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GD32F103RET6

GD32F103RET6

  • 厂商:

    GIGADEVICE(兆易创新)

  • 封装:

    LQFP64_10X10MM

  • 描述:

    ARM Cortex-M3 32位MCU LQFP64_10X10MM 108MHz

  • 数据手册
  • 价格&库存
GD32F103RET6 数据手册
GigaDevice Semiconductor Inc. GD32F103xx ARM® Cortex™-M3 32-bit MCU Datasheet GD32F103xx Datasheet Table of Contents Table of Contents ........................................................................................................... 1 List of Figures ................................................................................................................ 3 List of Tables .................................................................................................................. 4 1. General description ................................................................................................. 5 2. Device overview ....................................................................................................... 6 2.1. Device information .......................................................................................................... 6 2.2. Block diagram ................................................................................................................. 9 2.3. Pinouts and pin assignment ........................................................................................ 11 2.4. Memory map .................................................................................................................. 15 2.5. Clock tree ...................................................................................................................... 19 2.6. Pin definitions ............................................................................................................... 20 2.6.1. GD32F103Zx LQFP144 pin definitions ................................................................................. 20 2.6.2. GD32F103Vx LQFP100 pin definitions ................................................................................ 28 2.6.3. GD32F103Rx LQFP64 pin definitions .................................................................................. 35 2.6.4. GD32F103Cx LQFP48 pin definitions .................................................................................. 39 2.6.5. GD32F103Tx QFN36 pin definitions .................................................................................... 42 3. Functional description .......................................................................................... 44 3.1. ARM® Cortex™-M3 core............................................................................................... 44 3.2. On-chip memory ........................................................................................................... 44 3.3. Clock, reset and supply management ......................................................................... 45 3.4. Boot modes ................................................................................................................... 45 3.5. Power saving modes .................................................................................................... 47 3.6. Analog to digital converter (ADC) ................................................................................ 47 3.7. Digital to analog converter (DAC) ................................................................................ 48 3.8. DMA ............................................................................................................................... 48 3.9. General-purpose inputs/outputs (GPIOs) .................................................................... 48 3.10. Timers and PWM generation ................................................................................. 49 3.11. Real time clock (RTC) ............................................................................................ 50 3.12. Inter-integrated circuit (I2C) .................................................................................. 50 3.13. Serial peripheral interface (SPI) ............................................................................ 51 3.14. Universal synchronous asynchronous receiver transmitter (USART) ............... 51 1 GD32F103xx Datasheet 3.15. Inter-IC sound (I2S) ................................................................................................ 51 3.16. Secure digital input and output card interface (SDIO) ......................................... 52 3.17. Universal serial bus full-speed device (USBD) .................................................... 52 3.18. Controller area network (CAN) .............................................................................. 52 3.19. External memory controller (EXMC) ..................................................................... 52 3.20. Debug mode ........................................................................................................... 53 3.21. Package and operation temperature ..................................................................... 53 4. Electrical characteristics ....................................................................................... 54 4.1. Absolute maximum ratings .......................................................................................... 54 4.2. Recommended DC characteristics .............................................................................. 54 4.3. Power consumption ...................................................................................................... 55 4.4. EMC characteristics ...................................................................................................... 60 4.5. Power supply supervisor characteristics.................................................................... 60 4.6. Electrical sensitivity ..................................................................................................... 62 4.7. External clock characteristics...................................................................................... 63 4.8. Internal clock characteristics ....................................................................................... 64 4.9. PLL characteristics ....................................................................................................... 65 4.10. Memory characteristics ......................................................................................... 65 4.11. GPIO characteristics .............................................................................................. 65 4.12. ADC characteristics ............................................................................................... 67 4.13. DAC characteristics ............................................................................................... 67 4.14. I2C characteristics ................................................................................................. 67 4.15. SPI characteristics ................................................................................................. 68 5. Package information.............................................................................................. 69 5.1. QFN package outline dimensions ................................................................................ 69 5.2. LQFP package outline dimensions .............................................................................. 70 6. Ordering Information ............................................................................................. 72 7. Revision History..................................................................................................... 74 2 GD32F103xx Datasheet List of Figures Figure 2-1. GD32F103x4/6/8/B block diagram ........................................................................................... 9 Figure 2-2. GD32F103xC/D/E/F/G/I/K block diagram .............................................................................. 10 Figure 2-3. GD32F103Zx LQFP144 pinouts .............................................................................................. 11 Figure 2-4. GD32F103Vx LQFP100 pinouts ............................................................................................. 12 Figure 2-5. GD32F103Rx LQFP64 pinouts .............................................................................................. 13 Figure 2-6. GD32F103Cx LQFP48 pinouts .............................................................................................. 13 Figure 2-7. GD32F103Tx QFN36 pinouts ................................................................................................. 14 Figure 2-8. GD32F103xx clock tree .......................................................................................................... 19 Figure 5-1. QFN package outline.............................................................................................................. 69 Figure 5-2. LQFP package outline............................................................................................................ 70 3 GD32F103xx Datasheet List of Tables Table 2-1. GD32F103xx devices features and peripheral list .................................................................. 6 Table 2-2. GD32F103xx devices features and peripheral list (continued) ............................................. 7 Table 2-3. GD32F103xx devices features and peripheral list (continued) ............................................. 8 Table 2-4. GD32F103xx memory map ...................................................................................................... 15 Table 2-5. GD32F103Zx LQFP144 pin definitions ................................................................................... 20 Table 2-6. GD32F103Vx LQFP100 pin definitions ................................................................................... 28 Table 2-7. GD32F103Rx LQFP64 pin definitions .................................................................................... 35 Table 2-8. GD32F103Cx LQFP48 pin definitions .................................................................................... 39 Table 2-9. GD32F103Tx QFN36 pin definitions ....................................................................................... 42 Table 4-1. Absolute maximum ratings ..................................................................................................... 54 Table 4-2. DC operating conditions ......................................................................................................... 