WSD30150DN56
N-Ch MOSFET
Product Summery
General Description
The WSD30150DN56 is the highest performance trench
N-Ch MOSFET with extreme high celldensity ,which
provide excellent RDSON and gate charge for most of
the synchronous buck converter applications .
BVDSS
RDSON
ID
30V
1.8mΩ
150A
Applications
The WSD30150DN56 meet the RoHS and Green
Product requirement , 100% EAS guaranteed with
full function reliability approved.
z High Frequency Point-of-Load Synchronous
Buck Converter
z Networking DC-DC Power System
Features
z Power Tool Application
z Advanced high cell density Trench technology
DFN5X6-8 Pin Configuration
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=100℃
IDM
Rating
Units
Drain-Source Voltage
30
V
Gate-Source Voltage
±20
V
1,7
150
A
1,7
83
A
200
A
125
mJ
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
EAS
Single Pulse Avalanche Energy
IAS
Avalanche Current
50
A
W
PD@TC=25℃
Total Power Dissipation
62.5
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
4
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-Ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
30
℃/W
---
2
℃/W
Dec.2014
WSD30150DN56
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
30
---
---
V
Reference to 25℃ , ID=1mA
---
0.02
---
V/℃
---
1.8
2.4
2.4
3.2
1.4
1.7
2.5
V
---
-6.1
---
mV/℃
VDS=24V , VGS=0V , TJ=25℃
---
---
1
VDS=24V , VGS=0V , TJ=55℃
---
---
5
VGS=10V , ID=20A
VGS=4.5V , ID=15A
VGS=VDS , ID =250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=10A
---
27
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
0.8
1.5
Ω
---
26
---
---
9.5
---
---
11.4
-----
Qg
Total Gate Charge (4.5V)
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=15V , VGS=4.5V , ID=30A
uA
nC
---
20
Rise Time
VDD=15V , VGEN=10V , RG=6Ω,
---
12
---
Turn-Off Delay Time
ID=1A, RL=15Ω.
---
69
---
Fall Time
---
29
---
Ciss
Input Capacitance
---
3200
---
Coss
Output Capacitance
---
680
---
Crss
Reverse Transfer Capacitance
---
320
---
Min.
Typ.
Max.
Unit
98
---
---
mJ
Min.
Typ.
Max.
Unit
A
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=15V , VGS=0V , f=1MHz
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=25V , L=0.1mH , IAS=30A
Diode Characteristics
Symbol
Parameter
Conditions
1,6
IS
Continuous Source Current
ISM
Pulsed Source Current2,6
VSD
Diode Forward Voltage
2
VG=VD=0V , Force Current
VGS=0V , IS=A , TJ=25℃
---
---
30
---
---
200
A
---
---
1.2
V
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t
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