XD3232

XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 D External Capacitors . . . 4 × 0.1 µF D Accepts 5-V Logic Input With 3.3-V Supply D Alternative High-Speed Pin-Compatible D RS-232 Bus-Pin ESD Protection Exceeds D D D D D ±15 kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s Two Drivers and Two Receivers Low Supply Current . . . 300 µA Typical C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 D Device (1 Mbit/s) XD/XL3232 Applications − Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 The XD/XL3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets therequirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communicationcontroller and the serial-port connector. The charge pump and four small external capacitors allow operationfrom a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/µs driver output slew rate. Function Tables EACH DRIVER INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level EACH RECEIVER INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off logic diagram (positive logic) 11 14 DIN1 DOUT1 10 7 DIN2 DOUT2 12 13 ROUT1 RIN1 9 8 ROUT2 RIN2 2 XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V Input voltage range, V I: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V Output voltage range, VO: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Package thermal impedance, θJA (see Notes 2 and 3): 3232 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 °C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), θJA , and TA . The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ (max) − TA)/θ JA. Operating at the absolute maximum T J of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4 and Figure 4) VCC = 3.3 V VCC = 5 V Supply voltage Driver high-level input voltage VIL Driver low-level input voltage DIN Driver input voltage DIN VI Receiver input voltage TA Operating free-air temperature DIN VCC = 3.3 V VCC = 5 V VIH XD/XL3232 MIN NOM MAX 3 3.3 3.6 4.5 5 5.5 UNIT V 2 V 2.4 0.8 0 5.5 −25 25 0 70 −40 85 V V °C NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS ICC MIN TYP‡ Supply current No load, VCC = 3.3 V or 5 V 0.3 ‡ All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. 3 MAX 1 UNIT mA XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS MIN TYP† VOH VOL High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC −5 −5.4 IIH IIL High-level input current VI = VCC VI at GND IOS‡ Low-level input current Short-circuit output current VCC = 3.6 V, VCC = 5.5 V, VO = 0 V VO = 0 V MAX UNIT V V ±0.01 ±1 µA ±0.01 ±1 µA ±35 ±60 mA ro Output resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 10M W † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. ‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS Maximum data rate CL = 1000 pF, One DOUT switching, RL = 3 kΩ, See Figure 1 tsk(p) Pulse skew§ CL = 150 pF to 2500 pF RL = 3 kΩ to 7 kΩ, See Figure 2 SR(tr) Slew rate, transition region (see Figure 1) RL = 3 kΩ to 7 kΩ, VCC = 3.3 V MIN TYP† 150 250 kbit/s 300 ns CL = 150 pF to 1000 pF 6 30 CL = 150 pF to 2500 pF 4 30 † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. § Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. 4 MAX UNIT V/µs XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER VOH VOL TEST CONDITIONS High-level output voltage MIN IOH = −1 mA IOL = 1.6 mA Low-level output voltage VIT+ Positive-going input threshold voltage VCC = 3.3 V VCC = 5 V VIT− Negative-going input threshold voltage VCC = 3.3 V VCC = 5 V Vhys ri Input hysteresis (VIT+ − VIT−) VCC−0.6 V TYP† MAX UNIT VCC−0.1 V V 0.4 1.5 2.4 1.8 2.4 0.6 1.2 0.8 1.5 V V V 0.3 V VI = ±3 V to ±25 V 3 5 † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. Input resistance 7 kW switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 3) PARAMETER tPLH tPHL TEST CONDITIONS Propagation delay time, low- to high-level output CL= 150 pF Propagation delay time, high- to low-level output MIN TYP† MAX UNIT 300 ns 300 ns Pulse skew‡ tsk(p) 300 † All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. ‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at VCC = 5 V ± 0.5 V. ns PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tTHL CL (see Note A) Output tTLH 3V −3 V TEST CIRCUIT SR(tr) + t THL 6V or t 3V −3 V VOH VOL VOLTAGE WAVEFORMS TLH NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 5 XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL tPLH VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 APPLICATION INFORMATION 1 + CBYPASS − = 0.1µF + C1 − VCC 16 C1+ 2 †+ C3 − 3 4 V+ GND 14 DOUT1 C1− 13 C2+ + C2 15 RIN1 5 kΩ − 5 C2− 12 6 C4 DOUT2 RIN2 − V− 11 ROUT1 DIN1 + 7 10 8 9 DIN2 ROUT2 5 kΩ † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.047 µF 0.1 µF 0.1 µF 0.33 µF 0.47 µF Figure 4. Typical Operating Circuit and Capacitor Values 7 XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 SOP16 8 XL3232 SOP16 XD3232 DIP16 RS-232 接口集成电路 DIP16 −A− 16 9 B 1 8 F C L S −T− SEATING PLANE K H J G D 16 PL 0.25 (0.010) M T A M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. INCHES DIM MIN MAX A 0.740 0.770 B 0.250 0.270 C 0.145 0.175 D 0.015 0.021 F 0.040 0.70 G 0.100 BSC H 0.050 BSC J 0.008 0.015 K 0.110 0.130 L 0.295 0.305 M 0_ 10_ S 0.020 0.040 9 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01 M