54 Table 4-3. Power consumption characteristics (for GD32F103x4/6/8/B devices) ............................... 55 Table 4-4. Power consumption characteristics (for GD32F103xC/D/E/F/G/I/K devices) .................... 56 Table 4-5. Power consumption of peripherals (for GD32F103x4/6/8/B devices) ................................. 57 Table 4-6. Power consumption of peripherals (for GD32F103xC/D/E/F/G/I/K devices) ...................... 58 Table 4-7. EMS characteristics ................................................................................................................. 60 Table 4-8. EMI characteristics .................................................................................................................. 60 Table 4-9. Power supply supervisor characteristics (for GD32F103x4/6/8/B devices) ....................... 60 Table 4-10. Power supply supervisor characteristics (for GD32F103xC/D/E/F/G/I/K devices) .......... 60 Table 4-11. ESD characteristics ............................................................................................................... 62 Table 4-12. Static latch-up characteristics .............................................................................................. 62 Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics . 63 Table 4-14. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics .. 63 Table 4-15. High speed internal clock (IRC8M) characteristics ............................................................ 64 Table 4-16. Low speed internal clock (IRC40K) characteristics ........................................................... 64 Table 4-17. PLL characteristics ................................................................................................................ 65 Table 4-18. Flash memory characteristics .............................................................................................. 65 Table 4-19. I/O port characteristics (for GD32F103x4/6/8/B devices) ................................................... 65 Table 4-20. I/O port characteristics (for GD32F103xC/D/E/F/G/I/K devices) ........................................ 66 Table 4-21. ADC characteristics ............................................................................................................... 67 Table 4-22. DAC characteristics ............................................................................................................... 67 Table 4-23. I2C characteristics ................................................................................................................. 67 Table 4-24. Standard SPI characteristics ................................................................................................ 68 Table 5-1. QFN package dimensions ....................................................................................................... 69 Table 5-2. LQFP package dimensions ..................................................................................................... 71 Table 6-1. Part ordering code for GD32F103xx devices ........................................................................ 72 Table 7-1. Revision history ....................................................................................................................... 74 4 GD32F103xx Datasheet 1. General description The GD32F103xx device is a 32-bit general-purpose microcontroller based on the ARM® Cortex™-M3 RISC core with best ratio in terms of processing power, reduced power consumption and peripheral set. The Cortex™-M3 is a next generation processor core which is tightly coupled with a Nested Vectored Interrupt Controller (NVIC), SysTick timer and advanced debug support. The GD32F103xx device incorporates the ARM® Cortex™-M3 32-bit processor core operating at 108 MHz frequency with Flash accesses zero wait states to obtain maximum efficiency. It provides up to 3 MB on-chip Flash memory and up to 96 KB SRAM memory. An extensive range of enhanced I/Os and peripherals connected to two APB buses. The devices offer up to three 12-bit ADCs, up to two 12-bit DACs, up to ten general 16-bit timers, two basic timers plus two PWM advanced timer, as well as standard and advanced communication interfaces: up to three SPIs, two I2Cs, three USARTs, two UARTs, two I2Ss, an USBD, a CAN and a SDIO. The device operates from a 2.6 to 3.6 V power supply and available in –40 to +85 °C temperature range. Several power saving modes provide the flexibility for maximum optimization between wakeup latency and power consumption, an especially important consideration in low power applications. The above features make the GD32F103xx devices suitable for a wide range of applications, especially in areas such as industrial control, motor drives, power monitor and alarm systems, consumer and handheld equipment, POS, vehicle GPS, video intercom, PC peripherals and so on. 5 GD32F103xx Datasheet 2. Device overview 2.1. Device information Table 2-1. GD32F103xx devices features and peripheral list GD32F103xx Part Number T4 T6 T8 TB C4 C6 C8 CB R4 R6 R8 RB V8 VB Flash (KB) 16 32 64 128 16 32 64 128 16 32 64 128 64 128 SRAM (KB) 6 10 20 20 6 10 20 20 6 10 20 20 20 20 2 2 3 3 2 2 3 3 2 2 3 3 3 3 (1-2) (1-2) (1-3) (1-3) (1-2) (1-2) (1-3) (1-3) (1-2) (1-2) (1-3) (1-3) (1-3) (1-3) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 (0) (0) (0) (0) (0) (0) (0) (0) (0) (0) (0) (0) (0) (0) SysTick 1 1 1 1 1 1 1 1 1 1 1 1 1 1 Watchdog 2 2 2 2 2 2 2 2 2 2 2 2 2 2 RTC 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 3 3 2 2 3 3 3 3 (0-1) (0-1) (0-1) (0-1) (0-1) (0-1) (0-2) (0-2) (0-1) (0-1) (0-2) (0-2) (0-2) (0-2) 1 1 1 1 1 1 2 2 1 1 2 2 2 2 (0) (0) (0) (0) (0) (0) (0-1) (0-1) (0) (0) (0-1) (0-1) (0-1) (0-1) 1 1 1 1 1 1 2 2 1 1 2 2 2 2 (0) (0) (0) (0) (0) (0) (0-1) (0-1) (0) (0) (0-1) (0-1) (0-1) (0-1) CAN 1 1 1 1 1 1 1 1 1 1 1 1 1 1 USBD 1 1 1 1 1 1 1 1 1 1 1 1 1 1 GPIO 26 26 26 26 37 37 37 37 51 51 51 51 80 80 EXMC 0 0 0 0 0 0 0 0 0 0 0 0 1 1 EXTI 16 16 16 16 16 16 16 16 16 16 16 16 16 16 Units 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Channels 10 10 10 10 10 10 10 10 16 16 16 16 16 16 General timer(16bit) Timers Advanced timer(16bit) ADC Connectivity USART I2C SPI Package QFN36 LQFP48 LQFP64 LQFP100 6 GD32F103xx Datasheet Table 2-2. GD32F103xx devices features and peripheral list (continued) GD32F103xx Part Number RC RD RE RF RG RI RK VC VD VE VF VG VI VK Flash (KB) 256 384 512 768 1024 2048 3072 256 384 512 768 1024 2048 3072 SRAM (KB) 48 64 64 96 96 96 96 48 64 64 96 96 96 96 4 4 4 10 10 10 10 4 4 4 10 10 10 10 (1-4) (1-4) (1-4) (1-4,8-13) (1-4,8-13) (1-4,8-13) (1-4,8-13) (1-4) (1-4) (1-4) (1-4,8-13) (1-4,8-13) (1-4,8-13) (1-4,8-13) 2 2 2 2 2 2 2 2 2 2 2 2 2 2 (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 2 2 2 2 2 2 2 2 2 2 2 2 2 (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) Watchdog 2 2 2 2 2 2 2 2 2 2 2 2 2 2 RTC 1 1 1 1 1 1 1 1 1 1 1 1 1 1 USART 3 3 3 3 3 3 3 3 3 3 3 3 3 3 UART 2 2 2 2 2 2 2 2 2 2 2 2 2 2 I2C 2 2 2 2 2 2 2 2 2 2 2 2 2 2 General timer(16bit) Advanced Timers timer(16bit) SysTick Basic timer(16- Connectivity bit) 3 3 3 3 3 3 3 3 3 3 3 3 3 3 (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) CAN 1 1 1 1 1 1 1 1 1 1 1 1 1 1 USBD 1 1 1 1 1 1 1 1 1 1 1 1 1 1 SPI 2 2 2 2 2 2 2 2 2 2 2 2 2 2 (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) 1 1 1 1 1 1 1 1 1 1 1 1 1 1 GPIO 51 51 51 51 51 51 51 80 80 80 80 80 80 80 EXMC 0 0 0 0 0 0 0 1 1 1 1 1 1 1 EXTI 16 16 16 16 16 16 16 16 16 16 16 16 16 16 Units 3 3 3 3 3 3 3 3 3 3 3 3 3 3 Channels 16 16 16 16 16 16 16 16 16 16 16 16 16 16 DAC 2 2 2 2 2 2 2 2 2 2 2 2 2 2 I2S ADC SDIO Package LQFP64 LQFP100 7 GD32F103xx Datasheet Table 2-3. GD32F103xx devices features and peripheral list (continued) GD32F103xx Part Number ZD ZE ZF ZG ZI ZK Flash (KB) 256 384 512 768 1024 2048 3072 SRAM (KB) 48 64 64 96 96 96 96 General 4 4 4 10 10 10 10 timer(16-bit) (1-4) (1-4) (1-4) (1-4,8-13) (1-4,8-13) (1-4,8-13) (1-4,8-13) Advanced 2 2 2 2 2 2 2 timer(16-bit) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) (0,7) SysTick 1 1 1 1 1 1 1 Connectivity Timers ZC Basic timer(16- 2 2 2 2 2 2 2 bit) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) (5-6) Watchdog 2 2 2 2 2 2 2 RTC 1 1 1 1 1 1 1 USART 3 3 3 3 3 3 3 UART 2 2 2 2 2 2 2 I2C 2 2 2 2 2 2 2 3 3 3 3 3 3 3 (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) (0-2) CAN 1 1 1 1 1 1 1 USBD 1 1 1 1 1 1 1 SPI 2 2 2 2 2 2 2 (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) (1-2) 1 1 1 1 1 1 1 GPIO 112 112 112 112 112 112 112 EXMC 1 1 1 1 1 1 1 EXTI 16 16 16 16 16 16 16 Units 3 3 3 3 3 3 3 Channels 21 21 21 21 21 21 21 2 2 2 2 2 2 2 I2S ADC SDIO DAC Package LQFP144 8 GD32F103xx Datasheet 2.2. Block diagram Figure 2-1. GD32F103x4/6/8/B block diagram TPIU SW/JTAG Flash Memory Controller Ibus Flash Memory PLL Fmax: 108MHz Dbus FMC Master DMA0 7chs AHB Matrix: Fmax = 108MHz NVIC ICode DCode System ARM Cortex-M3 Processor Fmax: 108MHz POR/PDR Master EXMC Slave Slave LDO 1.2V RCU AHB Peripherals Slave Slave CRC SRAM Controller AHB to APB Bridge 2 IRC 8MHz SRAM HXTAL 4-16MHz AHB to APB Bridge 1 LVD Interrput request CAN0 USART0 Slave 12-bit SAR ADC Slave WWDGT ADC0 TIMER1 ADC1 TIMER2 GPIOA TIMER3 GPIOB GPIOC GPIOD APB1: Fmax = 54MHz SPI0 APB2: Fmax = 108MHz Powered By V DDA Powered By V DDA SPI1 USART1 USART2 GPIOE I2C0 TIMER0 I2C1 EXTI USBD FWDGT RTC 9 GD32F103xx Datasheet Figure 2-2. GD32F103xC/D/E/F/G/I/K block diagram POR/PDR TPIU SW/JTAG DMA0 7chs DMA1 5chs Ibus Dbus Master Master AHB Matrix: Fmax = 108MHz NVIC ICode DCode System ARM Cortex-M3 Processor Fmax: 108MHz PLL Master Flash Memory Controller 1 Flash Memory Flash Memory Controller 2 Flash Memory FMC CRC Fmax: 108MHz LDO 1.2V RCU IRC 8MHz AHB Peripherals Slave EXMC HXTAL 4-16MHz Slave Slave SRAM Controller SRAM SDIO LVD Slave Slave AHB to APB Bridge 2 AHB to APB Bridge 1 Powered By V DDA Interrput request CAN0 USART0 Slave SPI0 Slave WWDGT TIMER1 ADC0 12-bit SAR ADC GPIOB GPIOC APB1: Fmax = 54MHz GPIOA TIMER3 APB2: Fmax = 108MHz ADC2 Powered By V DDA TIMER2 ADC1 TIMER4 TIMER11 TIMER12 TIMER13 GPIOD SPI1/I2S1 GPIOE SPI2/I2S2 GPIOF USART1 GPIOG USART2 TIMER0 UART3 TIMER7 UART4 TIMER8 I2C0 TIMER9 TIMER5 I2C1 TIMER10 TIMER6 USBD EXTI DAC0 DAC1 FWDGT RTC : Blocks are available in GD32F103xF/G/I/K devices 10 GD32F103xx Datasheet 2.3. Pinouts and pin assignment Figure 2-3. GD32F103Zx LQFP144 pinouts PA14 PA15 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 VSS_10 VDD_10 PD6 PD7 PG9 PG10 PG11 PG12 PG13 PG14 VSS_11 VDD_11 PG15 PB4 PB3 PB5 PB6 PB7 BOOT0 PB8 PB9 PE0 PE1 VSS_3 VDD_3 144143142141140139138137136135134133 