TC5018RGBF07-3CJH-S04 数据手册
深圳市天成照明有限公司
SPECIFICATIONS
产品规格书
客户名称
Customer
产品名称
Product
S04
客户代码
Customer NO.
产品型号
Type
TC5018RGBF07-3CJH
-S04
5018 RGB LED 光源
5.0 x 1.8 x 1.6 mm
0.2W
SMD LED 器件
地址:深圳市宝安区松岗街道东方大道 33 号
电话:0755-29573599 29573979
网址:http://www.tczmled.com
传真:0755-29573533
邮编:518106
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电话:0755-29573599
传真:0755-29573533
目 录
1、产品概述............................................................................................................. 3
2、特征说明............................................................................................................. 3
3、产品尺寸............................................................................................................. 3
4、RGB 光电特性...................................................................................................... 4
5、绝对最大值......................................................................................................... 4
6、光电特性曲线..................................................................................................... 5
7、包装..................................................................................................................... 6
8、可靠性测试......................................................................................................... 7
9、焊接说明............................................................................................................. 8
10、注意事项........................................................................................................... 9
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传真:0755-29573533
1. Description(产品描述)
5018RGB LED 是一款小尺寸侧发光贴装光源,实现 PCB 板安装后侧面照明效果。
氛围灯、背光、等侧发光装饰。RGB 三色调光效果应用。
2. Features(特征说明)
5.0X1.8X1.6mm SMD LED;(表面贴装元器件尺寸 5.0X1.8X1.6mm)
The materials of the LED dice is InGaN;(发光二极管所用的晶片材料是 InGaN)
Suitable for all SMT assembly and welding process;(适用于所用的 SMT 装配焊接工艺)
Moisture resistant grade :level 5a;
3. Package Dimensions(产品尺寸)
注:
a. 所有标注尺寸的单位均为 mm;
b. 除了特别注明,所有标注尺寸的公差均为±0.2mm;
c. 封装尺寸:5.0x1.8x1.6mm;
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传真:0755-29573533
4. Electro-optical characteristics at Ta=25℃(RGB 光电特性)
Item(项目)
Forward voltage
(正向电压)
Symbol
Mix
Typ
Max
Unit
Conditions
(符号) (最小) (平均) (最大) (单位) (测试条件)
VF
Reverse current
(反向电流)
Dominant
wavelength
(主波长)
Luminous intensity
(发光强度)
G
2.8
3.2
R
2.0
2.4
B
2.8
3.2
IR
λd
IV
--
--
5
G
520
525
R
620
625
B
465
470
G
1300
1800
R
500
700
B
300
500
V
IF=20mA
μA
VR = 5V
nm
IF=20mA
mcd
IF=20mA
5. Absolute maximum ratings at Ta=25℃(绝对最大额定值)
Parameters(参数)
Symbol(符号)
Value(值)
Unit(单位)
Power Dissipation(功耗)
Pd
200
mW
Forward Current(正向电流)
IF
20
mA
Pulse Forward Current(脉冲电流)
IFP
30
mA
Reverse Voltage(反向电压)
VR
5
V
Electrostatic Discharge(静电)
ESD
2000(HBM)
V
Operating Temperature(操作温度)
Topr
-40 ~ +85 ℃
℃
Storage Temperature(保存温度)
Tstg
-40 ~ +100 ℃
℃
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6. Typical optical characteristics curves(光电特性曲线)
Spectral Distribution
。 C)
Forward current vs.Forward Voltage(Ta=25
。 C)
Relative Intensity vs.Wavelength(Ta=25
1.2
。 C)
Relative Intensity vs.Forward Crrent(Ta=25
20
1.5
0.8
0.6
0.4
0.2
Relative Intensity
Forward Current(mA)
Relative Intensity
1.0
10
1.0
0.5
0.0
0.0
0.0
400
450
500
550 600 650 700
1.5 2.0 2.5 3.0 3.5 4.0 4.5
Wavelength[nm]
0
Forward Voltage VF(V)
10
20
30
Forward Current (mA)
Detrating
Relative Intensity vs.Ambient temperature
40
Forward Current(mA)
10
Relative Intensity
。 C)
Forward Crrent vs.Chromating (Ta=25
Ambient temperature vs.Maximun Forward Current
1.0
0.5
650
20
550
0
0.1
450
-50
0
50
0
100
20
40
60
80 100 120
0
。 C)
Ambient temperature Ta(25
。 C)
Ambient temperature Ta(25
10
20
30
Forward Current (mA)
Diagram characteristics of radiation
。
。
。
1.0
。
0.8
0.6
。
0.4
0.2
。
。
0
。
20
。
40
。
60
。
80
。
100
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7. Packaging Specifications(包装规格)
● Feeding Direction(进料方向)
卷盘尺寸:178x12mm
标签图示
Note: volume is 800pcs;每卷数量 800pcs;
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8. Reliability(可靠性)
TEST ITEMS AND RESULTS(测试项目和结果)
序号
Test Item
(测试项目)
Ref.Standard
(参考标准)
Test Conditions
(测试条件)
Note
(备注)
Conclusion
(结论)
1
Reflow
Soldering
(回流焊)
JESD22-B106
Tsld=240℃,10sec
3 times
0/22
2
Temperature
Cycle(温度循环)
JESD22-A104
-20℃ 30min
↑↓15min
120℃ 30min
200 cycle
0/100
3
Thermal Shock
(冷热冲击)
JESD22-A106
-40℃ 15min
↑↓15sec
125℃ 15min
200 cycle
0/100
4
High
Temperature
Storage
(高温存储)
JESD22-A103
Ta=100℃
1000 hrs
0/100
5
Low Temperature
Storage(低温存
储)
JESD22-A119
Ta=-40℃
1000 hrs
0/100
6
Power
temperature
Cycling
(点亮高低温循
环)
JESD22-A105
On5min-40℃>15min
↑ ↓
↑ ↓
15min
200 cycle
0/100
7
Life Test
(老化测试)
JESD22-A108
Ta=25℃
IF=60mA
1000 hrs
0/100
8
High Humidity
Heat Life Test
(高温高湿)
JESD22-A101
60℃ RH=90%
IF=60mA
1000 hrs
0/100
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9. Reflow profile(焊接说明)
SMD Reflow Soldering Instructions(回流焊简介)
a. Reflow soldering should not be done more than two times
回流焊次数不应超过 2 次
b. When soldering ,do not put stress on the LEDs during heating
焊接时,在加热过程中不能有应力作用于 LED 灯珠
Soldering iron(烙铁)
a. When hand soldering, keep the temperature of the iron under 300℃, and at that
temperature keep the time under 3 sec.
手工焊接时,烙铁温度控制在 300℃以下,且时间不可超过 3 秒
b. The hand soldering should be done only a time 手工焊接只可焊接一次;
Rework(返工)
a. Customer must finish rework within 5 sec under 240℃
温度保持在 240℃以下,5 秒内完成返工作业
b. The head of iron can not touch the LEDs
烙铁不能碰触到 LED 灯珠
c. Twin-head type is preferred.双头形烙铁为最佳
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10.
传真:0755-29573533
CAUTIONS(注意事项)
Note for use 使用注意事项
a、 Incoming material inspection: ensure the vacuum packing is intact and there is no
vacuum leakage. If there is vacuum leakage, please confirm whether the reflow welding is
abnormal. If it is abnormal, please return to the factory for high-temperature
dehumidification.
来料检验:确保真空包装完好,无漏真空现象,如有漏真空请确认回流焊是否异常,如异常
需返厂重新高温除湿;
b、 Use: Please confirm the first piece before the formal SMT. According to the principle
of one pack and one package, the lamp bead should not be exposed to air for more than
4 hours. The lamp bead should be reflow welded within 2 hours after the SMT is finished.
使用:正式贴片前请先做好首件确认,使用时按拆一包用一包的原则,灯珠裸露在空气中不得
超过 4 小时,贴片完成灯珠需在 2 小时以内过完回流焊,使用锡膏为中低温锡膏,回流焊最高
温度不得超过 240 度;
c、 Maintenance: material should be completed within 4 hours and domestic demand after
reflow soldering test and repair the lamp bead, such as more than 4 hours need to repair
the lamp plate temperature above 65 ℃ dehumidification 12 hours to repair work, and
repair the lamp bead also must carry on the low temperature above 65 ℃ dehumidification
12 hours, use prohibited in the process of maintenance with temperature over 240 ℃
heating machine repair, prohibit the whole plate placed in the heating stage repair,
follow the principle of bad which return which measuring.
维修:材料在回流焊后 4 小时内需完成测试和维修灯珠,如超过 4 小时需将要维修灯板低
温 65℃除湿 12 小时以上才可进行维修作业,且维修所需的灯珠也要进行低温 65℃除湿 12 小时以
上才可使用,维修过程中禁止用温度超过 240℃加热台进行返修,禁止整板放置于加热台上返修,
遵循坏哪颗返哪颗的原则。
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传真:0755-29573533
d、Warm prompt: the whole process special considerations for light bead before use
vacuum packing, dehumidification, SMT placement time and workshop of temperature and
humidity control, product maintenance lamp plate if bare at room temperature environment
for a long time need to dehumidification, light board and light bead light beads as LED
electronic products, need to pay attention to moisture in spring and summer, autumn and
winter anti-static, product quality is enterprise's life, to the quality strives for the
survival, to the quality strives for the development is our consistent aim.Also in order
to ensure the quality of the client, please strictly refer to the above recommendations
温馨提示:整个工序特别注意事项为灯珠使用前真空包装、除湿后贴片放置时间和车间的温
湿度管控,产品维修时灯板如裸露在室温环境时间过长灯板和灯珠需进行除湿,灯珠为 LED 电子元
器件产品,需注意春夏季防潮,秋冬季防静电,产品品质就是一家企业的生命,以质量求生存,以
质量求发展是我司的一贯宗旨。也为保证客户端品质,请严格参照以上建议操作。
The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft
surface on the top of package.
the reliability of the LEDs.
on the encapsulated part.
The pressure to the top surface will be influence to
Precautions should be taken to avoid the strong pressure
So when using the picking up nozzle, the pressure on the
silicone resin should be proper.
封装的 LED 为硅材料。该 LED 具有软表面的封装顶部。顶部表面的压力会影响 LED 的可靠
性。应采取预防措施,以避免有过大的压力作用于在封装件上。因此,在选用吸嘴时,应适用
于有机硅树脂的压力。
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