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认
书
APPROVAL SHEET
客 户 名 称:
/
Customer
叠层片式铁氧体功率电感器
产 品 名 称:
Multilayer Chip Ferrite Power Inductor
Part Name
产 品 规 格:
CMP321609-D Series
Specification
版 本 号:
22.01
Version No.
日
期:
2022-1-7
DATE
制造
客户
Manufacturer
Customer
拟制
审核
确认
检验
审核
批准
Draft by
Checked by
Approve by
Check by
Checked by
Approval by
林晓华
徐雪枫
覃贤
履 历 表 Resume
版本
Version No.
18.01
20.01
21.01
修 改 明 细
Modify Details
首次发行 Initial issue
日期
Date
2018-5-21
修改了可靠性试验项目抗弯强度试验方法及要求 Modified the bending strength
test method and requirements of reliability test items.
修改了可靠性试验项目抗弯强度试验方法,修改了温度循环为温度冲击.
Modified the reliability test item of bending strength test method, changed the
temperature cycling items into temperature shocking .
2020-5-28
2021-5-6
删除了跌落试验内容.
Deleted the drop test item.
22.01
修改了存储期限. Modified the storage period.
Page 1 of 11
2022-1-7
序号
No
目
录
TABLE OF CONTENTS
1
外形尺寸与内部结构 Dimension & Inner-configuration
2
产品品名构成 Product Spec. Model
3
电性能参数表 Electrical Characteristics List
4
可靠性试验项目 Reliability Testing Items
5
产品包装 Packaging
6
推荐焊接条件 Recommend Soldering Conditions
7
清洗 Cleaning
8
存储要求 Storage Requirements
9
ODS(消耗臭氧层物质)的使用情况 Usage Of ODS
10
注意事项 Notes
Page 2 of 11
1 外形尺寸与内部结构 Dimension & Inner-configuration:
a.镀层 Ni/Sn plating
b.银层 Ag layer
c.内电极 Inner electrode
d.瓷体 Body
e.端电极 Terminal electrode
f.瓷体 ferrite or ceramic
序号 No.
部位 Component
材料 Material
1
瓷体Body
铁氧体电感:镍铜锌体系Ni-Cu-Zn
2
内电极Inner electrode
纯银Ag
3
端电极
Terminal electrode
银层 Ag layer
银Ag
Ni/Sn镀层Ni/Sn plating
镍层-锡层Ni-Sn
单位Unit:mm(inch)
型号 Size
L
W
T
a
321609
3.2±0.20(0.126±0.008)
1.6±0.20(0.063±0.008)
0.9±0.20(0.035±0.008)
0.5±0.3(0.020±0.012)
2 产品品名构成 Product Spec. Model
CMP
321609
UD
1R0
M
T
包装 Packaging:编带包装 Tape & Reel:T
误差范围 Tolerance:M,±20%
电感量 Inductance:1R0=1.0µH
材料代号 Material code:UD
尺寸 Dimensions:(L×W×T)(3.2×1.6×0.9mm)
产品类型 Product symbol:
CMP:叠层片式铁氧体功率电感器 Multilayer Chip Ferrite Power Inductor
Page 3 of 11
3 电性能参数表 Electrical Characteristics List
测试
电压
Test
voltage
(mV)
自谐
振频率
SRF
(MHz)
min
额定
电流
Rated
current
(mA)max
1
50
60
1200
0.15
1
50
65
1200
1.5
0.17
1
50
60
1000
±20
1.8
0.24
1
50
55
900
CMP321609UD2R2MT
±20
2.2
0.24
1
50
50
900
CMP321609UD2R7MT
±20
2.7
0.30
1
50
45
800
CMP321609UD3R3MT
±20
3.3
0.30
1
50
41
800
CMP321609UD3R9MT
±20
3.9
0.38
1
50
38
700
CMP321609UD4R7MT
±20
4.7
0.38
1
50
35
700
CMP321609UD5R6MT
±20
5.6
0.45
1
50
32
500
CMP321609XD6R8MT
±20
6.8
0.45
1
50
29
500
CMP321609XD8R2MT
±20
8.2
0.55
1
50
26
300
CMP321609XD100MT
±20
10
0.55
1
50
24
300
CMP321609XD120MT
±20
12
0.55
1
50
22
300
CMP321609JD150MT
±20
15
0.65
1
50
19
100
CMP321609JD180MT
±20
18
0.65
1
50
18
100
误差
范围
Tolerance
(%)
标称
感量
Inductance
(µH)
CMP321609UD1R0MT
±20
1.0
0.15
CMP321609UD1R2MT
±20
1.2
CMP321609UD1R5MT
±20
CMP321609UD1R8MT
型号规格
Part NO.