132131130129128127126125124123122121120 119118117116115114113112111110109 PE2 1 108 PE3 PE4 2 107 VSS_2 3 106 NC PE5 PE6 4 105 PA13 5 104 PA12 VBAT 6 103 PA11 PC13-TAMPER-RTC PC14-OSC32IN 7 102 PA10 8 101 PA9 PC15-OSC32OUT 9 100 PA8 PF0 10 99 PC9 PF1 11 98 PC8 PF2 12 97 PC7 PF3 PF4 13 96 PC6 14 95 VDD_9 VDD_2 PF5 15 94 VSS_9 VSS_5 16 93 PG8 VDD_5 17 92 PG7 91 PG6 90 PG5 89 PG4 GigaDevice GD32F103Zx LQFP144 PF6 18 PF7 19 PF8 20 PF9 21 88 PG3 PF10 22 87 PG2 OSCIN 23 86 PD15 OSCOUT 24 85 PD14 NRST 25 84 VDD_8 PC0 26 83 VSS_8 PC1 27 82 PD13 PC2 28 81 PD12 PC3 VSSA 29 80 PD11 30 79 PD10 VREFVREF+ 31 78 PD9 32 77 PD8 VDDA 33 76 PB15 PA0_WKUP 34 75 PB14 PA1 35 74 PB13 PA2 36 73 PB12 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 VDD_1 VSS_1 PB11 PB10 PE15 PE13 PE14 PE12 PE11 VDD_7 PE10 VSS_7 PE8 PE9 PE7 PG1 PG0 PF15 PF14 VDD_6 PF13 VSS_6 PF12 PB2 PF11 PB1 PC5 PB0 PA7 PC4 PA6 PA5 VDD_4 PA4 VSS_4 PA3 11 GD32F103xx Datasheet Figure 2-4. GD32F103Vx LQFP100 pinouts PA14 PA15 PC10 PC11 PC12 PD0 PD1 PD2 PD3 PD4 PD5 PD6 PD7 PB4 PB3 PB5 PB6 PB7 BOOT0 PB8 PB9 PE0 PE1 VSS_3 VDD_3 PE2 1 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 PE3 PE4 2 74 VSS_2 3 73 NC PE5 PE6 4 72 PA13 5 71 PA12 VBAT 6 PC13-TAMPER-RTC PC14-OSC32IN 7 70 69 PA10 8 68 PA9 PC15-OSC32OUT 9 67 PA8 VSS_5 10 66 PC9 VDD_5 11 65 PC8 64 PC7 63 PC6 14 62 PD15 OSCIN 12 GigaDevice GD32F103Vx LQFP100 VDD_2 PA11 OSCOUT NRST PC0 13 15 61 PD14 PC1 16 60 PD13 PC2 PC3 17 59 PD12 18 58 PD11 VSSA 19 57 PD10 VREFVREF+ 20 56 PD9 21 55 PD8 VDDA 22 54 PB15 PA0-WKUP 23 53 PB14 PA1 24 52 PB13 PA2 25 51 PB12 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 VSS_1 VDD_1 PB11 PB10 PE15 PE14 PE13 PE11 PE12 PE10 PE9 PE8 PE7 PB2 PB1 PC5 PB0 PA7 PC4 PA6 PA5 PA4 VDD_4 PA3 VSS_4 12 GD32F103xx Datasheet Figure 2-5. GD32F103Rx LQFP64 pinouts PA14 PA15 PC10 PC11 PD2 PC12 PB3 PB4 PB5 PB6 PB7 BOOT0 PB8 PB9 VSS_3 VDD_3 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 VBAT 1 48 VDD_2 PC13-TAMPER-RTC 2 47 VSS_2 PC14-OSC32IN 3 46 PA13 PC15-OSC32OUT PD0-OSCIN 4 45 PA12 5 44 PA11 PD1 OSCOUT 6 43 PA10 NRST PC0 7 42 PA9 PC1 9 PC2 PC3 VSSA GigaDevice GD32F103Rx LQFP64 41 PA8 40 PC9 10 39 PC8 11 38 PC7 12 37 PC6 VDDA 13 36 PB15 PA0-WKUP 14 35 PB14 PA1 15 34 PB13 PA2 16 33 PB12 8 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 PA15 PA14 VDD_1 PB2 VSS_1 PB1 PB11 PB0 PB3 PB10 PC5 PB4 PC4 PA7 PA6 PA5 PA4 VDD_4 VSS_4 PA3 Figure 2-6. GD32F103Cx LQFP48 pinouts PB5 PB6 PB7 BOOT0 PB8 PB9 VSS_3 VDD_3 48 47 46 45 44 43 42 41 40 39 38 37 VBAT 1 36 VDD_2 PC13-TAMPER-RTC 2 35 VSS_2 PC14-OSC32IN 3 34 PA13 PC15-OSC32OUT PD0-OSCIN 4 33 PA12 5 32 PA11 PD1-OSCOUT NRST VSSA 6 31 PA10 30 PA9 8 29 VDDA 9 28 PA8 PB15 PA0-WKUP 10 27 PB14 PA1 PA2 11 26 PB13 25 PB12 GigaDevice GD32F103Cx LQFP48 7 12 13 14 15 16 17 18 19 20 21 22 23 24 VSS_1 VDD_1 PB11 PB10 PB2 PB1 PA7 PB0 PA6 PA5 PA4 PA3 13 GD32F103xx Datasheet Figure 2-7. GD32F103Tx QFN36 pinouts PA2 PA14 PA1 PA15 PA0-WKUP PB3 PB4 VDDA PB5 OSCOUT/PD1 NRST VSSA PB6 OSCIN/PD0 PB7 BOOT0 VSS_3 VDD_3 36 35 34 33 32 31 30 29 28 1 27 2 26 VDD_2 3 25 PA13 24 5 GigaDevice GD32F103Tx 23 QFN36 6 22 7 21 PA12 PA9 8 PA8 4 20 9 19 10 11 12 13 14 15 16 17 18 VSS_2 PA11 PA10 VDD_1 VSS_1 PB2 PB1 PB0 PA7 PA6 PA5 PA4 PA3 14 GD32F103xx Datasheet 2.4. Memory map Table 2-4. GD32F103xx memory map Pre-defined Regions Bus External device AHB Address Peripherals 0xA000 0000 - 0xA000 0FFF EXMC - SWREG 0x9000 0000 - 0x9FFF FFFF EXMC - PC CARD 0x7000 0000 - 0x8FFF FFFF EXMC - NAND 0x6000 0000 - 0x6FFF FFFF NOR/PSRAM/SRA External RAM EXMC - M Peripheral AHB 0x5000 0000 - 0x5003 FFFF Reserved 0x4008 0000 - 0x4FFF FFFF Reserved 0x4004 0000 - 0x4007 FFFF Reserved 0x4002 BC00 - 0x4003 FFFF Reserved 0x4002 B000 - 0x4002 BBFF Reserved 0x4002 A000 - 0x4002 AFFF Reserved 0x4002 8000 - 0x4002 9FFF Reserved 0x4002 6800 - 0x4002 7FFF Reserved 0x4002 6400 - 0x4002 67FF Reserved 0x4002 6000 - 0x4002 63FF Reserved 0x4002 5000 - 0x4002 5FFF Reserved 0x4002 4000 - 0x4002 4FFF Reserved 0x4002 3C00 - 0x4002 3FFF Reserved 0x4002 3800 - 0x4002 3BFF Reserved 0x4002 3400 - 0x4002 37FF Reserved 0x4002 3000 - 0x4002 33FF CRC 0x4002 2C00 - 0x4002 2FFF Reserved 0x4002 2800 - 0x4002 2BFF Reserved 0x4002 2400 - 0x4002 27FF Reserved 0x4002 2000 - 0x4002 23FF FMC 0x4002 1C00 - 0x4002 1FFF Reserved 0x4002 1800 - 0x4002 1BFF Reserved 0x4002 1400 - 0x4002 17FF Reserved 0x4002 1000 - 0x4002 13FF RCU 0x4002 0C00 - 0x4002 0FFF Reserved 0x4002 0800 - 0x4002 0BFF Reserved 0x4002 0400 - 0x4002 07FF DMA1 0x4002 0000 - 0x4002 03FF DMA0 0x4001 8400 - 0x4001 FFFF Reserved 0x4001 8000 - 0x4001 83FF SDIO 15 GD32F103xx Datasheet Pre-defined Regions Bus APB2 APB1 Address Peripherals 0x4001 7C00 - 0x4001 7FFF Reserved 0x4001 7800 - 0x4001 7BFF Reserved 0x4001 7400 - 0x4001 77FF Reserved 0x4001 7000 - 0x4001 73FF Reserved 0x4001 6C00 - 0x4001 6FFF Reserved 0x4001 6800 - 0x4001 6BFF Reserved 0x4001 5C00 - 0x4001 67FF Reserved 0x4001 5800 - 0x4001 5BFF Reserved 0x4001 5400 - 0x4001 57FF TIMER10 0x4001 5000 - 0x4001 53FF TIMER9 0x4001 4C00 - 0x4001 4FFF TIMER8 0x4001 4800 - 0x4001 4BFF Reserved 0x4001 4400 - 0x4001 47FF Reserved 0x4001 4000 - 0x4001 43FF Reserved 0x4001 3C00 - 0x4001 3FFF ADC2 0x4001 3800 - 0x4001 3BFF USART0 0x4001 3400 - 0x4001 37FF TIMER7 0x4001 3000 - 0x4001 33FF SPI0 0x4001 2C00 - 0x4001 2FFF TIMER0 0x4001 2800 - 0x4001 2BFF ADC1 0x4001 2400 - 0x4001 27FF ADC0 0x4001 2000 - 0x4001 23FF GPIOG 0x4001 1C00 - 0x4001 1FFF GPIOF 0x4001 1800 - 0x4001 1BFF GPIOE 0x4001 1400 - 0x4001 17FF GPIOD 0x4001 1000 - 0x4001 13FF GPIOC 0x4001 0C00 - 0x4001 0FFF GPIOB 0x4001 0800 - 0x4001 0BFF GPIOA 0x4001 0400 - 0x4001 07FF EXTI 0x4001 0000 - 0x4001 03FF AFIO 0x4000 CC00 - 0x4000 FFFF Reserved 0x4000 C800 - 0x4000 CBFF Reserved 0x4000 C400 - 0x4000 C7FF Reserved 0x4000 C000 - 0x4000 C3FF Reserved 0x4000 8000 - 0x4000 BFFF Reserved 0x4000 7C00 - 0x4000 7FFF Reserved 0x4000 7800 - 0x4000 7BFF Reserved 0x4000 7400 - 0x4000 77FF DAC 0x4000 7000 - 0x4000 73FF PMU 0x4000 6C00 - 0x4000 6FFF BKP 16 GD32F103xx Datasheet Pre-defined Regions Bus Address Peripherals 0x4000 6800 - 0x4000 6BFF Reserved 0x4000 6400 - 0x4000 67FF CAN0 0x4000 6000 - 0x4000 63FF SRAM Code AHB AHB Shared USBD/CAN SRAM 512 bytes 0x4000 5C00 - 0x4000 5FFF USBD 0x4000 5800 - 0x4000 5BFF I2C1 0x4000 5400 - 0x4000 57FF I2C0 0x4000 5000 - 0x4000 53FF UART4 0x4000 4C00 - 0x4000 4FFF UART3 0x4000 4800 - 0x4000 4BFF USART2 0x4000 4400 - 0x4000 47FF USART1 0x4000 4000 - 0x4000 43FF Reserved 0x4000 3C00 - 0x4000 3FFF SPI2/I2S2 0x4000 3800 - 0x4000 3BFF SPI1/I2S1 0x4000 3400 - 0x4000 37FF Reserved 0x4000 3000 - 0x4000 33FF FWDGT 0x4000 2C00 - 0x4000 2FFF WWDGT 0x4000 2800 - 0x4000 2BFF RTC 0x4000 2400 - 0x4000 27FF Reserved 0x4000 2000 - 0x4000 23FF TIMER13 0x4000 1C00 - 0x4000 1FFF TIMER12 0x4000 1800 - 0x4000 1BFF TIMER11 0x4000 1400 - 0x4000 17FF TIMER6 0x4000 1000 - 0x4000 13FF TIMER5 0x4000 0C00 - 0x4000 0FFF TIMER4 0x4000 0800 - 0x4000 0BFF TIMER3 0x4000 0400 - 0x4000 07FF TIMER2 0x4000 0000 - 0x4000 03FF TIMER1 0x2007 0000 - 0x3FFF FFFF Reserved 0x2006 0000 - 0x2006 FFFF Reserved 0x2003 0000 - 0x2005 FFFF Reserved 0x2002 0000 - 0x2002 FFFF Reserved 0x2001 C000 - 0x2001 FFFF Reserved 0x2001 8000 - 0x2001 BFFF Reserved 0x2000 0000 - 0x2001 7FFF SRAM 0x1FFF F810 - 0x1FFF FFFF Reserved 0x1FFF F800 - 0x1FFF F80F Option Bytes 0x1FFF B000 - 0x1FFF F7FF Boot loader 0x1FFF 7A10 - 0x1FFF AFFF Reserved 0x1FFF 7800 - 0x1FFF 7A0F Reserved 17 GD32F103xx Datasheet Pre-defined Regions Bus Address Peripherals 0x1FFF 0000 - 0x1FFF 77FF Reserved 0x1FFE C010 - 0x1FFE FFFF Reserved 0x1FFE C000 - 0x1FFE C00F Reserved 0x1001 0000 - 0x1FFE BFFF Reserved 0x1000 0000 - 0x1000 FFFF Reserved 0x083C 0000 - 0x0FFF FFFF Reserved 0x0830 0000 - 0x083B FFFF Reserved 0x0800 0000 - 0x082F FFFF Main Flash 0x0030 0000 - 0x07FF FFFF Reserved 0x0000 0000 - 0x002F FFFF Aliased to Main Flash or Boot loader 18 GD32F103xx Datasheet 2.5. Clock tree Figure 2-8. GD32F103xx clock tree USBD Prescaler ÷1,1.5,2,2.5 CK_USBD 48 MHz (to USBD) CK_I2S I2S enable (to I2S1,2) CK_SDIO SCS[1:0] SDIO enable (to SDIO) CK_EXMC CK_IRC8M 00 8 MHz IRC8M 1 ×2,3,4 …,32 PLL PLLSEL PLLMF 0 /2 CK_PLL 10 (to EXMC) EXMC enable CK_SYS 108 MHz max AHB Prescaler ÷1,2...512 CK_AHB 108 MHz max HCLK AHB enable (to AHB bus,Cortex-M3,SRAM,DMA,FMC) 01 CK_CST ÷8 (to Cortex-M3 SysTick) Clock Monitor /1 or /2 4-16 MHz HXTAL FCLK (free running clock) TIMER1,2,3,4,5,6, 11,12,13 if(APB1 prescale =1)x1 else x 2 CK_HXTAL PREDV0 CK_TIMERx TIMERx enable to TIMER1,2,3,4, 5,6,11,12,13 11 /128 32.768 KHz LXTAL CK_RTC 01 (to RTC) APB1 Prescaler ÷1,2,4,8,16 CK_APB1 PCLK1 54 MHz max to APB1 peripherals 10 RTCSRC[1:0] 40 KHz IRC40K CK_OUT0 Peripheral enable CK_FWDGT (to FWDGT) 0xx 100 101 110 111 NO CLK CK_SYS CK_IRC8M CK_HXTAL /2 CK_PLL TIMER0,7,8,9,10 if(APB2 prescale =1)x1 else x 2 APB2 Prescaler ÷1,2,4,8,16 CK_TIMERx TIMERx enable to TIMER0,7,8,9,10 CK_APB2 PCLK2 108 MHz max Peripheral enable ADC Prescaler ÷2,4,8,12,16 to APB2 peripherals CK_ADCX to ADC0,ADC1,ADC2 14 MHz max CKOUT0SEL[2:0] Legend: HXTAL: High speed external clock LXTAL: Low speed external clock IRC8M: High speed internal clock IRC40K: Low speed internal clock 19 GD32F103xx Datasheet 2.6. Pin definitions 2.6.1. GD32F103Zx LQFP144 pin definitions Table 2-5. GD32F103Zx LQFP144 pin definitions Pin I/O Type(1) Level(2) 1 I/O 5VT PE3 2 I/O 5VT PE4 3 I/O 5VT PE5 4 I/O 5VT Pin Name Pins PE2 Functions description Default: PE2 Alternate: TRACECK, EXMC_A23 Default: PE3 Alternate: TRACED0, EXMC_A19 Default: PE4 Alternate:TRACED1, EXMC_A20 Default: PE5 Alternate:TRACED2, EXMC_A21 Remap: TIMER8_CH0(3) Default: PE6 PE6 5 I/O 5VT Alternate:TRACED3, EXMC_A22 Remap: TIMER8_CH1(3) VBAT Default: VBAT 6 P 7 I/O 8 I/O 9 I/O PF0 10 I/O 5VT PF1 11 I/O 5VT PF2 12 I/O 5VT PF3 13 I/O 5VT PF4 14 I/O 5VT PF5 15 I/O 5VT VSS_5 16 P Default: VSS_5 VDD_5 17 P Default: VDD_5 PF6 18 I/O PC13TAMPER- Default: PC13 Alternate: TAMPER-RTC RTC PC14OSC32IN PC15OSC32OUT Default: PC14 Alternate: OSC32IN Default: PC15 Alternate: OSC32OUT Default: PF0 Alternate: EXMC_A0 Default: PF1 Alternate: EXMC_A1 Default: PF2 Alternate: EXMC_A2 Default: PF3 Alternate: EXMC_A3 Default: PF4 Alternate: EXMC_A4 Default: PF5 Alternate: EXMC_A5 Default: PF6 Alternate: ADC2_IN4, EXMC_NIORD 20 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Remap: TIMER9_CH0(3) Default: PF7 PF7 19 I/O Alternate: ADC2_IN5, EXMC_NREG Remap: TIMER10_CH0(3) Default: PF8 PF8 20 I/O Alternate: ADC2_IN6, EXMC_NIOWR Remap: TIMER12_CH0(3) Default: PF9 PF9 21 I/O Alternate: ADC2_IN7, EXMC_CD Remap: TIMER13_CH0(3) Default: PF10 PF10 22 I/O OSCIN 23 I OSCOUT 24 O NRST 25 I/O PC0 26 I/O PC1 27 I/O PC2 28 I/O PC3 29 I/O