B3D090L-C

B3D090L-C Order Code: B3D090L-C Version: A0 2013-09-17 Gas Discharge Tube Exterior Features Surface Mounting Design 7.6×5.0×5.8mm High Current Handling Capability 5,000A @ 8/20μs Low Capacitance and Insertion Loss Quick Response and Long Service Life Moisture sensitivity level：Level 1 SMD Application information Package (Top View) RS485/232/422 ` 1 Agency Approvals 3 2 Schematic Symbol Icon Description Compliance with 2011/65/EU 1 3 Compliance with IEC61249-2-21:2003 Mean lead free 2 UL Certificated E232249 Electrical Parameter DC Breakdown Voltage 1)2) Impulse Spark-over Voltage 100V/s 68-112 V At 1kV/μs for 99 % of measured values  700 At 1kV/μs Typical values of distribution  600 V V Impulse Discharge Current 3) 8/20μs 5,000 A Arc Voltage At 1A ~8 V Insulation Resistance DC=50V ≥1 GΩ Capacitance at 1MHz VDC=0.5V ≤1.5 pF Weight ~1.1 g Operating And Storage Temperature -40-90 ℃ Marking Bencent Logo YY MM B3D090L-C（YY：year of production，MM：month of production） 1) At delivery AQL 0.65 level II GB/T 2828.1-2003 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 1/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications B3D090L-C Order Code: B3D090L-C Version: A0 2013-09-17 Gas Discharge Tube Part Numbering System Product Characteristics B3D 090 L -C (1) (2) ( 3) (4) (1) Bencent 3-Electrode SMD Gas Discharge Tube 7.6×5.0×5.8mm Lead Material Copper Body Material Ceramics Terminal Finish 100% Matte-Tin Plated (2) DC Breakdown Voltage, e.g., 090=90V (3) Surge Rating @8/20μs, L=5,000A （ Total Impulse Discharge Current 5,000A @ 8/20μs） (4) “ -C ” Means it is Suitable for High-Speed SMT Environmental Reliability Characteristics Testing items Technical standards Temperature: 85℃ Time:2H Temperature: -40℃ Time:2H Frequency：10-500Hz Amplitude：0.15mm Time：45min Temperature: 260±5℃ Time of dip soldering：10s，1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions A B C D E F Recommended Soldering Pad A B C D 2/3 www.bencent.com.cn G REF mm inch A 7.6±0.3 0.299±0.012 B 0.5±0.2 0.020±0.008 C 1.6±0.2 0.063±0.008 D 0.5±0.2 0.020±0.008 E 5.0±0.2 0.197±0.008 F 5.0±0.2 0.197±0.008 G 5.8±0.3 0.228±0.012 REF mm inch A 9.6 0.378 B 1.5 0.059 C 1.5 0.059 D 5.0 0.197 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications B3D090L-C Order Code: B3D090L-C Version: A0 2013-09-17 Gas Discharge Tube Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time （min to max） 60 – 180 secs Average ramp up rate（Liquids）Tamp （TL） to peal TS(max) to TL - Ramp-up Rate 3°C/second max - Temperature (TL) - Temperature (TL) Peak Temperature (TP) 217°C 60 – 150 seconds tS 25 Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C 3/3 Reel Ramp-down Preheat TS(min) ~10 seconds Temperature (tp) Package TL TS(max) 260+0/-5 °C Time within 5°C of actual peak Critical Zone TL to TP Ramp-up TL 3°C/second max (Liquids) Reflow tP TP Temperature Pre Pb-Free assembly Time time to peak temper ature Information REF mm inch A 5.4±0.1 0.216±0.004 B 8.4±0.1 0.331±0.004 d Φ1.5±0.1 Φ0.059±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 P 8.0±0.1 0.315±0.004 E 1.75±0.1 0.069±0.004 F 7.5±0.1 0.295±0.004 W 16.0±0.3 0.630± 0.012 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.15 0.512±0.006 W1 16.8±2.0 0.661±0.079 Outline Reel (PCS) Per Carton (PCS) Reel Diameter (mm) TAPING 1,000 16,000 330 www.bencent.com.cn Carton Size(mm) L W H 360 360 380 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications