PJM3404NSA
N- Enhancement Mode Field Effect Transistor
SOT-23
Features
VDS = 30V,ID = 5.8A
RDS(ON) < 28mΩ @ VGS=10V
RDS(ON) < 40mΩ @ VGS=4.5V
Low Gate Charge and RDS(on)
High power and current handing capability
1. Gate 2.Source 3.Drain
Marking: R4
Applications
Schematic diagram
Load switch and in PWM applications
3Drain
1
Gate
2 Source
Absolute Maximum Ratings
Ratings at 25℃ ambient temperature unless otherwise specified.
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
30
V
Gate-Source Voltage
VGS
±20
V
Drain Current-Continuous
ID
5.8
A
Drain Current-Pulsed Note1
IDM
20
A
Maximum Power Dissipation
PD
0.9
W
TJ,TSTG
-55 To 150
℃
RθJA
139
℃/W
Operating Junction and Storage Temperature Range
Thermal Characteristics
Thermal Resistance,Junction-to-Ambient Note2
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Revision:1.0 Jun-2019
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PJM3404NSA
N- Enhancement Mode Field Effect Transistor
Electrical Characteristics
(TA=25℃ unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
V(BR)DSS
VGS=0V ID=250μA
30
-
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=30V,VGS=0V
-
-
1
μA
Gate-Body Leakage Current
IGSS
VGS=±20V,VDS=0V
-
-
±100
nA
Gate Threshold Voltage Note3
VGS(th)
VDS=VGS,ID=250μA
1.2
1.6
2.4
V
Drain-Source On-State Resistance Note3
RDS(ON)
VGS=10V, ID=5A
-
-
28
mΩ
VGS=4.5V, ID=4A
-
-
40
mΩ
VDS=5V,ID=5A
-
15
-
S
-
255
-
pF
-
45
-
pF
Static Characteristics
Forward Transconductance Note3
gFS
Dynamic Characteristics
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
-
35
-
pF
Turn-on Delay Time
td(on)
-
4.5
-
nS
Turn-on Rise Time
tr
-
2.5
-
nS
-
14.5
-
nS
-
3.5
-
nS
-
5.2
-
nC
-
0.85
-
nC
-
1.3
-
nC
-
-
1.2
V
-
-
5.8
A
VDS=15V,VGS=0V,
f=1.0MHz
Switching Characteristics
Turn-Off Delay Time
td(off)
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDD=15V, RL=3Ω
VGS=10V,RGEN=3Ω
VDS=15V,ID=5A,
VGS=10V
Drain-Source Diode Characteristics
Diode Forward Voltage Note 3
VSD
Diode Forward Current Note 2
IS
VGS=0V,IS=5A
Notes:
1.
2.
3.
Repetitive Rating: Pulse width limited by maximum junction temperature.
Surface Mounted on FR4 Board, t ≤ 10 sec.
Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
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Revision:1.0 Jun-2019
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PJM3404NSA
N- Enhancement Mode Field Effect Transistor
ID- Drain Current (A)
ID- Drain Current (A)
Typical Characteristics Curves
Vgs Gate-Source Voltage (V)
Vds Drain-Source Voltage (V)
Transfer Characteristics
Normalized On-Resistance
Rdson On-Resistance(mΩ)
Output Characteristics
TJ-Junction Temperature(℃)
Drain-Source On-Resistance
Drain-Source On-Resistance
Rdson On-Resistance(mΩ)
Is- Reverse Drain Current (A)
ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
Rdson vs Vgs
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Revision:1.0 Jun-2019
Vds Drain-Source Voltage (V)
Source- Drain Diode Forward
3/7
ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
PJM3404NSA
N- Enhancement Mode Field Effect Transistor
Qg Gate Charge (nC)
Safe Operation Area
C Capacitance (pF)
Gate Charge
Vds Drain-Source Voltage (V)
Vds Drain-Source Voltage (V)
Capacitance vs Vds
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Revision:1.0 Jun-2019
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PJM3404NSA
N- Enhancement Mode Field Effect Transistor
Package Outline
SOT-23
0.8
Max.
A
0.900
1.025
1.150
A1
0.000
0.050
0.100
b
c
D
0.300
0.080
2.800
0.400
0.115
2.900
0.500
0.150
3.000
E
1.200
1.300
1.400
HE
2.250
2.400
2.550
e
1.800
1.900
2.000
0.550REF
L1
L
0.300
0o
θ
0.500
8o
2.2
Typ.
0.8
1.0
Min.
1.0
Dimensions in millimeter
Symbol
1.9
SOT-23 (TO-236)
Recommended Soldering Pad
Ordering Information
Device
PJM3404NSA
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Revision:1.0 Jun-2019
Package
SOT-23
Shipping
3000/Reel&Tape(7inch)
5/7
PJM3404NSA
N- Enhancement Mode Field Effect Transistor
Conditions of Soldering and Storage
Recommended condition of reflow soldering
(°C)
Peak Temperature
245 to 260°C, 10s max.
Temperature
250
Reflow Heating Rate
1 to 5°C / s
200
150
100
50
0
Pre Heating Rate
Preliminary Heating
1 to 5°C / s
130 to 170°C, 50 to 120s
Soldering
230°C, 20 to 30s
Cooling
60s min.
Figure
2 times max.
Recommended peak temperature is over 245 OC. If peak temperature is below 245 OC, you may adjust
the following parameters:
Time length of peak temperature (longer)
Time length of soldering (longer)
Thickness of solder paste (thicker)
Conditions of hand soldering
Temperature: 370 OC
Time: 3s max.
Times: one time
Storage conditions
Temperature
5 to 40 OC
Humidity
30 to 80% RH
Recommended period
One year after manufacturing
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Revision:1.0 Jun-2019
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PJM3404NSA
N- Enhancement Mode Field Effect Transistor
Package Specifications
The method of packaging
Cover Tape
SOT-23 (TO-236)
3,000 pcs per reel
1
3
2
Carrier Tape
30,000 pcs per box
10 reels per box
220
195
0
435
21
43
5
120,000 pcs per carton
4 boxes per carton
210
Embossed tape and reel data
D
A
T2
T1
4.0
4.0
B
8.0
C
E
1Pin
G
N
Tape (8mm)
F
Reel (7'')
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Revision:1.0 Jun-2019
Symbol
A
B
C
E
F
D
T1
T2
N
G
Value (unit: mm)
Ø 177.8±1
2.7±0.2
Ø 13.5±0.2
Ø 54.5±0.2
12.3±0.3
9.6+2/-0.3
1.0±0.2
1.2±0.2
3.15±0.1
1.25±0.1
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