VSSA 30 P Default: VSSA VREF- 31 P Default: VREF- VREF+ 32 P Default: VREF+ VDDA 33 P Default: VDDA PA0-WKUP 34 I/O Alternate: ADC2_IN8, EXMC_INTR Default: OSCIN Remap: PD0 Default: OSCOUT Remap: PD1 Default: NRST Default: PC0 Alternate: ADC012_IN10 Default: PC1 Alternate: ADC012_IN11 Default: PC2 Alternate: ADC012_IN12 Default: PC3 Alternate: ADC012_IN13 Default: PA0 Alternate: WKUP, USART1_CTS, ADC012_IN0, TIMER1_CH0, TIMER1_ETI, TIMER4_CH0, TIMER7_ETI Default: PA1 PA1 35 I/O Alternate: USART1_RTS, ADC012_IN1, TIMER1_CH1, TIMER4_CH1 Default: PA2 PA2 36 I/O Alternate: USART1_TX, ADC012_IN2, TIMER1_CH2, TIMER4_CH2, TIMER8_CH0(3) Default: PA3 PA3 37 I/O Alternate: USART1_RX, ADC012_IN3, TIMER1_CH3, TIMER4_CH3, TIMER8_CH1(3) VSS_4 38 P Default: VSS_4 21 GD32F103xx Datasheet Pin Name Pins VDD_4 39 Pin I/O Type(1) Level(2) Functions description Default: VDD_4 P Default: PA4 PA4 40 Alternate: SPI0_NSS, USART1_CK, ADC01_IN4, I/O DAC_OUT0 Remap:SPI2_NSS, I2S2_WS PA5 41 Default: PA5 I/O Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1 Default: PA6 PA6 42 Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0, I/O TIMER7_BRKIN, TIMER12_CH0(3) Remap: TIMER0_BRKIN Default: PA7 PA7 43 Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1, I/O TIMER7_CH0_ON, TIMER13_CH0(3) Remap: TIMER0_CH0_ON PC4 44 I/O PC5 45 I/O PB0 46 I/O Default: PC4 Alternate: ADC01_IN14 Default: PC5 Alternate: ADC01_IN15 Default: PB0 Alternate: ADC01_IN8, TIMER2_CH2, TIMER7_CH1_ON Remap: TIMER0_CH1_ON Default: PB1 PB1 47 Alternate: ADC01_IN9, TIMER2_CH3, TIMER7_CH2_ON I/O Remap: TIMER0_CH2_ON Default: PB2, BOOT1 PB2 48 I/O 5VT PF11 49 I/O 5VT PF12 50 I/O 5VT VSS_6 51 P Default: VSS_6 VDD_6 52 P Default: VDD_6 PF13 53 I/O 5VT PF14 54 I/O 5VT PF15 55 I/O 5VT PG0 56 I/O 5VT PG1 57 I/O 5VT Default: PF11 Alternate: EXMC_NIOS16 Default: PF12 Alternate: EXMC_A6 Default: PF13 Alternate: EXMC_A7 Default: PF14 Alternate: EXMC_A8 Default: PF15 Alternate: EXMC_A9 Default: PG0 Alternate: EXMC_A10 Default: PG1 Alternate: EXMC_A11 22 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Default: PE7 PE7 58 I/O 5VT Alternate: EXMC_D4 Remap: TIMER0_ETI Default: PE8 PE8 59 I/O 5VT Alternate: EXMC_D5 Remap: TIMER0_CH0_ON Default: PE9 PE9 60 I/O 5VT Alternate: EXMC_D6 Remap: TIMER0_CH0 VSS_7 61 P Default: VSS_7 VDD_7 62 P Default: VDD_7 PE10 63 I/O Default: PE10 5VT Alternate: EXMC_D7 Remap: TIMER0_CH1_ON Default: PE11 PE11 64 I/O 5VT Alternate: EXMC_D8 Remap: TIMER0_CH1 Default: PE12 PE12 65 I/O 5VT Alternate: EXMC_D9 Remap: TIMER0_CH2_ON Default: PE13 PE13 66 I/O 5VT Alternate: EXMC_D10 Remap: TIMER0_CH2 Default: PE14 PE14 67 I/O 5VT Alternate: EXMC_D11 Remap: TIMER0_CH3 Default: PE15 PE15 68 I/O 5VT Alternate: EXMC_D12 Remap: TIMER0_BRKIN Default: PB10 PB10 69 I/O 5VT Alternate: I2C1_SCL, USART2_TX Remap: TIMER1_CH2 Default: PB11 PB11 70 I/O 5VT Alternate: I2C1_SDA, USART2_RX Remap: TIMER1_CH3 VSS_1 71 P Default: VSS_1 VDD_1 72 P Default: VDD_1 Default: PB12 PB12 73 I/O 5VT Alternate: SPI1_NSS, I2C1_SMBA, USART2_CK, TIMER0_BRKIN, I2S1_WS Default: PB13 PB13 74 I/O 5VT Alternate: SPI1_SCK, USART2_CTS, TIMER0_CH0_ON, I2S1_CK 23 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Default: PB14 PB14 75 I/O 5VT Alternate: SPI1_MISO, USART2_RTS, TIMER0_CH1_ON, TIMER11_CH0(3) Default: PB15 PB15 76 I/O 5VT Alternate: SPI1_MOSI, TIMER0_CH2_ON, I2S1_SD, TIMER11_CH1(3) Default: PD8 PD8 77 I/O 5VT Alternate: EXMC_D13 Remap: USART2_TX Default: PD9 PD9 78 I/O 5VT Alternate: EXMC_D14 Remap: USART2_RX Default: PD10 PD10 79 I/O 5VT Alternate: EXMC_D15 Remap: USART2_CK Default: PD11 PD11 80 I/O 5VT Alternate: EXMC_A16 Remap: USART2_CTS Default: PD12 PD12 81 I/O 5VT Alternate: EXMC_A17 Remap: TIMER3_CH0, USART2_RTS Default: PD13 PD13 82 I/O 5VT Alternate: EXMC_A18 Remap: TIMER3_CH1 VSS_8 83 P Default: VSS_8 VDD_8 84 P Default: VDD_8 PD14 85 I/O Default: PD14 5VT Alternate: EXMC_D0 Remap: TIMER3_CH2 Default: PD15 PD15 86 I/O 5VT Alternate: EXMC_D1 Remap: TIMER3_CH3 PG2 87 I/O 5VT PG3 88 I/O 5VT PG4 89 I/O 5VT PG5 90 I/O 5VT PG6 91 I/O 5VT PG7 92 I/O 5VT Default: PG2 Alternate: EXMC_A12 Default: PG3 Alternate: EXMC_A13 Default: PG4 Alternate: EXMC_A14 Default: PG5 Alternate: EXMC_A15 Default: PG6 Alternate: EXMC_INT1 Default: PG7 24 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Alternate: EXMC_INT2 5VT Default: PG8 PG8 93 I/O VSS_9 94 P Default: VSS_9 VDD_9 95 P Default: VDD_9 Default: PC6 PC6 96 I/O 5VT Alternate: I2S1_MCK, TIMER7_CH0, SDIO_D6 Remap: TIMER2_CH0 Default: PC7 PC7 97 I/O 5VT Alternate: I2S2_MCK, TIMER7_CH1, SDIO_D7 Remap: TIMER2_CH1 Default: PC8 PC8 98 I/O 5VT Alternate: TIMER7_CH2, SDIO_D0 Remap: TIMER2_CH2 Default: PC9 PC9 99 I/O 5VT Alternate: TIMER7_CH3, SDIO_D1 Remap: TIMER2_CH3 PA8 100 I/O 5VT PA9 101 I/O 5VT PA10 102 I/O 5VT Default: PA8 Alternate: USART0_CK, TIMER0_CH0, CK_OUT0 Default: PA9 Alternate: USART0_TX, TIMER0_CH1 Default: PA10 Alternate: USART0_RX, TIMER0_CH2 Default: PA11 PA11 103 I/O 5VT Alternate: USART0_CTS, CAN0_RX, USBDM, TIMER0_CH3 Default: PA12 PA12 104 I/O 5VT PA13 105 I/O 5VT NC 106 VSS_2 107 P Default: VSS_2 VDD_2 108 P Default: VDD_2 PA14 109 I/O 5VT PA15 110 I/O 5VT Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI, USBDP Default: JTMS, SWDIO Remap: PA13 - Default: JTCK, SWCLK Remap: PA14 Default: JTDI Alternate: SPI2_NSS, I2S2_WS Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS Default: PC10 PC10 111 I/O 5VT Alternate: UART3_TX, SDIO_D2 Remap: USART2_TX, SPI2_SCK, I2S2_CK PC11 112 I/O 5VT Default: PC11 Alternate: UART3_RX, SDIO_D3 25 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Remap: USART2_RX, SPI2_MISO Default: PC12 PC12 113 I/O 5VT Alternate: UART4_TX, SDIO_CK Remap: USART2_CK, SPI2_MOSI, I2S2_SD Default: PD0 PD0 114 I/O 5VT Alternate: EXMC_D2 Remap: CAN0_RX, OSCIN Default: PD1 PD1 115 I/O 5VT Alternate: EXMC_D3 Remap: CAN0_TX, OSCOUT PD2 116 I/O 5VT PD3 117 I/O 5VT Default: PD2 Alternate: TIMER2_ETI, SDIO_CMD, UART4_RX Default: PD3 Alternate: EXMC_CLK Remap: USART1_CTS Default: PD4 PD4 118 I/O 5VT Alternate: EXMC_NOE Remap: USART1_RTS Default: PD5 PD5 119 I/O 5VT Alternate: EXMC_NWE Remap: USART1_TX VSS_10 120 Default: VSS_10 VDD_10 121 Default: VDD_10 Default: PD6 PD6 122 I/O 5VT Alternate: EXMC_NWAIT Remap: USART1_RX Default: PD7 PD7 123 I/O 5VT Alternate: EXMC_NE0, EXMC_NCE1 Remap: USART1_CK PG9 124 I/O 5VT PG10 125 I/O 5VT PG11 126 I/O 5VT PG12 127 I/O 5VT PG13 128 I/O 5VT PG14 129 I/O 5VT VSS_11 130 P Default: PG9 Alternate: EXMC_NE1, EXMC_NCE2 Default: PG10 Alternate: EXMC_NCE3_0, EXMC_NE2 Default: PG11 Alternate: EXMC_NCE3_1 Default: PG12 Alternate: EXMC_NE3 Default: PG13 Alternate: EXMC_A24 Default: PG14 Alternate: EXMC_A25 Default: VSS_11 26 GD32F103xx Datasheet Pin I/O Type(1) Level(2) Pin Name Pins VDD_11 131 P PG15 132 I/O 5VT PB3 133 I/O 5VT Functions description Default: VDD_11 Default: PG15 Default: JTDO Alternate:SPI2_SCK, I2S2_CK Remap: PB3, TRACESWO, TIMER1_CH1, SPI0_SCK Default: NJTRST PB4 134 I/O 5VT Alternate: SPI2_MISO Remap: TIMER2_CH0, PB4, SPI0_MISO Default: PB5 PB5 135 Alternate: I2C0_SMBA, SPI2_MOSI, I2S2_SD I/O Remap: TIMER2_CH1, SPI0_MOSI Default: PB6 PB6 136 I/O 5VT Alternate: I2C0_SCL, TIMER3_CH0 Remap: USART0_TX Default: PB7 PB7 137 I/O 5VT Alternate: I2C0_SDA , TIMER3_CH1, EXMC_NADV Remap: USART0_RX BOOT0 138 I PB8 139 I/O Default: BOOT0 Default: PB8 5VT Alternate: TIMER3_CH2, SDIO_D4, TIMER9_CH0(3) Remap: I2C0_SCL, CAN0_RX Default: PB9 PB9 140 I/O 5VT Alternate: TIMER3_CH3, SDIO_D5, TIMER10_CH0(3) Remap: I2C0_SDA, CAN0_TX Default: PE0 PE0 141 I/O 5VT PE1 142 I/O 5VT VSS_3 143 P Default: VSS_3 VDD_3 144 P Default: VDD_3 Alternate: TIMER3_ETI, EXMC_NBL0 Default: PE1 Alternate: EXMC_NBL1 Notes: (1) Type: I = input, O = output, P = power. (2) I/O Level: 5VT = 5 V tolerant. (3) Functions are available in GD32F103ZF/G/I/K devices. 27 GD32F103xx Datasheet 2.6.2. GD32F103Vx LQFP100 pin definitions Table 2-6. GD32F103Vx LQFP100 pin definitions Pin I/O Type(1) Level(2) 1 I/O 5VT PE3 2 I/O 5VT PE4 3 I/O 5VT PE5 4 I/O 5VT Pin Name Pins PE2 Functions description Default: PE2 Alternate: TRACECK, EXMC_A23 Default: PE3 Alternate: TRACED0, EXMC_A19 Default: PE4 Alternate:TRACED1, EXMC_A20 Default: PE5 Alternate:TRACED2, EXMC_A21 Remap: TIMER8_CH0(3) Default: PE6 PE6 5 I/O 5VT Alternate:TRACED3, EXMC_A22 Remap: TIMER8_CH1(3) VBAT Default: VBAT 6 P 7 I/O 8 I/O 9 I/O VSS_5 10 P Default: VSS_5 VDD_5 11 P Default: VDD_5 OSCIN 12 I OSCOUT 13 O NRST 14 I/O PC0 15 I/O PC1 16 I/O PC2 17 I/O PC3 18 I/O VSSA 19 P Default: VSSA VREF- 20 P Default: VREF- VREF+ 21 P Default: VREF+ PC13TAMPERRTC PC14OSC32IN PC15OSC32OUT Default: PC13 Alternate: TAMPER-RTC Default: PC14 Alternate: OSC32IN Default: PC15 Alternate: OSC32OUT Default: OSCIN Remap: PD0 Default: OSCOUT Remap: PD1 Default: NRST Default: PC0 Alternate: ADC012_IN10(5) Default: PC1 Alternate: ADC012_IN11(5) Default: PC2 Alternate: ADC012_IN12(5) Default: PC3 Alternate: ADC012_IN13(5) 28 GD32F103xx Datasheet Pin Name Pins VDDA 22 Pin I/O Type(1) Level(2) Functions description Default: VDDA P Default: PA0 PA0-WKUP 23 Alternate: WKUP, USART1_CTS, ADC012_IN0(5), I/O TIMER1_CH0, TIMER1_ETI, TIMER4_CH0(4), TIMER7_ETI(4) Default: PA1 PA1 24 Alternate: USART1_RTS, ADC012_IN1(5), TIMER1_CH1, I/O TIMER4_CH1(4) Default: PA2 PA2 25 Alternate: USART1_TX, ADC012_IN2(5), TIMER1_CH2, I/O TIMER4_CH2(4), TIMER8_CH0(3) Default: PA3 PA3 26 Alternate: USART1_RX, ADC012_IN3(5), TIMER1_CH3, I/O TIMER4_CH3(4), TIMER8_CH1(3) VSS_4 27 P Default: VSS_4 VDD_4 28 P Default: VDD_4 Default: PA4 PA4 29 Alternate: SPI0_NSS, USART1_CK, ADC01_IN4, I/O DAC_OUT0(4) Remap:SPI2_NSS(4), I2S2_WS(4) PA5 30 Default: PA5 I/O Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1(4) Default: PA6 PA6 31 Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0, I/O TIMER7_BRKIN(4), TIMER12_CH0(3) Remap: TIMER0_BRKIN Default: PA7 PA7 32 Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1, I/O TIMER7_CH0_ON(4), TIMER13_CH0(3) Remap: TIMER0_CH0_ON PC4 33 I/O PC5 34 I/O Default: PC4 Alternate: ADC01_IN14 Default: PC5 Alternate: ADC01_IN15 Default: PB0 PB0 35 Alternate: ADC01_IN8, TIMER2_CH2, I/O TIMER7_CH1_ON(4) Remap: TIMER0_CH1_ON Default: PB1 PB1 36 Alternate: ADC01_IN9, TIMER2_CH3, I/O TIMER7_CH2_ON(4) Remap: TIMER0_CH2_ON PB2 37 I/O 5VT Default: PB2, BOOT1 29 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Default: PE7 PE7 38 I/O 5VT Alternate: EXMC_D4 Remap: TIMER0_ETI Default: PE8 PE8 39 I/O 5VT Alternate: EXMC_D5 Remap: TIMER0_CH0_ON Default: PE9 PE9 40 I/O 5VT Alternate: EXMC_D6 Remap: TIMER0_CH0 VSS_7 - P Default: VSS_7 VDD_7 - P Default: VDD_7 PE10 41 I/O Default: PE10 5VT Alternate: EXMC_D7 Remap: TIMER0_CH1_ON