客户
料号
Customer
P/N
Page 4 of 11
测试频率
直流
Test
电阻 RDC
frequency
(Ω)max
(MHz)
4 可靠性试验项目 Reliability Testing Items
序号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
工作温度范围
1
Operating
Temperature
-40℃~+85℃
Range
预热温度:120℃ ~ 150℃
预热时间: 60s
焊料:(96.5%Sn/3.0%Ag/0.5%Cu)焊锡
焊锡温度: 245℃±5℃
至少 95%端电极表面被焊锡覆盖。
2
可焊性
Solder ability
At least 95% of terminal electrode
should be covered with solder
浸锡深度:10mm
浸锡时间 : 5±1s
浸绩到助焊剂约:3 ~ 5 s
Preheating temperature:120℃ to 150℃
Preheating time: 60s
Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder.
Solder temperature: 245±5℃
Immersion tin depth:10mm
Duration : 5±1s
Dip performance to a flux of about:3 ~ 5 s
至少 95%的焊锡覆盖在端电极表面,
无可见机械损伤。
耐焊接热
3
Resistance
to Soldering
预热温度: 120℃~150℃
预热时间: 60s
电感量变化率如下:
焊料:(96.5%Sn/3.0%Ag/0.5%Cu)焊锡
铁氧体电感 (UD 料): ±20%
浸锡温度: 260℃±5℃
铁氧体电感 (XD 料): ±25%
浸锡深度:10mm
铁氧体电感 (JD 料): ±30%
浸锡时间 : 10±1s
At least 95% of terminal electrode
浸绩到助焊剂约:3 ~ 5 s
should be covered with solder.
Preheating temperature: 120℃ to 150℃
No mechanical damage.
Preheating time: 60s
Inductance :
Solder 96.5%Sn/3.0%Ag/0.5%Cu of the Sn solder.
UD :change within ±20%
Solder temperature: 260℃±5℃
XD :change within ±25%
Immersion tin depth:10mm
J D:change within ±30%
Duration : 10±1s
Dip performance to a flux of about:3 ~ 5 s
Page 5 of 11
序号
No.
项目
Items
要求
Requirements
试验方法及备注
Test Methods and Remarks
施加力:3216 系列为 10N。
保持时间:10±1S
Applied force: 10N force for 3216 series.
4
端电极强度
端电极与磁体不应受损,无可见机械损
Adhesion of
伤。
electrode
Keep time :10±1S
The termination and body should be
no damage.
无可见机械损伤,
耐低温
5
Low
temperature
resistance
测试温度:-40±2℃
24
测试时间:1000 -0 h
电感量变化率小于±10%,
No mechanical damage.
Inductance change: within ±10%
Temperature:-40±2℃
24
-
Testing time:1000 0 h
测试基板:玻璃环氧树脂基板
加压速度为 0.5mm/s,弯度:2mm,保持时间 20s±
1s
Testing board: glass epoxy-resin substrate
抗弯强度
6
Bending
strength
For 0.5 mm/s compression speed, curvature:
无可见机械损伤,
2mm, hold time 20s±1s
No mechanical damage
振幅:1.5mm
测试时间:沿三个垂直方向各做 2 小时
无可见机械损伤,
振动
7
Vibration
频率范围:10Hz~55Hz~10Hz (1 分钟)
电感量变化率小于±10%,
Amplitude modulation: 1.5mm
No mechanical damage.
Test time: A period of 2h in each of 3 mutually
Inductance change: within ±10%
perpendicular directions.
Frequency range: 10Hz to 55Hz to 10Hz for
1min.
Page 6 of 11
序号
No.
项目
Items
耐高温
8
High
temperature
resistance
要求
Requirements
试验方法及备注
Test Methods and Remarks
24
无可见机械损伤,
测试时间:1000 -0 h
电感量变化率小于±10%,
测试温度:85±2℃
No mechanical damage.
