0,8
0,4
0,15
신신 제제
C
인인인 인인 인제 +0.1 -0.05
SHIELD CASE THICKNESS 0.2±0.02 => 0.2 +0.02 -0
4 ±0.1
APPROVED
2009.10.05
P.K.KO
2012.02.15
P.K.KO
P.K.KOH
2012.03.30
TAPING 사양도 (SCALE 3/1)
2 ±0.05
DATE
O
1,55
+0.1
0
0,3
16
7,5 ±0.1
1,4
3,25
1,75 ±0.1
0,7
1,85
0,5
6,5
1
1,21
A
B
NOTES
4 ±0.1
1. MATERIAL : SUS301
2. MATERIAL THICKNESS :0.15t
3. FINISHED : Sn(100%) PLATING ON BOTH SIDE
( Ni 0.5㎛ Sn1.27㎛ )
4. PACKING MATERIALS.
- REEL : HIPS 0.3t
- COVER TAPE : PS
_ Q'TY/REEL : 10,000ea
5. AVAILABLE SHIELD CASE THICKNESS : 0.2 +0.02 -0
6. CONTACT RESISTANE 300mmΩ MAX
7. INTENTION FORCE/RETENTION FORCE SPEC
0,8
0,78
0,15 +0.02
-0.05
REV
REVISION HISTORY
DESCRIPTION
+0.1
-0.05
0,72
SCALE : 15/1
SPEC
1,5
INTENTION FORCE RETENTION FORCE
MAX 1.0Kg
MIN 0.3Kg
8.STENCIL THICKNESS : 0.12T
6,7
1
1,1
0,8
0,9
1,1
6,4
RECOMMENDED PCB LAYOUT
RECOMMENDED STENCIL LAY-OUT 0.1T
9. Maintain 90˚±3 while engage & disengage shield can & shield
clip to prevent deformation & to maintain retention force of
shield clip
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN MILLIMETERS
TOLERANCES ARE
ANGLES ± 0. 3°
0 ~ 1 ± 0.05
1 ~ 5 ± 0.1
5 ~ 10 ± 0.15
TITLE
SIZE DWG NO
SHILED CLIP
A3
ICSRC6508SFR
FILE NAME: ICSRC6508SFR.dft
SCALE:
WEIGHT:
SHEET 1 OF 1
REV
C
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