Default: PE11 PE11 42 I/O 5VT Alternate: EXMC_D8 Remap: TIMER0_CH1 Default: PE12 PE12 43 I/O 5VT Alternate: EXMC_D9 Remap: TIMER0_CH2_ON Default: PE13 PE13 44 I/O 5VT Alternate: EXMC_D10 Remap: TIMER0_CH2 Default: PE14 PE14 45 I/O 5VT Alternate: EXMC_D11 Remap: TIMER0_CH3 Default: PE15 PE15 46 I/O 5VT Alternate: EXMC_D12 Remap: TIMER0_BRKIN Default: PB10 PB10 47 I/O 5VT Alternate: I2C1_SCL, USART2_TX Remap: TIMER1_CH2 Default: PB11 PB11 48 I/O 5VT Alternate: I2C1_SDA, USART2_RX Remap: TIMER1_CH3 VSS_1 49 P Default: VSS_1 VDD_1 50 P Default: VDD_1 Default: PB12 PB12 51 I/O 5VT Alternate: SPI1_NSS, I2C1_SMBA, USART2_CK, TIMER0_BRKIN, I2S1_WS(4) Default: PB13 PB13 52 I/O 5VT Alternate: SPI1_SCK, USART2_CTS, TIMER0_CH0_ON, I2S1_CK(4) 30 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Default: PB14 PB14 53 I/O 5VT Alternate: SPI1_MISO, USART2_RTS, TIMER0_CH1_ON, TIMER11_CH0(3) Default: PB15 PB15 54 I/O 5VT Alternate: SPI1_MOSI, TIMER0_CH2_ON, I2S1_SD(4), TIMER11_CH1(3) Default: PD8 PD8 55 I/O 5VT Alternate: EXMC_D13 Remap: USART2_TX Default: PD9 PD9 56 I/O 5VT Alternate: EXMC_D14 Remap: USART2_RX Default: PD10 PD10 57 I/O 5VT Alternate: EXMC_D15 Remap: USART2_CK Default: PD11 PD11 58 I/O 5VT Alternate: EXMC_A16 Remap: USART2_CTS Default: PD12 PD12 59 I/O 5VT Alternate: EXMC_A17 Remap: TIMER3_CH0, USART2_RTS Default: PD13 PD13 60 I/O 5VT Alternate: EXMC_A18 Remap: TIMER3_CH1 Default: PD14 PD14 61 I/O 5VT Alternate: EXMC_D0 Remap: TIMER3_CH2 Default: PD15 PD15 62 I/O 5VT Alternate: EXMC_D1 Remap: TIMER3_CH3 Default: PC6 PC6 63 I/O 5VT Alternate: I2S1_MCK(4), TIMER7_CH0(4), SDIO_D6(4) Remap: TIMER2_CH0 Default: PC7 PC7 64 I/O 5VT Alternate: I2S2_MCK(4), TIMER7_CH1(4), SDIO_D7(4) Remap: TIMER2_CH1 Default: PC8 PC8 65 I/O 5VT Alternate: TIMER7_CH2(4), SDIO_D0(4) Remap: TIMER2_CH2 Default: PC9 PC9 66 I/O 5VT Alternate: TIMER7_CH3(4), SDIO_D1(4) Remap: TIMER2_CH3 PA8 67 I/O 5VT Default: PA8 31 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Alternate: USART0_CK, TIMER0_CH0, CK_OUT0 PA9 68 I/O 5VT PA10 69 I/O 5VT PA11 70 I/O 5VT Default: PA9 Alternate: USART0_TX, TIMER0_CH1 Default: PA10 Alternate: USART0_RX, TIMER0_CH2 Default: PA11 Alternate: USART0_CTS, CAN0_RX, USBDM, TIMER0_CH3 Default: PA12 PA12 71 I/O 5VT Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI, USBDP I/O 5VT Default: JTMS, SWDIO PA13 72 NC 73 VSS_2 74 P Default: VSS_2 VDD_2 75 P Default: VDD_2 PA14 76 I/O Remap: PA13 - 5VT Default: JTCK, SWCLK Remap: PA14 Default: JTDI PA15 77 I/O 5VT Alternate: SPI2_NSS(4), I2S2_WS(4) Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS Default: PC10 PC10 78 I/O 5VT Alternate: UART3_TX(4), SDIO_D2(4) Remap: USART2_TX, SPI2_SCK(4), I2S2_CK(4) Default: PC11 PC11 79 I/O 5VT Alternate: UART3_RX(4), SDIO_D3(4) Remap: USART2_RX, SPI2_MISO(4) Default: PC12 PC12 80 I/O 5VT Alternate: UART4_TX(4), SDIO_CK(4) Remap: USART2_CK, SPI2_MOSI(4), I2S2_SD(4) Default: PD0 PD0 81 I/O 5VT Alternate: EXMC_D2 Remap: CAN0_RX, OSCIN Default: PD1 PD1 82 I/O 5VT Alternate: EXMC_D3 Remap: CAN0_TX, OSCOUT PD2 83 I/O 5VT PD3 84 I/O 5VT Default: PD2 Alternate: TIMER2_ETI, SDIO_CMD(4), UART4_RX(4) Default: PD3 Alternate: EXMC_CLK Remap: USART1_CTS PD4 85 I/O 5VT Default: PD4 Alternate: EXMC_NOE 32 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Remap: USART1_RTS Default: PD5 PD5 86 I/O 5VT Alternate: EXMC_NWE Remap: USART1_TX Default: PD6 PD6 87 I/O 5VT Alternate: EXMC_NWAIT Remap: USART1_RX Default: PD7 PD7 88 I/O 5VT Alternate: EXMC_NE0, EXMC_NCE1 Remap: USART1_CK Default: JTDO PB3 89 I/O 5VT Alternate:SPI2_SCK(4), I2S2_CK(4) Remap: PB3, TRACESWO, TIMER1_CH1, SPI0_SCK Default: NJTRST PB4 90 I/O 5VT Alternate: SPI2_MISO(4) Remap: TIMER2_CH0, PB4, SPI0_MISO Default: PB5 PB5 91 Alternate: I2C0_SMBA, SPI2_MOSI(4), I2S2_SD(4) I/O Remap: TIMER2_CH1, SPI0_MOSI Default: PB6 PB6 92 I/O 5VT Alternate: I2C0_SCL, TIMER3_CH0 Remap: USART0_TX Default: PB7 PB7 93 I/O 5VT Alternate: I2C0_SDA , TIMER3_CH1, EXMC_NADV Remap: USART0_RX BOOT0 94 Default: BOOT0 I Default: PB8 PB8 95 I/O 5VT Alternate: TIMER3_CH2, SDIO_D4(4), TIMER9_CH0(3) Remap: I2C0_SCL, CAN0_RX Default: PB9 PB9 96 I/O 5VT Alternate: TIMER3_CH3, SDIO_D5(4), TIMER10_CH0(3) Remap: I2C0_SDA, CAN0_TX Default: PE0 PE0 97 I/O 5VT PE1 98 I/O 5VT VSS_3 99 P Default: VSS_3 VDD_3 100 P Default: VDD_3 Alternate: TIMER3_ETI, EXMC_NBL0 Default: PE1 Alternate: EXMC_NBL1 Notes: (1) Type: I = input, O = output, P = power. (2) I/O Level: 5VT = 5 V tolerant. (3) Functions are available in GD32F103VF/G/I/K devices. 33 GD32F103xx Datasheet (4) Functions are available in GD32F103VC/D/E/F/G/I/K devices. (5) ADC2 functions are available in GD32F103VC/D/E/F/G/I/K devices. 34 GD32F103xx Datasheet 2.6.3. GD32F103Rx LQFP64 pin definitions Table 2-7. GD32F103Rx LQFP64 pin definitions Pin I/O Type(1) Level(2) Pin Name Pins VBAT 1 P 2 I/O 3 I/O 4 I/O OSCIN 5 I OSCOUT 6 O NRST 7 I/O PC0 8 I/O PC1 9 I/O PC2 10 I/O PC3 11 I/O VSSA 12 P Default: VSSA VDDA 13 P Default: VDDA PC13TAMPERRTC PC14OSC32IN PC15OSC32OUT Functions description Default: VBAT Default: PC13 Alternate: TAMPER-RTC Default: PC14 Alternate: OSC32IN Default: PC15 Alternate: OSC32OUT Default: OSCIN Remap: PD0 Default: OSCOUT Remap: PD1 Default: NRST Default: PC0 Alternate: ADC012_IN10(5) Default: PC1 Alternate: ADC012_IN11(5) Default: PC2 Alternate: ADC012_IN12(5) Default: PC3 Alternate: ADC012_IN13(5) Default: PA0 PA0-WKUP 14 I/O Alternate: WKUP, USART1_CTS, ADC012_IN0(5), TIMER1_CH0, TIMER1_ETI, TIMER4_CH0(4), TIMER7_ETI(4) Default: PA1 PA1 15 I/O Alternate: USART1_RTS, ADC012_IN1(5), TIMER1_CH1, TIMER4_CH1(4) Default: PA2 PA2 16 I/O Alternate: USART1_TX, ADC012_IN2(5), TIMER1_CH2, TIMER4_CH2(4), TIMER8_CH0(3) Default: PA3 PA3 17 I/O Alternate: USART1_RX, ADC012_IN3(5), TIMER1_CH3, TIMER4_CH3(4), TIMER8_CH1(3) VSS_4 18 P Default: VSS_4 VDD_4 19 P Default: VDD_4 35 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Default: PA4 PA4 20 Alternate: SPI0_NSS, USART1_CK, ADC01_IN4, I/O DAC_OUT0(4) Remap:SPI2_NSS(4), I2S2_WS(4) PA5 21 Default: PA5 I/O Alternate: SPI0_SCK, ADC01_IN5, DAC_OUT1(4) Default: PA6 PA6 22 Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0, I/O TIMER7_BRKIN(4), TIMER12_CH0(3) Remap: TIMER0_BRKIN Default: PA7 PA7 23 Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1, I/O TIMER7_CH0_ON(4), TIMER13_CH0(3) Remap: TIMER0_CH0_ON PC4 24 I/O PC5 25 I/O PB0 26 I/O Default: PC4 Alternate: ADC01_IN14 Default: PC5 Alternate: ADC01_IN15 Default: PB0 Alternate: ADC01_IN8, TIMER2_CH2, TIMER7_CH1_ON(4) Remap: TIMER0_CH1_ON Default: PB1 PB1 27 Alternate: ADC01_IN9, TIMER2_CH3, TIMER7_CH2_ON(4) I/O Remap: TIMER0_CH2_ON PB2 28 I/O 5VT PB10 29 I/O 5VT Default: PB2, BOOT1 Default: PB10 Alternate: I2C1_SCL(6), USART2_TX(6) Remap: TIMER1_CH2 Default: PB11 5VT Alternate: I2C1_SDA(6), USART2_RX(6) PB11 30 I/O VSS_1 31 P Default: VSS_1 VDD_1 32 P Default: VDD_1 PB12 33 I/O Remap: TIMER1_CH3 Default: PB12 5VT Alternate: SPI1_NSS(6), I2C1_SMBA(6), USART2_CK(6), TIMER0_BRKIN, I2S1_WS(4) Default: PB13 PB13 34 I/O 5VT Alternate: SPI1_SCK(6), USART2_CTS(6), TIMER0_CH0_ON, I2S1_CK(4) Default: PB14 PB14 35 I/O 5VT Alternate: SPI1_MISO(6), USART2_RTS(6), TIMER0_CH1_ON, TIMER11_CH0(3) PB15 36 I/O 5VT Default: PB15 36 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Alternate: SPI1_MOSI(6), TIMER0_CH2_ON, I2S1_SD(4), TIMER11_CH1(3) Default: PC6 PC6 37 I/O 5VT Alternate: I2S1_MCK(4), TIMER7_CH0(4), SDIO_D6(4) Remap: TIMER2_CH0 Default: PC7 PC7 38 I/O 5VT Alternate: I2S2_MCK(4), TIMER7_CH1(4), SDIO_D7(4) Remap: TIMER2_CH1 Default: PC8 PC8 39 I/O 5VT Alternate: TIMER7_CH2(4), SDIO_D0(4) Remap: TIMER2_CH2 Default: PC9 PC9 40 I/O 5VT Alternate: TIMER7_CH3(4), SDIO_D1(4) Remap: TIMER2_CH3 PA8 41 I/O 5VT PA9 42 I/O 5VT PA10 43 I/O 5VT Default: PA8 Alternate: USART0_CK, TIMER0_CH0, CK_OUT0 Default: PA9 Alternate: USART0_TX, TIMER0_CH1 Default: PA10 Alternate: USART0_RX, TIMER0_CH2 Default: PA11 PA11 44 I/O 5VT Alternate: USART0_CTS, CAN0_RX, USBDM, TIMER0_CH3 Default: PA12 PA12 45 I/O 5VT PA13 46 I/O 5VT VSS_2 47 P Default: VSS_2 VDD_2 48 P Default: VDD_2 PA14 49 I/O 5VT PA15 50 I/O 5VT Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI, USBDP Default: JTMS, SWDIO Remap: PA13 Default: JTCK, SWCLK Remap: PA14 Default: JTDI Alternate: SPI2_NSS(4), I2S2_WS(4) Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS Default: PC10 PC10 51 I/O 5VT Alternate: UART3_TX(4), SDIO_D2(4) Remap: USART2_TX(6), SPI2_SCK(4), I2S2_CK(4) Default: PC11 PC11 52 I/O 5VT Alternate: UART3_RX(4), SDIO_D3(4) Remap: USART2_RX(6), SPI2_MISO(4) Default: PC12 PC12 53 I/O 5VT Alternate: UART4_TX(4), SDIO_CK(4) Remap: USART2_CK(6), SPI2_MOSI(4), I2S2_SD(4) 37 GD32F103xx Datasheet Pin Name Pins PD2 54 Pin I/O Type(1) Level(2) I/O 5VT Functions description Default: PD2 Alternate: TIMER2_ETI, SDIO_CMD(4), UART4_RX(4) Default: JTDO PB3 55 I/O 5VT Alternate:SPI2_SCK(4), I2S2_CK(4) Remap: PB3, TRACESWO, TIMER1_CH1, SPI0_SCK Default: NJTRST PB4 56 I/O 5VT Alternate: SPI2_MISO(4) Remap: TIMER2_CH0, PB4, SPI0_MISO Default: PB5 PB5 57 Alternate: I2C0_SMBA, SPI2_MOSI(4), I2S2_SD(4) I/O Remap: TIMER2_CH1, SPI0_MOSI Default: PB6 PB6 58 I/O 5VT Alternate: I2C0_SCL, TIMER3_CH0(6) Remap: USART0_TX Default: PB7 PB7 59 I/O BOOT0 60 I 5VT Alternate: I2C0_SDA , TIMER3_CH1(6), EXMC_NADV Remap: USART0_RX Default: BOOT0 Default: PB8 PB8 61 I/O 5VT Alternate: TIMER3_CH2(6), SDIO_D4(4), TIMER9_CH0(3) Remap: I2C0_SCL, CAN0_RX Default: PB9 PB9 62 I/O 5VT Alternate: TIMER3_CH3(6), SDIO_D5(4), TIMER10_CH0(3) Remap: I2C0_SDA, CAN0_TX VSS_3 63 P Default: VSS_3 VDD_3 64 P Default: VDD_3 Notes: (1) Type: I = input, O = output, P = power. (2) I/O Level: 5VT = 5 V tolerant. (3) Functions are available in GD32F103RF/G/I/K devices. (4) Functions are available in GD32F103RC/D/E/F/G/I/K devices. (5) ADC2 functions are available in GD32F103RC/D/E/F/G/I/K devices. (6) Functions are available in GD32F103R8/B/C/D/E/F/G/I/K devices. 