WSR80N06
N-Ch MOSFET
General Description
Product Summery
The WSR80N06 uses advanced trench
technology and design to provide excellent RDS(ON)
BVDSS
RDSON
ID
60V
9.1mΩ
80A
with low gate charge. It can be used in a wide variety
of applications.
Application
● Power switching application
● Hard switched and high frequency circuits
● Uninterruptible power supply
Features
● High density cell design for ultra low Rdson
TO-220AB Pin Configuration
● Fully characterized avalanche voltage and current
● Good stability and uniformity with high EAS
D
● Excellent package for good heat dissipation
● Special process technology for high ESD capability
D
S
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=100℃
IDM
EAS
PD@TC=25℃
TJ TSTG
Rating
Units
Drain-Source Voltage
60
V
Gate-Source Voltage
±20
V
80
A
1
Continuous Drain Current, VGS @ 10V
1
50
A
300
A
450
mJ
Total Power Dissipation
110
W
Operating Junction Temperature Range
-55 to 175
℃
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
2
3
Single Pulse Avalanche Energy
4
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-Ambient
RθJC
Thermal Resistance Junction-Case1
www.winsok.tw
Page 1
1
Max.
Unit
---
62
℃/W
---
0.57
℃/W
Dec.2014
WSR80N06
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
=
VGS=0V , ID 250uA
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance
Gate Threshold Voltage
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
gfs
Forward Transconductance
Qg
Total Gate Charge (4.5V)
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
Td(on)
Tr
Td(off)
Tf
Ciss
Reference to 25℃ , ID=1mA
2
=
VGS=10V , ID 30A
VGS=VDS , ID =250uA
Min.
Typ.
Max.
Unit
60
---
---
V
---
0.057
---
V/℃
---
9.1
11.5
2.0
3.0
4.0
V
---
-5.68
---
mV/℃
VDS=48V , VGS=0V , TJ=25℃
---
---
1
VDS=48V , VGS=0V , TJ=55℃
---
---
5
VGS=±20V , VDS=0V
---
---
±100
nA
20
---
---
S
---
36
45
---
9.9
18
---
6.6
15
---
16
---
10
21
Turn-Off Delay Time
---
45
65
Fall Time
---
12
22
---
2350
---
---
237
---
---
205
---
Min.
Typ.
Max.
Unit
---
---
80
A
---
---
1.2
V
=
VDS=5V , ID 15A
VDS=30V , VGS=4.5V , ID=30A
Turn-On Delay Time
VDS=30V , VGS=10V , ID=2A ,
R=1Ω.
Rise Time
Input Capacitance
VDS=25V , VGS=0V , f=1MHz
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
uA
nC
28
ns
pF
Diode Characteristics
Symbol
IS
Parameter
Conditions
1,6
Continuous Source Current
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25℃
IF=80A ,dI/dt=100A/µs,TJ=25℃
---
28
---
nS
---
49
---
nC
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
5. EAS condition : Tj=25℃,VDD=30V,VG=10V,L=0.5mH,Rg=25Ω
www.winsok.tw
Page 2
Dec.2014
WSR80N06
N-Ch MOSFET
Typical Characteristics
℃)
TJ-Junction Temperatu(re
Vds Drain-Source Voltage (V)
Figure 1 Output Characteristics
Figure 4 Rdson-JunctionTemperature
Vgs Gate-Source Voltage (V)
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Figure 5 Gate Charge
ID- Drain Current (A)
Figure 3 RdsonD
- rain Current
www.winsok.tw
Vsd Source-Drain Voltage (V)
Figure 6 Source- Drain Diode Forward
Page 3
Dec.2014
WSR80N06
N-Ch MOSFET
TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Figure 7 Capacitance vs Vds
Figure 9 BVDSS vs Junction Temperature
Vds Drain-Source Voltage (V)
TJ-Junction Temperature(℃)
Figure 8 Safe Operation Area
Figure 10 VGS(th) vs Junction Temperature
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
www.winsok.tw
Page 4
Dec.2014
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