ICSRC5210SFR

REVISION HISTORY DESCRIPTION 신신제제 REV 1,56 C D 1,75 ±0.1 16 4 ±0.1 NOTES 4 ±0.1 1. MATERIAL : SUS301 2. MATERIAL THICKNESS :0.15t 3. FINISHED : Sn(100%) PLATING ON BOTH SIDE ( Ni0.5㎛ Sn1.27㎛ ) 4. PACKING MATERIALS. - REEL : HIPS 0.3t - COVER TAPE : PS _ Q'TY/REEL : 10,000ea 5. AVAILABLE SHIELD CASE THICKNESS : 0.2 +0.02 -0 6. CONTACT RESISTANCE 300mmΩ MAX 7. INTENTION FORCE/RETENTION FORCE SPEC 1,28 0,85 SCALE 15 / 1 SPEC 1,5 2 0,9 1,1 1,5 P.K.KOH P.K.KOH 0,3 O 2 ±0.05 0,74 0,15 RECOMMENDED PCB LAYOUT SHIELD CASE THICKNESS 0.2 ±0.02 => 0.2 +0.02 -0 TAPING 사양도 (SCALE : 3/1 ) +0.1 -0.05 +0.02 -0.05 5,4 인인인 인인 면경 0.74 +0.1 -0.05 P.K.KO P.K.KO 7,5 ±0.1 1,57 3,14 5,2 1,3 1 BOTTOM면 R면경 0.1 R APPROVED +0.1 0 0,15 1,55 1 A B DATE 2009.04.05 2010.08.23 2012.02.17 2012.03.30 0,8 5 REECOMMENDED STENCIL LAY-OUT 0.1T 1,5 INTENTION FORCE RETENTION FORCE MAX 1.6Kg MIN 0.5Kg 8. STENCIL THICKNESS : 0.12T 9. Maintain 90˚±3 while engage & disengage shield can & shield clip to prevent deformation & to maintain retention force of shield clip UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS TOLERANCES ARE ANGLES ± 0. 3° 0 ~ 1 ± 0.05 1 ~ 5 ± 0.1 5 ~ 10 ± 0.15 Solution Provider TITLE SIZE DWG NO SHILED CLIP A3 ICSRC-5210SFR FILE NAME: ICSRC-5210SFRdft.dft SCALE: WEIGHT: SHEET 1 OF 1 REV D