ICSRC52128SFR

REVISION HISTORY DESCRIPTION 신신 제제 1 A 0,15 1,56 0,25 REV DATE 2009.04.05 2010.08.23 APPROVED P.K.KO P.K.KO B BOTTOM면R면면 면경 0.1 R C 인인인 인인 면경 0.85 +0.15 -0.05 2012.02.17 P.K.KOH D SHIELD CASE THICKNESS 0.2 ±0.02 => 0.2 + 0.02 -0 2012.03.30 P.K.KOH +0.1 0 4 ±0.1 1,55 2 ±0.05 0,3 16 7,5 ±0.1 O 1,58 3,14 5,2 1,2 1,75 ±0.1 Taping 사양도SCALE 2: 1 1,2 SCALE 15 / 1 0,15 0,86 1,28 0,85 +0.15 -0.05 0,15 +0.02 -0.05 NOTES 4 ±0.1 1. MATERIAL : SUS301 2. MATERIAL THICKNESS :0.15t 3. FINISHED : Sn(100%) PLATING ON BOTH SIDE ( Ni0.5㎛ Sn1.27㎛ ) 4. PACKING MATERIALS. - REEL : HIPS 0.3t - COVER TAPE : PS _ Q'TY/REEL : 10,000ea 5. AVAILABLE SHIELD CASE THICKNESS : 0.2+0.02-0 6. CONTACT RESISTANCE 300mmΩ MAX 7. INTENTION FORCE/RETENTION FORCE SPEC INTENTION FORCE RETENTION FORCE SPEC MAX 1.2Kg MIN 0.5Kg . 8. STENCIL THICKNESS : 0.12T 1,42 5,4 RECOMMENDED PCB LAYOUT 9. Maintain 90˚±3 while engage & disengage shield can & shield clip to prevent deformation & to maintain retention force of shield clip 0,9 1,3 1,1 2 1,5 1,5 0,8 5 1,5 RECOMMENDED STENCIL LAY-OUT 0.1T UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS TOLERANCES ARE ANGLES ± 0. 3° 0 ~ 1 ± 0.05 1 ~ 5 ± 0.1 5 ~ 10 ± 0.15 Solution Provider TITLE SIZE DWG NO SHILED CLIP A3 ICSRC-52128SFR FILE NAME: ICSRC-52128SFR.dft SCALE: WEIGHT: SHEET 1 OF 1 REV D