38 GD32F103xx Datasheet 2.6.4. GD32F103Cx LQFP48 pin definitions Table 2-8. GD32F103Cx LQFP48 pin definitions Pin I/O Type(1) Level(2) Pin Name Pins VBAT 1 P 2 I/O 3 I/O 4 I/O OSCIN 5 I OSCOUT 6 O NRST 7 I/O VSSA 8 P Default: VSSA VDDA 9 P Default: VDDA PA0-WKUP 10 I/O PC13TAMPERRTC PC14OSC32IN PC15OSC32OUT Functions description Default: VBAT Default: PC13 Alternate: TAMPER-RTC Default: PC14 Alternate: OSC32IN Default: PC15 Alternate: OSC32OUT Default: OSCIN Remap: PD0 Default: OSCOUT Remap: PD1 Default: NRST Default: PA0 Alternate: WKUP, USART1_CTS, ADC012_IN0(3), TIMER1_CH0, TIMER1_ETI, TIMER4_CH0 PA1 11 I/O PA2 12 I/O PA3 13 I/O PA4 14 I/O PA5 15 I/O Default: PA1 Alternate: USART1_RTS, ADC012_IN1(3), TIMER1_CH1 Default: PA2 Alternate: USART1_TX, ADC012_IN2(3), TIMER1_CH2 Default: PA3 Alternate: USART1_RX, ADC012_IN3(3), TIMER1_CH3 Default: PA4 Alternate: SPI0_NSS, USART1_CK, ADC01_IN4 Default: PA5 Alternate: SPI0_SCK, ADC01_IN5 Default: PA6 PA6 16 I/O Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0 Remap: TIMER0_BRKIN Default: PA7 PA7 17 I/O Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1 Remap: TIMER0_CH0_ON Default: PB0 PB0 18 I/O Alternate: ADC01_IN8, TIMER2_CH2 Remap: TIMER0_CH1_ON PB1 19 I/O Default: PB1 Alternate: ADC01_IN9, TIMER2_CH3 39 GD32F103xx Datasheet Pin Name Pins Pin I/O Type(1) Level(2) Functions description Remap: TIMER0_CH2_ON PB2 20 I/O 5VT Default: PB2, BOOT1 Default: PB10 PB10 21 I/O 5VT Alternate: I2C1_SCL(4), USART2_TX(4) Remap: TIMER1_CH2 Default: PB11 PB11 22 I/O 5VT Alternate: I2C1_SDA(4), USART2_RX(4) Remap: TIMER1_CH3 VSS_1 23 P Default: VSS_1 VDD_1 24 P Default: VDD_1 Default: PB12 PB12 25 I/O 5VT Alternate: SPI1_NSS(4), I2C1_SMBA(4), USART2_CK(4), TIMER0_BRKIN Default: PB13 PB13 26 I/O 5VT Alternate: SPI1_SCK(4), USART2_CTS(4), TIMER0_CH0_ON Default: PB14 PB14 27 I/O 5VT Alternate: SPI1_MISO(4), USART2_RTS(4), TIMER0_CH1_ON PB15 28 I/O 5VT PA8 29 I/O 5VT PA9 30 I/O 5VT PA10 31 I/O 5VT PA11 32 I/O 5VT Default: PB15 Alternate: SPI1_MOSI(4), TIMER0_CH2_ON Default: PA8 Alternate: USART0_CK, TIMER0_CH0, CK_OUT0 Default: PA9 Alternate: USART0_TX, TIMER0_CH1 Default: PA10 Alternate: USART0_RX, TIMER0_CH2 Default: PA11 Alternate: USART0_CTS, CAN0_RX, USBDM, TIMER0_CH3 Default: PA12 PA12 33 I/O 5VT PA13 34 I/O 5VT VSS_2 35 P Default: VSS_2 VDD_2 36 P Default: VDD_2 PA14 37 I/O 5VT PA15 38 I/O 5VT PB3 39 I/O 5VT Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI, USBDP Default: JTMS, SWDIO Remap: PA13 Default: JTCK, SWCLK Remap: PA14 Default: JTDI Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS Default: JTDO Remap: PB3, TRACESWO, TIMER1_CH1, SPI0_SCK 40 GD32F103xx Datasheet Pin Name Pins PB4 40 Pin I/O Type(1) Level(2) I/O 5VT Functions description Default: NJTRST Remap: TIMER2_CH0, PB4, SPI0_MISO Default: PB5 PB5 41 Alternate: I2C0_SMBA I/O Remap: TIMER2_CH1, SPI0_MOSI Default: PB6 PB6 42 I/O 5VT Alternate: I2C0_SCL, TIMER3_CH0(4) Remap: USART0_TX Default: PB7 PB7 43 I/O 5VT Alternate: I2C0_SDA , TIMER3_CH1(4) Remap: USART0_RX BOOT0 44 I PB8 45 I/O Default: BOOT0 Default: PB8 5VT Alternate: TIMER3_CH2(4) Remap: I2C0_SCL, CAN0_RX Default: PB9 PB9 46 I/O 5VT Alternate: TIMER3_CH3(4) Remap: I2C0_SDA, CAN0_TX VSS_3 47 P Default: VSS_3 VDD_3 48 P Default: VDD_3 Notes: (1) Type: I = input, O = output, P = power. (2) I/O Level: 5VT = 5 V tolerant. (3) ADC2 functions are not available in GD32F103C4/6/8/B devices. (4) Functions are available in GD32F103C8/B devices. 41 GD32F103xx Datasheet 2.6.5. GD32F103Tx QFN36 pin definitions Table 2-9. GD32F103Tx QFN36 pin definitions Pin I/O Type(1) Level(2) Pin Name Pins Functions description OSCIN 2 I OSCOUT 3 O NRST 4 I/O VSSA 5 P Default: VSSA VDDA 6 P Default: VDDA Default: OSCIN Remap: PD0 Default: OSCOUT Remap: PD1 Default: NRST Default: PA0 PA0-WKUP 7 Alternate: WKUP, USART1_CTS, ADC012_IN0(3), I/O TIMER1_CH0, TIMER1_ETI PA1 8 I/O PA2 9 I/O PA3 10 I/O PA4 11 I/O PA5 12 I/O PA6 13 I/O Default: PA1 Alternate: USART1_RTS, ADC012_IN1(3), TIMER1_CH1 Default: PA2 Alternate: USART1_TX, ADC012_IN2(3), TIMER1_CH2 Default: PA3 Alternate: USART1_RX, ADC012_IN3(3), TIMER1_CH3 Default: PA4 Alternate: SPI0_NSS, USART1_CK, ADC01_IN4 Default: PA5 Alternate: SPI0_SCK, ADC01_IN5 Default: PA6 Alternate: SPI0_MISO, ADC01_IN6, TIMER2_CH0 Remap: TIMER0_BRKIN Default: PA7 PA7 14 Alternate: SPI0_MOSI, ADC01_IN7, TIMER2_CH1 I/O Remap: TIMER0_CH0_ON Default: PB0 PB0 15 Alternate: ADC01_IN8, TIMER2_CH2 I/O Remap: TIMER0_CH1_ON Default: PB1 PB1 16 Alternate: ADC01_IN9, TIMER2_CH3 I/O Remap: TIMER0_CH2_ON 5VT Default: PB2, BOOT1 PB2 17 I/O VSS_1 18 P Default: VSS_1 VDD_1 19 P Default: VDD_1 PA8 20 I/O 5VT PA9 21 I/O 5VT Default: PA8 Alternate: USART0_CK, TIMER0_CH0, CK_OUT0 Default: PA9 Alternate: USART0_TX, TIMER0_CH1 42 GD32F103xx Datasheet Pin I/O Type(1) Level(2) 22 I/O 5VT PA11 23 I/O 5VT PA12 24 I/O 5VT PA13 25 I/O 5VT VSS_2 26 P Default: VSS_2 VDD_2 27 P Default: VDD_2 PA14 28 I/O 5VT PA15 29 I/O 5VT PB3 30 I/O 5VT PB4 31 I/O 5VT PB5 32 I/O Pin Name Pins PA10 Functions description Default: PA10 Alternate: USART0_RX, TIMER0_CH2 Default: PA11 Alternate: USART0_CTS, CAN0_RX, USBDM, TIMER0_CH3 Default: PA12 Alternate: USART0_RTS, CAN0_TX, TIMER0_ETI, USBDP Default: JTMS, SWDIO Remap: PA13 Default: JTCK, SWCLK Remap: PA14 Default: JTDI Remap: TIMER1_CH0, TIMER1_ETI, PA15, SPI0_NSS Default: JTDO Remap: PB3, TRACESWO, TIMER1_CH1, SPI0_SCK Default: NJTRST Remap: TIMER2_CH0, PB4, SPI0_MISO Default: PB5 Alternate: I2C0_SMBA Remap: TIMER2_CH1, SPI0_MOSI Default: PB6 PB6 33 I/O 5VT Alternate: I2C0_SCL, TIMER3_CH0(4) Remap: USART0_TX Default: PB7 PB7 34 I/O 5VT Alternate: I2C0_SDA , TIMER3_CH1(4) Remap: USART0_RX BOOT0 35 I Default: BOOT0 VSS_3 36 P Default: VSS_3 VDD_3 1 P Default: VDD_3 Notes: (1) Type: I = input, O = output, P = power. (2) I/O Level: 5VT = 5 V tolerant. (3) ADC2 functions are not available in GD32F103T4/6/8/B devices. (4) Functions are available in GD32F103T8/B devices. 43 GD32F103xx Datasheet 3. Functional description 3.1. ARM® Cortex™-M3 core The Cortex™-M3 processor is the latest generation of ARM® processors for embedded systems. It has been developed to provide a low-cost platform that meets the needs of MCU implementation, with a reduced pin count and low-power consumption, while delivering outstanding computational performance and an advanced system response to interrupts.  32-bit ARM® Cortex™-M3 processor core  Up to 108 MHz operation frequency  Single-cycle multiplication and hardware divider  Integrated Nested Vectored Interrupt Controller (NVIC)  24-bit SysTick timer The Cortex™-M3 processor is based on the ARMv7 architecture and supports both Thumb and Thumb-2 instruction sets. Some system peripherals listed below are also provided by Cortex™-M3:  Internal Bus Matrix connected with I-Code bus, D-Code bus, System bus, Private Peripheral Bus (PPB) and debug accesses. 3.2.  Nested Vectored Interrupt Controller (NVIC).  Flash Patch and Breakpoint (FPB).  Data Watchpoint and Trace (DWT).  Instrumentation Trace Macrocell (ITM).  Embedded Trace Macrocell (ETM).  Serial Wire JTAG Debug Port (SWJ-DP).  Trace Port Interface Unit (TPIU).  Memory Protection Unit (MPU). On-chip memory  Up to 3072 Kbytes of Flash memory  Up to 96 Kbytes of SRAM The ARM® Cortex™-M3 processor is structured in Harvard architecture which can use separate buses to fetch instructions and load/store data. 3072 Kbytes of inner Flash and 96 Kbytes of inner SRAM at most is available for storing programs and data, both accessed (R/W) at CPU clock speed with zero wait states. The Table 2-4. GD32F103xx memory map shows the memory map of the GD32F103xx series of devices, including code, SRAM, peripheral, and other pre-defined regions. 44 GD32F103xx Datasheet 3.3. Clock, reset and supply management  Internal 8 MHz factory-trimmed RC and external 4 to 16 MHz crystal oscillator  Internal 40 KHz RC calibrated oscillator and external 32.768 KHz crystal oscillator  Integrated system clock PLL  2.6 to 3.6 V application supply and I/Os  Supply Supervisor: POR (Power On Reset), PDR (Power Down Reset), and low voltage detector (LVD) The Clock Control unit provides a range of frequencies and clock functions. These include an Internal 8M RC oscillator (IRC8M), a High Speed crystal oscillator (HXTAL), a Low Speed Internal 40K RC oscillator (IRC40K), a Low Speed crystal oscillator (LXTAL), a Phase Lock Loop (PLL), a HXTAL clock monitor, clock prescalers, clock multiplexers and clock gating circuitry. The frequency of AHB, APB2 and the APB1 domains can be configured by each prescaler. The maximum frequency of the AHB, APB2 and APB1 domains is 108 MHz/108 MHz/54 MHz. See Figure 2-8. GD32F103xx clock tree for details. GD32F10x Reset Control includes the control of three kinds of reset: power reset, system reset and backup domain reset. The system reset resets the processor core and peripheral IP components except for the SW-DP controller and the Backup domain. Power-on reset (POR) and power-down reset (PDR) are always active, and ensures proper operation starting from/down to 2.6 V. The device remains in reset mode when VDD is below a specified threshold. The embedded low voltage detector (LVD) monitors the power supply, compares it to the voltage threshold and generates an interrupt as a warning message for leading the MCU into security. Power supply schemes:  VDD range: 2.6 to 3.6 V, external power supply for I/Os and the internal regulator. Provided externally through VDD pins.  VSSA, VDDA range: 2.6 to 3.6 V, external analog power supplies for ADC, reset blocks, RCs and PLL. VDDA and VSSA must be connected to VDD and VSS, respectively.  VBAT range: 1.8 to 3.6 V, power supply for RTC, external clock 32 KHz oscillator and backup registers (through power switch) when VDD is not present. 3.4. Boot modes At startup, boot pins are used to select one of three boot options:  Boot from main flash memory (default)  Boot from system memory  Boot from on-chip SRAM The boot loader is located in the internal boot ROM memory (system memory). It is used to reprogram the Flash memory by using USART0 (PA9 and PA10), if devices are GD32F103xF/G/I/K, USART1 (PA2 and PA3) is also available for boot functions. It also can 45 GD32F103xx Datasheet be used to transfer and update the Flash memory code, the data and the vector table sections. In default condition, boot from bank 0 of Flash memory is selected. It also supports to boot from bank 1 of Flash memory by setting a bit in option bytes. 46 GD32F103xx Datasheet 3.5. Power saving modes The MCU supports three kinds of power saving modes to achieve even lower power consumption. They are sleep mode, deep-sleep mode, and standby mode. These operating modes reduce the power consumption and allow the application to achieve the best balance between the CPU operating time, speed and power consumption.  Sleep mode In sleep mode, only clock of Cortex™-M3 is off. All peripherals continue to operate and any interrupt/event can wake up the system.  Deep-sleep mode In deep-sleep mode, all clocks in the 1.2V domain are off, and all of IRC8M, HXTAL and PLLs are disabled. Only the contents of SRAM and registers are retained. Any interrupt or wakeup event from EXTI lines can wake up the system from the deep-sleep mode including the 16 external lines, the RTC alarm, the LVD output, USB Wakeup and Ethernet Wakeup. When exiting the deep-sleep mode, the IRC8M is selected as the system clock.  