Testing time: 1000 -0 h
Inductance change: within ±10%
Temperature: 85±2℃
24
湿度:90%~95% RH,温度:60℃±2℃
无可见机械损伤,
恒定湿热
9
Static
Humidity
电感量变化率小于±10%,
No mechanical damage.
Inductance change: within ±10%
24
-
测试时间:1000 0 h
Humidity: 90% to 95% RH
Temperature: 60℃±2℃
24
-
Testing time: 1000 0 h
施加电流:额定电流
高温负载
High
10
temperature
load
无可见机械损伤,
24
电感量变化率小于±10%,
No mechanical damage.
Inductance change: within ±10%
测试时间:1000 -0 h
测试温度:85℃±2℃
impose current: at room
24
Testing time: 1000 -0 h
Temperature: 85±2℃
温度:-40℃,30±3 分钟
+85℃,30±3 分钟
循环次数:32
Temperature: -40℃ for 30±3min
无可见机械损伤,
温度冲击
11
Temperature
Shock
+85℃ for 30±3min
电感量变化率小于±10%,
Number of cycles: 32
No mechanical damage.
Inductance change: within ±10%
注:以上要求测试电性能的项目,应试验后在标准条件下放置 24 小时后测试。
Note: When there are questions concerning, measurement shall be made after 24±2hrs of recovery
under the standard condition.
Page 7 of 11
5 产品包装 Packaging
1)编带图 Taping drawings
2)卷盘尺寸 Reel dimensions (Unit: mm)
型号 Size
A
B
C
N
G
CF-8
178±2.0
22.0±2.0
12.5±1.5
57±2.0
8
3)导带及空格部分 Leader and blank portion
4)编带尺寸 Taping dimensions (Unit: mm)
纸带 Paper tape
Page 8 of 11
型号
Size
A0
B0
W
F
E
P1
P2
P0
D0
T
321609
1.90±0.2
3.50±0.2
8.0±0.2
3.5±0.1
1.75±0.2
4.0±0.2
2.0±0.1
4.0±0.2
1.55±0.1
0.95±0.1
5)剥离力检验 Peeling off force
① 盖带的剥离力:沿面胶移动方向拉时要求剥离力为 0.1N~0.7N。
Peeling force should be 0.1~0.7N pulling in the direction of arrow.
② 剥离速度:300mm/min
Speed of peeling off: 300mm/min.
③ 在纸带剥落时,面胶不能有破损,不能粘纸带。
The cover bond should not be damaged and bond the tape when it peeled off.
6)包装数量(单位:粒)Packaging number (Unit: Pcs )
型号 Size
321609
每卷数量 REEL
4000
每盒数量 BOX
40000
每箱数量 CASE
240000
7)标签粘贴位置 Label stick station
卷盘标签 Reel label
纸盒标签 Carton label
纸盒标签 Carton label
Page 9 of 11
外箱标签 Outer box label
6 推荐焊接条件 Recommend Soldering Conditions
1) 焊接条件 Soldering Conditions
产品适用于回流焊 Products can be applied to reflow soldering.
① 焊接要求 Soldering conditions
预热时,产品表温与焊料温度的温差最大不允许超出 150℃,焊接完冷却时,产品表温与溶剂温度
之间的温差最大不超过 100℃。预热不足有可能引发产品表面裂纹,从而导致产品品质下降。
Pre-heating should be in such a way that the temperature difference between solder and ferrite
surface is limited to 150℃ max. Also cooling into solvent after soldering should be in such way
that the temperature difference is limited to 100℃ max. Un-enough pre-heating may cause
cracks on the ferrite, resulting in the deterioration of product quality.
产品要在以下画出的曲线允许的范围内进行焊接。其它焊接条件可能引起产品电极的腐蚀。当焊接
重复时,允许的时间为第一次做的累计时间。
Products should be soldered within the following allowable range indicated by the slanted line.
The excessive soldering conditions may cause the corrosion of the electrode. When soldering is
repeated, allowable time is the accumulated time.
2) 回流焊曲线 Reflow soldering profile
3)手工焊接 Iron soldering
烙铁温度:350℃ (Max)
功率:最大为 30W
烙铁停留时间:
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