XD17358

XL17358 SOP-8 XD17358 DIP-8 Description XDXL/17358 series are dual operational amplifier that provide high gain and internal phase compensation, with single power supply. They can be widely applied to control equipments and to general use. Features • Wide range of supply voltage, and single power supply used • Wide range of common mode voltage, and possible to operate with an input about 0 V, and output around 0 V is available • Frequency characteristics and input bias current are temperature compensated • Low electro-magnetic susceptibility level Measurement Condition Output Offset Voltage vs. Input Interference 5.0 Rs Rs − + Rf 0.01 µ Vin −10 dBm RF signal source (for quasi-RF noise) Vout V _ (= 100∗Vio) Output offset voltage (arb. unit) Rf Vcc = +7.5 V Vee = −7.5 V 4.0 XDXL/17358 series 3.0 2.0 Improvement 1.0 XDXL/17358 series 0 −1.0 100E+3 1 1E+6 10E+6 100E+6 1E+9 Input RF frequency (Hz) 10E+9 XL17358 SOP-8 XD17358 DIP-8 Pin Arrangement Vout1 Vin(−)1 1 2 Vin(+)1 3 GND 4 1 − + 2 + − 8 VCC 7 Vout2 6 Vin(−)2 5 Vin(+)2 (Top View) Circuit Schematic (1/2) Q5 Vin(−) Q1 Q2 Q3 Q4 Q6 C Q7 R1 Vin(+) Vout Q11 Q10 Q8 Q9 2 Q13 Q12 XL17358 SOP-8 XD17358 DIP-8 Absolute Maximum Ratings (Ta = 25°C) Ratings Item Symbol Supply voltage VCC Sink current Isink XDXL/17358 32 Unit V mA 50 1 Power dissipation PT 570 * Common mode input voltage VCM −0.3 to VCC V Differential input voltage Vin (diff) ±VCC V Operating temperature Topr −40 to +85 °C Storage temperature Tstg −55 to +125 °C mW Notes: 1. This is the allowable values up to Ta = 50°C. Derate by 8.3 mW/°C. 2. These are the allowable values up to Ta = 25°C mounting in air. When it is mounted on glass epoxy board of 40 mm × 40 mm × 1.5 mmt with 30% wiring density, the allowable value is 570 mW up to Ta = 45°C. If Ta > 45°C, derate by 7.14 mW/°C. 3 XL17358 SOP-8 XD17358 DIP-8 Electrical Characteristics (VCC = +15 V, Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Input offset voltage VIO — 3 7 mV VCM = 7.5V, RS = 50Ω, Rf = 50kΩ Input offset current IIO — 5 50 nA VCM = 7.5V, IIO = | II (+) – II (–) | Input bias current IIB — 30 250 nA VCM = 7.5V Power source rejection ratio PSRR — 93 — dB RS = 1kΩ, Rf = 100kΩ Voltage gain AVD 75 90 — dB RL = ∞, RS = 1kΩ, Rf = 100kΩ Common mode rejection ratio CMR — 80 — dB RS = 50Ω, Rf = 5kΩ Common mode input voltage range VCM (+) 13.5 — — V RS = 1kΩ, Rf = 100kΩ VCM (–) — — –0.3 V RS = 1k•, Rf = 100kΩ Peak-to-peak output voltage Vop-p — 13.6 — V f = 100Hz, RL = 20kΩ, RS = 1kΩ, Rf = 100kΩ Output source current Iosource 20 40 — mA VIN = 1V, VIN = 0V, VOH = 10V Output sink current Iosink 10 20 — mA VIN = 1V, VIN = 0V, VOL = 2.5V Output sink current Iosink 15 50 — µA VIN = 1V, VIN = 0V, Vout = 200mV + – – + – + Supply current ICC — 0.8 2 mA VIN = GND, RL = ∞ Slew rate SR — 0.2 — V/µs RL = ∞, VCM = 7.5V, f = 1.5kHz Channel separation CS — 120 — dB f = 1kHz 4 XL17358 SOP-8 XD17358 DIP-8 Input Bias Current vs. Ambient Temperature Output Source Current vs. Ambient Temperature 80 VCC = 15 V 70 VOH = 10 V 60 80 Input bias current IIB (nA) Output source current Iosource (mA) Characteristic Curves 50 40 30 20 10 0 −20 0 20 40 60 Ambeint temperature Ta (°C) VCC = 15 V VCM = 7.5 V 70 60 50 40 30 20 10 0 −20 80 Ta = 25°C Input bias current IIB (nA) Supply current ICC (mA) 80 3 2 1 0 8 16 24 32 Supply voltage VCC (V) 40 20 0 40 Maximum output voltage VOP-P (V) Voltage gain AVD (dB) 8 16 24 32 Supply voltage VCC (V) 40 Maxlmum Output Voltage vs. Frequency 160 Ta = 25°C RL = ∞ 120 80 40 8 16 24 32 Supply voltage VCC (V) Ta = 25°C 60 Voltage Gain vs. Supply Voltage 0 80 Input Bias Current vs. Supply Voltage Supply Current vs. Supply Voltage 4 0 20 40 60 Ambeint temperature Ta (°C) 40 5 20 VCC = 15 V Ta = 25°C RL = 20 kΩ 16 12 8 4 0 1k 3k 10 k 30 k 100 k 300 k Frequency f (Hz) 1M XL17358 SOP-8 XD17358 DIP-8 Voltage Gain vs. Frequency 120 VCC = 15V Ta = 25°C RL = ∞ 80 60 40 20 0 1 3 10 30 100 300 1k 3k Frequency f (Hz) 10 k 30 k 100 k 300 k Common Mode Rejection Ratio vs. Frequency 120 Common mode rejection ratio CMR (dB) Voltage gain AVD (dB) 100 VCC = 15V Ta = 25°C RS = 50 Ω 100 80 60 40 20 0 100 300 1k 3 k 10 k 30 k Frequency f (Hz) 6 100 k 300 k 1M 1M XL17358 SOP-8 XD17358 DIP-8 Solder Mounting Method 1. Small and light surface-mount packages require spicial attentions on solder mounting. On solder mounting, pre-heating before soldering is needed. The following figure show an example of infrared rays refow. Temperature 2. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress. Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic substrates. 235°C Max 10 s Max 140 to 160°C ≅ 60 s 1 to 4°C/s 1 to 5°C/s Time (s) Figure 1 An Example of Infrared Rays Reflow Conditions 7 XL17358 SOP-8 XD17358 DIP-8 Package Dimensions Unit: mm 6.3 7.4 Max 9.6 10.6 Max 8 5 1 0.89 4 1.3 7.62 0.5 Min 2.54 Min 5.06 Max 1.27 Max + 0.10 0.25 − 0.05 0.48 ± 0.10 2.54 ± 0.25 0° − 15° Unit: mm 4.85 4.4 5.25 Max 5 8 1 2.03 Max *0.22 ± 0.05 0.20 ± 0.04 4 0.75 Max 0.25 6.50 +– 0.15 1.05 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 0˚ – 8˚ 0.25 0.60 +– 0.18 0.15 0.12 M 8