Standby mode In standby mode, the whole 1.2V domain is power off, the LDO is shut down, and all of IRC8M, HXTAL and PLL are disabled. The contents of SRAM and registers (except Backup registers) are lost. There are four wakeup sources for the Standby mode, including the external reset from NRST pin, the RTC alarm, the FWDGT reset, and the rising edge on WKUP pin. 3.6. Analog to digital converter (ADC)  12-bit SAR ADC  Up to 1 MSPS for 12-bit resolution  Analog input signal voltage range: VSSA to VDDA (2.6 to 3.6 V)  Temperature sensor Up to three 12-bit multi-channel ADCs are integrated in the device. Each has a total of up to 21 multiplexed external channels. An analog watchdog block can be used to detect the channels, which are required to remain within a specific threshold window. A configurable channel management block of analog inputs also can be used to perform conversions in single, continuous, scan or discontinuous mode. The ADCs can be triggered from the events generated by the general level 0 timers (TIMERx) or the advanced timers (TIMER0 and TIMER7) with internal connection. The temperature sensor generates a voltage that varies linearly with temperature. The analog supply voltage VDDA can vary from 2.6 V to 3.6 V. The output voltage of temperature sensor is internally connected to the ADC_IN16 input channel. 47 GD32F103xx Datasheet 3.7. Digital to analog converter (DAC)  Two 12-bit DACs with independent output channels  8-bit or 12-bit mode in conjunction with the DMA controller The two 12-bit buffered DACs are used to generate variable analog outputs. The DAC channels can be triggered by the timer or EXTI with DMA support. In dual DAC channel operation, conversions could be done independently or simultaneously. The maximum output value of the DAC is VREF+. 3.8. DMA  7 channel DMA0 controller and 5 channel DMA1 controller  Peripherals supported: Timers, ADC, SPIs, I2Cs, USARTs, DAC, I2S and SDIO The direct memory access (DMA) controllers provide a hardware method of transferring data between peripherals and/or memory without intervention from the CPU, thereby freeing up bandwidth for other system functions. Three types of access method are supported: peripheral to memory, memory to peripheral, memory to memory. Each channel is connected to fixed hardware DMA requests. The priorities of DMA channel requests are determined by software configuration and hardware channel number. Transfer size of source and destination are independent and configurable. 3.9. General-purpose inputs/outputs (GPIOs)  Up to 112 fast GPIOs, all mappable on 16 external interrupt lines  Analog input/output configurable  Alternate function input/output configurable There are up to 112 general purpose I/O pins (GPIO), named PA0 ~ PA15, PB0 ~ PB15, PC0 ~ PC15, PD0 ~ PD15, PE0 ~ PE15, PF0 ~ PF15 and PG0 ~ PG15 for the device to implement logic input/output functions. Each GPIO port has related control and configuration registers to satisfy the requirements of specific applications. The external interrupt on the GPIO pins of the device have related control and configuration registers in the Interrupt/event Controller Unit (EXTI). The GPIO ports are pin-shared with other alternative functions (AFs) to obtain maximum flexibility on the package pins. The GPIO pins can be used as alternative functional pins by configuring the corresponding registers regardless of the AF input or output pins. Each of the GPIO pins can be configured by software as output (push-pull or open-drain), input, peripheral alternate function or analog mode. Each GPIO pin can be configured as pull-up, pull-down or no pull-up/pull-down. All GPIOs are high-current capable except for analog mode. 48 GD32F103xx Datasheet 3.10. Timers and PWM generation  Up to two 16-bit advanced timer (TIMER0 & TIMER7), ten 16-bit general timers, and two 16-bit basic timer (TIMER5 & TIMER6)  Up to 4 independent channels of PWM, output compare or input capture for each and external trigger input  16-bit, motor control PWM advanced timer with programmable dead-time generation for output match  Encoder interface controller with two inputs using quadrature decoder  24-bit SysTick timer down counter  2 watchdog timers (Free watchdog timer and window watchdog timer) The advanced timer (TIMER0 & TIMER7) can be seen as a three-phase PWM multiplexed on 6 channels. It has complementary PWM outputs with programmable dead-time generation. It can also be used as a complete general timer. The 6 independent channels can be used for  Input capture  Output compare  PWM generation (edge-aligned or center-aligned counting modes)  Single pulse mode output If configured as a general 16-bit timer, it can be synchronized with external signals or to interconnect with other general timers together which have the same architecture and features. The general timer, known as TIMER1 ~ TIMER4, TIMER8 ~ TIMER10, TIMER11 ~ TIMER13 can be used for a variety of purposes including general timer, input signal pulse width measurement or output waveform generation such as a single pulse generation or PWM output, up to 4 independent channels for input capture/output compare. The general timer also supports an encoder interface with two inputs using quadrature decoder. The basic timer, known as TIMER5 and TIMER6 are mainly used for DAC trigger generation. They can also be used as a simple 16-bit time base. The GD32F103xx have two watchdog peripherals, free watchdog timer and window watchdog timer. They offer a combination of high safety level, flexibility of use and timing accuracy. The free watchdog timer consists of an 8-stage prescaler and a 12-bit down-counter, it is clocked from an independent 40 KHz internal RC and as it operates independently of the main clock, it can operate in deep-sleep and standby modes. It can be used either as a watchdog to reset the device when a problem occurs, or as a free-running timer for application timeout management. The window watchdog timer is based on a 7-bit down counter that can be set as free-running. It can be used as a watchdog to reset the device when a problem occurs. It is clocked from the main clock. It has an early wakeup interrupt capability and the counter can be frozen in 49 GD32F103xx Datasheet debug mode. The SysTick timer is dedicated for OS, but could also be used as a standard down counter. The features are shown below: 3.11.  A 24-bit down counter  Auto reload capability  Maskable system interrupt generation when the counter reaches 0  Programmable clock source Real time clock (RTC)  32-bit up-counter with a programmable 20-bit prescaler  Alarm function  Interrupt and wake-up event The real time clock is an independent timer which provides a set of continuously running counters which can be used with suitable software to provide a clock calendar function, and provides an alarm interrupt and an expected interrupt. The RTC features a 32-bit programmable counter for long-term measurement using the compare register to generate an alarm. A 20-bit prescaler is used for the time base clock and is by default configured to generate a time base of 1 second from a clock at 32.768 KHz from external crystal oscillator. 3.12. Inter-integrated circuit (I2C)  Up to two I2C bus interfaces can support both master and slave mode with a frequency up to 400 KHz  Provide arbitration function, optional PEC (packet error checking) generation and checking  Supports 7-bit and 10-bit addressing mode and general call addressing mode The I2C interface is an internal circuit allowing communication with an external I2C interface which is an industry standard two line serial interface used for connection to external hardware. These two serial lines are known as a serial data line (SDA) and a serial clock line (SCL). The I2C module provides transfer rate of up to 100 KHz in standard mode and up to 400 KHz in fast mode. The I2C module also has an arbitration detect function to prevent the situation where more than one master attempts to transmit data to the I2C bus at the same time. A CRC-8 calculator is also provided in I2C interface to perform packet error checking for I2C data. 50 GD32F103xx Datasheet 3.13. Serial peripheral interface (SPI)  Up to three SPI interfaces with a frequency of up to 18 MHz  Support both master and slave mode  Hardware CRC calculation and transmit automatic CRC error checking The SPI interface uses 4 pins, among which are the serial data input and output lines (MISO & MOSI), the clock line (SCK) and the slave select line (NSS). Both SPIs can be served by the DMA controller. The SPI interface may be used for a variety of purposes, including simplex synchronous transfers on two lines with a possible bidirectional data line or reliable communication using CRC checking. 3.14. Universal synchronous asynchronous receiver transmitter (USART)  Up to three USARTs and two UARTs with operating frequency up to 6.75 MHz  Supports both asynchronous and clocked synchronous serial communication modes  IrDA SIR encoder and decoder support  LIN break generation and detection  USARTs support ISO 7816-3 compliant smart card interface The USART (USART0, USART1 and USART2) and UART (UART3 & UART4) are used to translate data between parallel and serial interfaces, provides a flexible full duplex data exchange using synchronous or asynchronous transfer. It is also commonly used for RS-232 standard communication. The USART includes a programmable baud rate generator which is capable of dividing the system clock to produce a dedicated clock for the USART transmitter and receiver. The USART also supports DMA function for high speed data communication except UART4. 3.15. Inter-IC sound (I2S)  Two I2S bus Interfaces with sampling frequency from 8 KHz to 192 KHz  Support either master or slave mode The Inter-IC sound (I2S) bus provides a standard communication interface for digital audio applications by 3-wire serial lines. GD32F103xx contain two I2S-bus interfaces that can be operated with 16/32 bit resolution in master or slave mode, pin multiplexed with SPI1 and SPI2. The audio sampling frequency from 8 KHz to 192 KHz is supported with less than 0.5% accuracy error. 51 GD32F103xx Datasheet 3.16. Secure digital input and output card interface (SDIO)  Support SD2.0/SDIO2.0/MMC4.2 host interface The Secure Digital Input and Output Card Interface (SDIO) provides access to external SD memory cards specifications version 2.0, SDIO card specification version 2.0 and multi-media card system specification version 4.2 with DMA supported. In addition, this interface is also compliant with CE-ATA digital protocol rev1.1. 