics Co., Ltd. Fig. 8.2-5 Packaging type L(cm) W(cm) H(cm) Outer Case-１ 40 20 20 Outer Case-２ 40 20 40 Customer DATE CODE Manufacturer C/No. Outer Case H SHEN ZHEN SUNLORD ELECTRONICS CO.,LTD P/O No. Customer P/N Sunlord P/N QT’Y(K) Fig. 8.2-6: Marking label on outer case 9. Recommended Soldering Technologies 9.1 Re-flowing Profile: △ 1~2 ℃/sec. Ramp △ Pre-heating: 150~190℃/120±30 sec. △ Time above 240℃: 20~60sec △ Peak temperature: 260℃ Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.2 times for Re-flowing 9.2 Iron Soldering Profile. △ Iron soldering power: Max.30W △ Pre-heating: 150 ℃ / 60 sec. △ Soldering Tip temperature: 350℃Max. △ Soldering time: 3 sec Max. △ Solder paste: Sn/3.0Ag/0.5Cu △ Max.1 times for iron soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 9.3 Solder Volume Solder shall be used not to exceed as shown below. Max: 260℃ 260℃ 200℃ 240℃ 190℃ 150℃ 20~60sec. Gradual Cooling 120±30sec. 3 sec. Max. 350℃ Soldering Iron Power: max. 30W Diameter of Soldering Iron 1.0mm max. Tc ℃ Upper Limit Recommendable 1/3T ≤L≤T (T: Chip thickness) L Fig.9.3-1 Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Sunlord Specifications for Multi-layer Chip Ferrite Beads Page 10 of 10 9.4 Attention Regarding PCB Bending The following shall be considered when designing and laying out PCB’s. (1) PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection. Products shall be located in the sideways direction to the (Poor example) Fig. 9.4-1 mechanical stress (Good example) (2) Products location on PCB separation. C Seam B Product shall be located carefully because they may be subjected to the mechanical stress in order of A>C=B>D. A D Fig. 9.4-2 9.5 Cleaning Products shall be cleaned on the following conditions: (1) Cleaning temperature shall be limited to 60℃ Max. (40℃ Max. for fluoride and alcohol type cleaner.) (2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon at the mounted products and PCB. Power: 20W/l Max. Frequency: 28KHz to 40 KHz Time: 5 minutes Max (3) Cleaner ① Alternative cleaner i. Isopropyl alcohol (IPA) ii. HCFC-225 ② Aqueous agent z Surface Active Agent Type (Clean through-750H) z Hydrocarbon Type (Techno Cleaner-335) z Higher Alcohol Type (Pine Alpha ST-100S) z Alkali saponifier Type (※ Aqua Cleaner 240) ※ Alkali saponification shall be diluted to 20% volume with de-ionized water. (4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent, product shall be dried completely after rinse with de-ionized water in order to remove the cleaner. (5) Some products may become slightly whitened. However, product performance or usage is not affected. 10. Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd b) Manufacturer Shenzhen Sunlord Electronics Co., Ltd c) Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial Zone, Guanlan, Shenzhen, China Zip: 518110