WTM3401
P-Channel Power MOSFET
Description
■ The WTM3401 uses advanced trench technology to provide
excellent RDS(ON), low gate charge and operation with gate
voltages as low as 2.5V. This device is suitable for use as a
battery protection or in PWM application.
Features
■ V DS = -30V, lD = -4.2A
RDS(ON) < 130mΩ @ VGS= -2.5V
SOT-23 Top View
RDS(ON) < 75mΩ @ VGS= -4.5V
RDS(ON) < 55mΩ @ VGS= -10V
■ High power and current handing capability
■ Lead free product is acquired
■ Surface mount package
Application
■ Battery protection.
■ Load switch
■ Power management
Schematic Diagram
Package and order information
Device
Device Marking
Device Package
Reel Size
Tape width
Quantity
WTM3401
A19T
SOT-23
Ø180mm
8 mm
3000 pcs
Absolute Maximum Ratings (TA=25℃, RH=45%-75%, unless otherwise noted)
Parameter
Symbol
Value
Unit
Drain-Source Voltage
VDS
-30
V
Gate-Source Voltage
VGS
±12
V
Drain Current-Continuous
ID
-4.2
A
Drain Current-Pulsed (Note 1)
IDM
-30
A
Maximum Power Dissipation
PD
1.2
W
TJ & TSTG
−55 to +150
°C
Symbol
Value
Unit
RθJA
104
℃/W
Operating Junction and Storage Temperature Range
Thermal Characteristic
Parameter
Thermal Resistance and Junction-to-Ambient (Note 2)
V1.0_Aug,2018
-1-
www.wpmtek.com
WTM3401
P-Channel Power MOSFET
Electrical Characteristics(TA = 25°C unless otherwise noted)
Parameter
Symbol
Condition
Min
BVDSS
VGS=0V ID = -250μA
-30
Zero Gate Voltage Drain Current
IDSS
VDS=-24V,VGS=0V
-
Gate-Body Leakage Current
IGSS
VGS=±10V,VDS=0V
VGS(th)
VDS=VGS,ID =-250μA
Typ
Max
Unit
-
V
-
-1
μA
-
-
±100
nA
-0.7
-1
-1.3
V
48
55
mΩ
Off Characteristics
Drain-Source Breakdown Voltage
On Characteristics (Note 3)
Gate Threshold Voltage
VGS=-10V, ID =-4.2A
Drain-Source On-State Resistance
Forward Transconductance
RDS(ON)
gFS
VGS =-4.5V,ID =-4A
-
56
75
mΩ
VGS =-2.5V,ID =-1A
-
72
130
mΩ
10
-
S
-
880
-
PF
-
105
-
PF
VDS=-5V,ID=-4.2A
Dynamic Characteristics (Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
-
65
-
PF
Turn-on Delay Time
td(on)
-
7
-
nS
Turn-on Rise Time
tr
VDD =-15V,ID =-4.2A
-
3
-
nS
VGS =-10V,RGEN =6Ω
-
30
-
nS
VDS=-15V,VGS=0V,F=1.0MHz
Switching Characteristics (Note 4)
Turn-Off Delay Time
td(off)
Turn-Off Fall Time
tf
-
12
-
nS
Total Gate Charge
Qg
-
8.5
-
nC
Gate-Source Charge
Qgs
-
1.8
-
nC
Gate-Drain Charge
Qgd
-
2.7
-
nC
-
-
-1.2
V
VDS=-15V,ID=-4.2A,VGS=-4.5V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
VSD
VGS=0V,IS =-4.2A
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
V1.0_Aug,2018
-2-
www.wpmtek.com
WTM3401
P-Channel Power MOSFET
Typical Electrical and Thermal Characteristics
Figure 2 - Switching Waveforms
PD Power (W)
ID-Drain Current(A)
Figure 1 - Switching Test Circuit
TJ -Junction Temperature (°C)
(°C)
Figure 3 - Power Dissipation
Figure 4 - Drain Current
Rdson On-Resistance(Ω)
ID-Drain Current(A)
V1.0_Aug,2018
TJ -Junction Temperature
Vds Drain-Source Voltage (V)
ID-Drain Current(A)
Figure 5 - Output Characteristics
Figure 6 -Drain-Source On-Resistance
-3-
www.wpmtek.com
WTM3401
ID-Drain Current(A)
Normalized On-Resistance
P-Channel Power MOSFET
TJ -Junction Temperature (°C)
Vgs Gate-source Voltage(V)
Figure 8 – Drain-Source On-Resistance
C Capacitance(pF)
Rdson On-Resistance(Ω)
Figure 7 – Transfer Characteristics
Vgs Drain-source Voltage(V)
Figure 9 – Rdson vs Vgs
Figure 10 – Capacitance vs Vds
Is-Reverse Drain Current(A)
Vgs Gate-Source Voltage(V)
Vgs Gate-source Voltage(V)
Qg Gate Charge (nC)
Vsd Source-Drain Voltage(V)
Figure 11 –Gate Charge
V1.0_Aug,2018
Figure 12–Source-Drain Diode Forward
-4-
www.wpmtek.com
WTM3401
ID- Drain Current(A)
P-Channel Power MOSFET
Vds Drain-Source Voltage(V)
Transient Thermal Impedance
r(t), Normalized Effective
Figure 13 – Safe Operation Area
Square Wave Pulse Duration(sec)
Figure 14 – Normalized Maximum Transient Thermal Impedance
V1.0_Aug,2018
-5-
www.wpmtek.com
WTM3401
P-Channel Power MOSFET
Soldering Parameters
Reflow Condition
Pre Heat
Pb-Free assembly
-Temperature Min (Ts(min))
+150℃
-Temperature Max(Ts(max))
+200℃
-Time (Min to Max) (ts)
60-180 secs.
Average ramp up rate (Liquid us Temp (TL) to peak)
3℃/sec. Max
Ts(max) to TL - Ramp-up Rate
3℃/sec. Max
-Temperature(TL) (Liquid us)
+217℃
Reflow
-Temperature(tL)
60-150 secs.
Peak Temp (Tp)
+260(+0/-5)℃
Time within 5℃ of actual Peak Temp (tp)
30 secs. Max
Ramp-down Rate
6℃/sec. Max
Time 25℃ to Peak Temp (TP)
8 min. Max
Do not exceed
V1.0_Aug,2018
+260℃
-6-
www.wpmtek.com
WTM3401
P-Channel Power MOSFET
Package Outline Dimensions (SOT-23)
Symbol
Dimensions in Millimeters
Min
Max
A
0.900
1.150
A1
0.000
0.100
A2
0.900
1.050
b
0.300
0.500
c
0.080
0.150
D
2.800
3.000
E
1.200
2.250
1.400
2.550
E1
0.950 TYP
e
e1
1.800
0.55 REF
L
L1
θ
2.000
0.300
0°
0.500
8°
Recommend PAD Layout
Notes:
1.
All dimensions are in millimeters.
2.
Tolerance ±0.10mm (4 mil) unless otherwise specified
3.
Package body sizes exclude mold flash and gate burrs. Mold flash at the non-lead sides should be less than 5 mils.
4.
Dimension L is measured in gauge plane.
5.
Controlling dimension is millimeter, converted inch dimensions are not necessarily exact.
V1.0_Aug,2018
-7-
www.wpmtek.com
很抱歉,暂时无法提供与“WTM3401”相匹配的价格&库存,您可以联系我们找货
免费人工找货