WSF20N06
N-Ch MOSFET
General Description
Product Summery
The WSF20N06 is the highest performance
trench N-Ch MOSFET with extreme high cell
density , which provide excellent RDSON and
gate charge for most of the synchronous buck
converter applications .
BVDSS
RDSON
ID
60V
35mΩ
25A
Applications
The WSF20N06 meet the RoHS and
Green Product requirement .
z High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z Networking DC-DC Power System
z LCD/LED back light
Features
TO-252 Pin Configuration
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
60
V
VGS
Gate-Source Voltage
±20
V
ID@TC=25℃
1
Continuous Drain Current, VGS @ 10V
25
A
ID@TC=100℃
Continuous Drain Current, VGS @ 10V1
27
A
1
8
A
1
10
A
100
A
ID@TA=25℃
ID@TA=70℃
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
EAS
Single Pulse Avalanche Energy
38
mJ
IAS
Avalanche Current
PD@TC=25℃
14
A
4
35
W
4
Total Power Dissipation
PD@TA=25℃
Total Power Dissipation
3.3
W
TSTG
Storage Temperature Range
-55 to 175
℃
TJ
Operating Junction Temperature Range
-55 to 175
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-Ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
75
℃/W
---
3
℃/W
Dec.2014
WSF20N06
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=250uA
60
---
---
V
Reference to 25℃ , ID=1mA
---
0.057
---
V/℃
VGS=10V , ID=16A
---
35
45
VGS=5V , ID=8A
---
40
50
1.0
1.6
2.5
V
---
-5.68
---
mV/℃
VDS=60V , VGS=0V , TJ=25℃
---
---
1
VDS=60V , VGS=0V , TJ=125℃
---
---
100
VGS=VDS , ID =250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±16V , VDS=0V
---
---
±10
nA
gfs
Forward Transconductance
VDS=25V , ID=18A
---
25
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
1.7
3.4
Ω
Qg
Total Gate Charge (4.5V)
---
20
---
Qgs
Gate-Source Charge
---
7
---
Qgd
Gate-Drain Charge
---
5
---
VDS=30V , VGS=10V , ID=18A
uA
nC
---
18
---
Rise Time
VDD=30V , VGS=10V ,
---
15
---
Turn-Off Delay Time
RG=6.8Ω, ID=1A
---
60
---
Fall Time
---
31
---
Ciss
Input Capacitance
---
650
---
Coss
Output Capacitance
---
95
---
Crss
Reverse Transfer Capacitance
---
60
---
Min.
Typ.
Max.
Unit
19
---
---
mJ
Min.
Typ.
Max.
Unit
---
---
25
A
---
---
75
A
---
---
1.3
V
---
65
---
nS
---
85
---
nC
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=30V , VGS=0V , f=1MHz
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=25V , L=0.1mH , IAS=15A
Diode Characteristics
Symbol
IS
ISM
Parameter
Conditions
1,6
Continuous Source Current
2,6
Pulsed Source Current
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=20A , TJ=25℃
IF=20A ,dI/dt=100A/µs,TJ=25℃
Note :
1. The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t
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