SS22

5.0 SS22 THRU SS2200 Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER Features DO-214AC/SMA  The plastic package carries Underwriters Laboratory Flammability Classification 94V-0  For surface mounted applications  Metal silicon junction,majority carrier conduction  Low power loss,high efficiency 0.110(2.80) 0.094(2.40) 0.067 (1.70) 0.039 (1.00)  Built-in strain relief,ideal for automated placement  High forward surge current capability  High temperature soldering guaranteed: 0.177(4.50) 0.157(3.99) 0.012(0.305) 0.006(0.152) 250 °C/10 seconds at terminals 0.087(2.20) 0.078(1.90) 0.059(1.50) 0.035(0.90) 0.008(0.203)MAX. Mechanical Data 0.205(5.20) 0.188(4.80) Case: JEDEC DO-214AC/SMA molded plastic body Terminals: Solderable per MIL-STD-750,Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight : 0.003 ounce, 0.093 grams Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics Ratings at 25 C ambient temperature unless otherwise specified. Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%. Parameter SYMBOLS Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL(see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed onrated load (JEDEC Method) Maximum instantaneous forward voltage at 2.0A Maximum DC reverse current at rated DCblocking voltage TA=25℃ TA=125℃ Typical junction capacitance (NOTE 1) VRMM VRMS VDC SS23 SS24 SS25 SS26 SS28 SS210 SS2150 SS2200 MDD SS22 MDD SS23 MDD SS24 MDD SS25 MDD SS26 MDD SS28 MDD SS210 MDD SS2150 MDD SS2200 20 14 20 30 21 30 40 28 40 50 35 50 60 42 60 80 56 80 100 70 100 150 105 150 200 140 200 V V V 2.0 A IFSM 50 A VF 0.55 Operating junction temperature range TJ TSTG 0.85 0.70 0.5 10.0 IR CJ RJA 5.0 220 0.95 0.2 2.0 180 pF 75.0 -50 to +125 ℃/W ℃ -50 to +150 ℃ -50 to +150 DN:T20515A0 Rev:2020A0 V mA Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.P.C.B. mounted with 0.2x0.2”(5.0x5.0mm) copper pad areas http://www.microdiode.com UNITS I(AV) Typical thermal resistance (NOTE 2) Storage temperature range SS22 Page :1 SS22 THRU SS2200 Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere Typical Characterisitics Fig.2 Typical Reverse Characteristics Average Forward Current (A) 3.0 2.5 2.0 1.5 1.0 0.5 Single phase half-wave 60 Hz resistive or inductive load 0.0 25 50 75 100 125 150 Instaneous Reverse Current ( μA) Fig.1 Forward Current Derating Curve 10 4 T J =75°C 10 2 SS22/SS24 SS26-SS2200 10 1 T J =25°C 10 0 0 Case Temperature (°C) 40 60 80 100 Fig.4 Typical Junction Capacitance 500 Junction Capacitance (pF) 20 10 1.0 SS22/SS24 SS26/SS28 SS210 SS2150/SS2200 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 T J =25°C 200 100 50 SS22/SS24 20 SS26-SS2200 10 1.8 0.1 60 50 40 30 20 8.3 ms Single Half Sine Wave (JEDEC Method) 00 1 10 Number of Cycles at 60Hz 100 Transient Thermal Impedance（ °C /W） Fig.5 Maximum Non-Repetitive Peak Forward Surge Current 10 10 1 100 Reverse Voltage (V) Instaneous Forward Voltage (V) Peak Forward Surge Current (A) 20 Percent of Rated Peak Reverse Voltage（%） Fig.3 Typical Forward Characteristic Instaneous Forward Current (A) T J =100°C 10 3 Fig.6- Typical Transient Thermal Impedance 100 10 1 0.01 0.1 1 10 100 t, Pulse Duration（sec） The curve above is for reference only. http://www.microdiode.com Rev:2020A0 Page :2 SS22 THRU SS2200 Reverse Voltage - 20 to 200 Volts Forward Current - 2.0 Ampere Packing information unit:mm P0 Item P1 Symbol Tolerance SMA A B C d D D1 D D1 D2 E F P P0 P1 T W W1 0.1 0.1 0.1 0.05 2.0 min 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 2.80 5.33 2.36 1.50 330.00 50.00 178.00 62.00 13.00 1.75 5.50 4.00 4.00 2.00 0.28 12.00 18.00 d E F B A W P D2 T D1 C W1 D Carrier width Carrier length Carrier depth Sprocket hole 13" Reel outside diameter 13" Reel inner diameter 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. Reel packing PACKAGE SMA REEL SIZE 7" APPROX. GROSS WEIGHT (kg) COMPONENT SPACING (m/m) BOX (pcs) INNER BOX (m/m) REEL DIA, (m/m) 2,000 4.0 4,000 183*155*183 178 382*356*392 80,000 16.0 10,000 290*290*38 330 310*310*360 80,000 11.0 15,000 335*335*38 330 350*330*360 120,000 14.5 REEL (pcs) SMA 11" 5,000 4.0 SMA 13" 7,500 4.0 CARTON SIZE (m/m) CARTON (pcs) Suggested Pad Layout Symbol Unit (mm) A 1.68 Unit (inch) 0.066 B 1.52 0.060 C 3.90 0.154 D 2.41 0.095 E 5.45 0.215 Important Notice and Disclaimer Microdiode Electronics (Jiangsu) reserves the right to make changes to this document and its products and specifications at any time without notice. Customers should obtain and confirm the latest product information and specifications before final design,purchase or use. Microdiode Electronics (Jiangsu) makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, not does Microdiode Electronics (Jiangsu) assume any liability for application assistance or customer product design. Microdiode Electronics (Jiangsu) does not warrant or accept any liability with products which are purchased or used for any unintended or unauthorized application. No license is granted by implication or otherwise under any intellectual property rights of Microdiode Electronics (Jiangsu). Microdiode Electronics (Jiangsu) products are not authorized for use as critical components in life support devices or systems without express written approval of Microdiode Electronics (Jiangsu). http://www.microdiode.com Rev:2020A0 Page :3