5.0
SS22 THRU SS2200
Reverse Voltage - 20 to 200 Volts
Forward Current - 2.0 Ampere
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
Features
DO-214AC/SMA
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Metal silicon junction,majority carrier conduction
Low power loss,high efficiency
0.110(2.80)
0.094(2.40)
0.067 (1.70)
0.039 (1.00)
Built-in strain relief,ideal for automated placement
High forward surge current capability
High temperature soldering guaranteed:
0.177(4.50)
0.157(3.99)
0.012(0.305)
0.006(0.152)
250 °C/10 seconds at terminals
0.087(2.20)
0.078(1.90)
0.059(1.50)
0.035(0.90)
0.008(0.203)MAX.
Mechanical Data
0.205(5.20)
0.188(4.80)
Case: JEDEC DO-214AC/SMA molded plastic body
Terminals: Solderable per MIL-STD-750,Method 2026
Polarity: Color band denotes cathode end Mounting
Position: Any
Weight : 0.003 ounce, 0.093 grams
Dimensions in inches and (millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
SYMBOLS
Marking Code
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at TL(see fig.1)
Peak forward surge current
8.3ms single half sine-wave
superimposed onrated load (JEDEC Method)
Maximum instantaneous forward voltage at 2.0A
Maximum DC reverse current
at rated DCblocking voltage
TA=25℃
TA=125℃
Typical junction capacitance (NOTE 1)
VRMM
VRMS
VDC
SS23
SS24
SS25
SS26
SS28
SS210
SS2150
SS2200
MDD
SS22
MDD
SS23
MDD
SS24
MDD
SS25
MDD
SS26
MDD
SS28
MDD
SS210
MDD
SS2150
MDD
SS2200
20
14
20
30
21
30
40
28
40
50
35
50
60
42
60
80
56
80
100
70
100
150
105
150
200
140
200
V
V
V
2.0
A
IFSM
50
A
VF
0.55
Operating junction temperature range
TJ
TSTG
0.85
0.70
0.5
10.0
IR
CJ
RJA
5.0
220
0.95
0.2
2.0
180
pF
75.0
-50 to +125
℃/W
℃
-50 to +150
℃
-50 to +150
DN:T20515A0
Rev:2020A0
V
mA
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas
http://www.microdiode.com
UNITS
I(AV)
Typical thermal resistance (NOTE 2)
Storage temperature range
SS22
Page :1
SS22 THRU SS2200
Reverse Voltage - 20 to 200 Volts
Forward Current - 2.0 Ampere
Typical Characterisitics
Fig.2 Typical Reverse Characteristics
Average Forward Current (A)
3.0
2.5
2.0
1.5
1.0
0.5
Single phase half-wave 60 Hz
resistive or inductive load
0.0
25
50
75
100
125
150
Instaneous Reverse Current ( μA)
Fig.1 Forward Current Derating Curve
10 4
T J =75°C
10 2
SS22/SS24
SS26-SS2200
10
1
T J =25°C
10 0
0
Case Temperature (°C)
40
60
80
100
Fig.4 Typical Junction Capacitance
500
Junction Capacitance (pF)
20
10
1.0
SS22/SS24
SS26/SS28
SS210
SS2150/SS2200
0.1
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
T J =25°C
200
100
50
SS22/SS24
20
SS26-SS2200
10
1.8
0.1
60
50
40
30
20
8.3 ms Single Half Sine Wave
(JEDEC Method)
00
1
10
Number of Cycles at 60Hz
100
Transient Thermal Impedance( °C /W)
Fig.5 Maximum Non-Repetitive Peak
Forward Surge Current
10
10
1
100
Reverse Voltage (V)
Instaneous Forward Voltage (V)
Peak Forward Surge Current (A)
20
Percent of Rated Peak Reverse Voltage(%)
Fig.3 Typical Forward Characteristic
Instaneous Forward Current (A)
T J =100°C
10 3
Fig.6- Typical Transient Thermal Impedance
100
10
1
0.01
0.1
1
10
100
t, Pulse Duration(sec)
The curve above is for reference only.
http://www.microdiode.com
Rev:2020A0
Page :2
SS22 THRU SS2200
Reverse Voltage - 20 to 200 Volts
Forward Current - 2.0 Ampere
Packing information
unit:mm
P0
Item
P1
Symbol
Tolerance
SMA
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.05
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.80
5.33
2.36
1.50
330.00
50.00
178.00
62.00
13.00
1.75
5.50
4.00
4.00
2.00
0.28
12.00
18.00
d
E
F
B
A
W
P
D2
T
D1
C
W1
D
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
Reel packing
PACKAGE
SMA
REEL SIZE
7"
APPROX.
GROSS WEIGHT
(kg)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
INNER
BOX
(m/m)
REEL
DIA,
(m/m)
2,000
4.0
4,000
183*155*183
178
382*356*392
80,000
16.0
10,000
290*290*38
330
310*310*360
80,000
11.0
15,000
335*335*38
330
350*330*360
120,000
14.5
REEL
(pcs)
SMA
11"
5,000
4.0
SMA
13"
7,500
4.0
CARTON
SIZE
(m/m)
CARTON
(pcs)
Suggested Pad Layout
Symbol
Unit (mm)
A
1.68
Unit (inch)
0.066
B
1.52
0.060
C
3.90
0.154
D
2.41
0.095
E
5.45
0.215
Important Notice and Disclaimer
Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and
specifications at any time without notice. Customers should obtain and confirm the latest product information and
specifications before final design,purchase or use.
Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application
assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with
products which are purchased or used for any unintended or unauthorized application.
No license is granted by implication or otherwise under any intellectual property rights of Microdiode
Electronics (Jiangsu).
Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support
devices or systems without express written approval of Microdiode Electronics (Jiangsu).
http://www.microdiode.com
Rev:2020A0
Page :3
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