3.17. Universal serial bus full-speed device (USBD)  One full-speed USB Interface with frequency up to 12 Mbit/s  Internal main PLL for USB CLK compliantly The Universal Serial Bus (USB) is a 4-wire bus that supports communication between one or more devices. Full-speed peripheral is compliant with the USB 2.0 specification. The device controller enables 12 Mbit/s data exchange with a USB Host controller. Transaction formatting is performed by the hardware, including CRC generation and checking. The status of a completed USB transfer or error condition is indicated by status registers. An interrupt is also generated if enabled. The dedicated 48 MHz clock is generated from the internal main PLL (the clock source must use a HSE crystal oscillator) and the operating frequency divided from APB1 should be 12 MHz above. 3.18. Controller area network (CAN)  One CAN2.0B interface with communication frequency up to 1 Mbit/s  Internal main PLL for USB CLK compliantly Controller area network (CAN) is a method for enabling serial communication in field bus. The CAN protocol has been used extensively in industrial automation and automotive applications. It can receive and transmit standard frames with 11-bit identifiers as well as extended frames with 29-bit identifiers. It has three mailboxes for transmission and two FIFOs of three message deep for reception. It also provides 14 scalable/configurable identifier filter banks for selecting the incoming messages needed and discarding the others. 3.19. External memory controller (EXMC)  Supported external memory: SRAM, PSRAM, ROM and NOR-Flash, NAND Flash and CF card  Up to 16-bit data bus  Support interface with Motorola 6800 and Intel 8080 type LCD directly External memory controller (EXMC) is an abbreviation of external memory controller. It is 52 GD32F103xx Datasheet divided in to several sub-banks for external device support, each sub-bank has its own chip selection signal but at one time, only one bank can be accessed. The EXMC support code execution from external memory except NAND Flash and CF card. The EXMC also can be configured to interface with the most common LCD module of Motorola 6800 and Intel 8080 series and reduce the system cost and complexity. 3.20. Debug mode  Serial wire JTAG debug port (SWJ-DP) The ARM® SWJ-DP Interface is embedded and is a combined JTAG and serial wire debug port that enables either a serial wire debug or a JTAG probe to be connected to the target. 3.21. Package and operation temperature  LQFP144 (GD32F103Zx), LQFP100 (GD32F103Vx), LQFP64 (GD32F103Rx), LQFP48 (GD32F103Cx) and QFN36 (GD32F103Tx)  Operation temperature range: -40°C to +85°C (industrial level) 53 GD32F103xx Datasheet 4. Electrical characteristics 4.1. Absolute maximum ratings The maximum ratings are the limits to which the device can be subjected without permanently damaging the device. Note that the device is not guaranteed to operate properly at the maximum ratings. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. Table 4-1. Absolute maximum ratings Symbol Parameter Min Max Unit VDD External voltage range VSS - 0.3 VSS + 3.6 V VDDA External analog supply voltage VSSA - 0.3 VSSA + 3.6 V VBAT External battery supply voltage VSS - 0.3 VSS + 3.6 V Input voltage on 5V tolerant pin VSS - 0.3 VDD + 4.0 V Input voltage on other I/O VSS - 0.3 4.0 V Maximum current for GPIO pins — 25 mA Injected current on 5V tolerant pin — ±5 mA Injected current on other I/O — ±5 mA ∑IINJ Injected current on all I/O — ±25 mA TA Operating temperature range -40 +85 °C TSTG Storage temperature range -55 +150 °C TJ Maximum junction temperature — 125 °C VIN IIO IINJ 4.2. Recommended DC characteristics Table 4-2. DC operating conditions Symbol Parameter Conditions Min Typ Max Unit VDD Supply voltage — 2.6 3.3 3.6 V VDDA Analog supply voltage Same as VDD 2.6 3.3 3.6 V VBAT Battery supply voltage — 1.8 — 3.6 V 54 GD32F103xx Datasheet 4.3. Power consumption The power measurements specified in the tables represent that code with data executing from on-chip Flash with the following specifications. Table 4-3. Power consumption characteristics (for GD32F103x4/6/8/B devices) Symbol Parameter Conditions Min Typ. Max Unit VDD=VBAT=3.3V, HXTAL=8MHz, System — 45.5 — mA — 33.96 — mA -— 30.72 — mA — 23.05 — mA — 19.82 — mA — 5.84 — mA — 347.1 — μA — 335.9 — μA — 9.27 — μA — 8.82 — μA — 7.52 — μA — 13.03 — μA — 10.7 — μA — 5.79 — μA system clock = IRC8M = 8MHz — 4.5 — μs system clock = IRC8M = 8MHz — 6.5 — μs clock=108 MHz, all peripherals enabled VDD=VBAT=3.3V, HXTAL=8MHz, System Supply current clock =108 MHz, all peripherals disabled (Run mode) VDD=VBAT=3.3V, HXTAL=8MHz, System clock =72MHz, all peripherals enabled VDD=VBAT=3.3V, HXTAL=8MHz, System Clock =72 MHz, all peripherals disabled VDD=VBAT=3.3V, HXTAL=8MHz, System clock =108 MHz, CPU clock off, all Supply current peripherals enabled (Sleep mode) VDD=VBAT=3.3V, HXTAL=8MHz, System clock =108 MHz, CPU clock off, all peripherals disabled IDD VDD=VBAT=3.3V, All clock off, regulator in Supply current (Deep-Sleep mode) run mode, IRC40K on, RTC on, all GPIOs analog mode VDD=VBAT=3.3V, All clock off, regulator in low power mode, IRC40K on, RTC on, all GPIOs analog mode VDD=VBAT=3.3V, LDO off, LXTAL off, IRC40K on, RTC on Supply current VDD=VBAT=3.3V, LDO off, LXTAL off, (Standby mode) IRC40K on, RTC off VDD=VBAT=3.3V, LDO off, LXTAL off, IRC40K off, RTC off VDD not available, VBAT=3.6V, LDO off, Battery supply IBAT current (Standby mode) LXTAL on, IRC40K off, RTC on VDD not available, VBAT=3.3 V, LDO off, LXTAL off, IRC40K on, RTC on VDD not available, VBAT=2.6 V, LDO off, LXTAL off, IRC40K on, RTC on tSLEEP tDEEPSLEEP Wakeup from Sleep mode Wakeup from deep-sleep 55 GD32F103xx Datasheet mode(regulator in run mode) Wakeup from deep-sleep mode(regulator system clock = IRC8M = 8MHz — 6.5 — μs system clock = IRC8M = 8MHz — 59.4 — ms in low power mode) tSTDBY Wakeup from Standby mode Table 4-4. Power consumption characteristics (for GD32F103xC/D/E/F/G/I/K devices) Symbol Parameter Conditions Min Typ. Max Unit VDD=VBAT=3.3V, HXTAL=8MHz, System — 66.32 — mA — 41.18 — mA -— 44.98 — mA — 28.21 — mA — 37.91 — mA — 7.94 — mA — 716.5 — μA — 706.8 — μA — 9.88 — μA — 9.45 — μA — 8.17 — μA — 12.79 — μA — 10.11 — μA clock=108 MHz, all peripherals enabled VDD=VBAT=3.3V, HXTAL=8MHz, System Supply current clock =108 MHz, all peripherals disabled (Run mode) VDD=VBAT=3.3V, HXTAL=8MHz, System clock =72MHz, all peripherals enabled VDD=VBAT=3.3V, HXTAL=8MHz, System Clock =72 MHz, all peripherals disabled VDD=VBAT=3.3V, HXTAL=8MHz, System clock =108 MHz, CPU clock off, all Supply current peripherals enabled (Sleep mode) VDD=VBAT=3.3V, HXTAL=8MHz, System clock =108 MHz, CPU clock off, all peripherals disabled IDD VDD=VBAT=3.3V, All clock off, regulator in Supply current (Deep-Sleep mode) run mode, IRC40K on, RTC on, all GPIOs analog mode VDD=VBAT=3.3V, All clock off, regulator in low power mode, IRC40K on, RTC on, all GPIOs analog mode VDD=VBAT=3.3V, LDO off, LXTAL off, IRC40K on, RTC on Supply current VDD=VBAT=3.3V, LDO off, LXTAL off, (Standby mode) IRC40K on, RTC off VDD=VBAT=3.3V, LDO off, LXTAL off, IRC40K off, RTC off Battery supply IBAT current (Standby mode) VDD not available, VBAT=3.6V, LDO off, LXTAL on, IRC40K off, RTC on VDD not available, VBAT=3.3 V, LDO off, LXTAL off, IRC40K on, RTC on 56 GD32F103xx Datasheet VDD not available, VBAT=2.6 V, LDO off, — 5.62 — μA system clock = IRC8M = 8MHz — 4.5 — μs system clock = IRC8M = 8MHz — 6 — μs system clock = IRC8M = 8MHz — 6 — μs system clock = IRC8M = 8MHz — 118.8 — ms LXTAL off, IRC40K on, RTC on Wakeup from tSLEEP Sleep mode Wakeup from deep-sleep mode(regulator in run mode) tDEEPSLEEP Wakeup from deep-sleep mode(regulator in low power mode) tSTDBY Wakeup from Standby mode Table 4-5. Power consumption of peripherals (for GD32F103x4/6/8/B devices) Typical consumption Peripheral APB1 APB2 AHB at 25℃ (TYP) TIMER1 0.75 TIMER2 0.79 TIMER3 0.75 SPI1 0.1 USART1 0.18 USART2 0.18 I2C0 0.23 I2C1 0.23 USB 0.46 CAN 0.75 GPIOA 0.3 GPIOB 0.3 GPIOC 0.3 GPIOD 0.3 GPIOE 0.3 ADC0(1) 0.34 ADC1(1) 0.35 TIMER0 1.33 SPI0 0.1 USART0 0.35 EXMC 0.11 Unit mA Note: (1) The condition of ADC measurement is:system clock = fHCLK = 56MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK, fADC = fAPB2/4, ADCON bit is set to 1. 57 GD32F103xx Datasheet (2) HXTAL = 8MHz, system clock = fHCLK = 108MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK. Table 4-6. Power consumption of peripherals (for GD32F103xC/D/E/F/G/I/K devices) Typical consumption Peripheral APB1 APB2 AHB at 25℃ (TYP) TIMER1 0.93 TIMER2 0.88 TIMER3 1.03 TIMER4 0.99 TIMER5 0.34 TIMER6 0.31 TIMER11 0.93 TIMER12 0.78 TIMER13 1.02 SPI1 0.43 SPI2 0.4 USART1 0.36 USART2 0.44 UART3 0.46 USRT4 0.42 I2C0 0.47 I2C1 0.47 USB 0.46 CAN 0.75 DAC(1) 0.29 GPIOA 0.47 GPIOB 0.59 GPIOC 0.63 GPIOD 0.59 GPIOE 0.62 GPIOF 0.65 GPIOG 0.79 ADC0(2) 1.42 ADC1(2) 1.44 ADC2(2) 1.39 TIMER0 1.52 TIMER7 1.53 TIMER8 1.04 TIMER9 0.95 TIMER10 0.97 SPI0 0.22 USART0 0.63 EXMC 1.53 Unit mA 58 GD32F103xx Datasheet SDIO 0.61 Note: (1) The condition of DAC measurement is:DEN0, DEN1 bits in the DAC_CTL register are set to 1, and the converted value is set to 0x800. (2) The condition of ADC measurement is:system clock = fHCLK = 56MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK, fADC = fAPB2/4, ADCON bit is set to 1. (3) HXTAL = 8MHz, system clock = fHCLK = 108MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK. 59 GD32F103xx Datasheet 4.4. EMC characteristics EMS (electromagnetic susceptibility) includes ESD (Electrostatic discharge, positive and negative) and FTB (Burst of Fast Transient voltage, positive and negative) testing result is given in the Table 4-7. EMS characteristics, based on the EMS levels and classes compliant with IEC 61000 series standard. Table 4-7. EMS characteristics Symbol VESD Parameter Conditions Voltage applied to all device pins to VDD = 3.3 V, TA = +25 °C induce a functional disturbance conforms to IEC 61000-4-2 Fast transient voltage burst applied to VFTB induce a functional disturbance through 100 pF on VDD and VSS pins Level/Class 3B VDD= 3.3 V, TA = +25 °C 4A conforms to IEC 61000-4-4 EMI (Electromagnetic Interference) emission testing result is given in the Table 4-8. EMI characteristics, compliant with IEC 61967-2 standard which specifies the test board and the pin loading. Table 4-8. EMI characteristics Symbol Parameter Conditions 4.5. Peak level frequency band Unit 56M 72M 108M 0.1 to 2 MHz
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