GT23L16U2Y 2*3

深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 GT23L16U2Y 标准点阵汉字库芯片 V1.4 II_J 2020-12 www.genitop.com www.gaotonggroup.cn 1 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 版本修订记录 版本号 修改内容 日期 V 1.0I_A 原始版本 2011-12 V1.1Ⅰ_A 8X16 ASCII 字符位置下调 2012-02 V1.2Ⅰ_A 增加 8X16 ASCII 定制字库，高通输入法码表 2012-02 备注 替换 8X16 ASCII 字符,增加 8X16 ASCII 粗体 V1.3Ⅰ_A 字符,增加 96 个 12 点阵，16 点阵不等宽 ASCII 2012-03 字符,增加条形码（W） V1.4Ⅰ_A 增加 GB/T 条形码图库(W) 2012-04 V1.4 II_B 调用程序升级 2012-04 V1.4 II_C Datasheet 格式修改 2012-07 V1.4 II_D 修改芯片特点和电子特性 2015-07 V1.4 II_E 更新字库 AC/DC 参数 V1.4 II_F V1.4 II_G 添加上电时序 2017-03 2019-06 时钟频率由 50MHZ 更新为 45MHZ,DFN4X4 2019-07 封装更新为 DEN8 2X3 封装 V1.4 II_H 删除 ASCII 码 6X12 点阵 2019-08 V1.4 II_I 更新规格书样张、验证数据 2020-03 V1.4 II_J 更新 AC/DC 2020-12 2 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 目 录 1 概述························································································································· 4 1.1 芯片特点·····································································································································4 1.2 芯片内容·····································································································································5 1.3 字型样张·····································································································································6 2 操作指令···················································································································7 2.1 Instruction Parameter(指令参数)··········································································································7 2.2 Read Data Bytes（一般读取）··········································································································· 7 2.3 Read Data Bytes at Higher Speed（快速读取点阵数据）··········································································· 8 2.4 深度睡眠模式指令（B9H）··············································································································9 2.5 唤醒深度睡眠模式指令（ABH）······································································································· 9 3 引脚描述与电路连接·································································································· 10 3.1 引脚配置··································································································································· 10 3.2 引脚描述···································································································································· 10 3.3 SPI 接口与主机接口参考电路示意图································································································· 11 4 电气特性················································································································· 12 4.1 绝对最大额定值·························································································································· 12 4.2 DC 特性····································································································································· 12 4.3 AC 特性····································································································································· 12 4.4 上电时序··································································································································· 14 5 封装尺寸················································································································· 15 6 字库排置（竖置横排）······························································································· 16 6.1 点阵排列格式····························································································································· 16 6.2 5X16 点汉字排列格式举例··············································································································16 6.3 16 点阵不等宽 ASCII（圆角字体）字符排列格式·················································································16 7 点阵数据验证（客户参考用）·······················································································18 3 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 1 概述 GT23L16U2Y是一款12x12，16x16点阵的Unicode字库芯片，支持GB2312国标汉字。排列格式 为竖置横排。用户通过字符内码，利用我司所提供库文件内的函数接口可直接读取该内码的点阵信 息。此芯片支持高通汉字输入法，详情请参考输入法资料包。 1.1 芯片特点      数据总线：SPI 串行总线接口 点阵排列方式：竖置横排 时钟频率：45MHz(max.) @3.3V 工作电压：2.7V~3.6V 电流： 工作电流：5 -15mA 睡眠电流：1-5uA    工作温度：-40℃~85℃ 封装：DFN8-2X3 字符集： 中文 GB2312 兼容 UNICODE 条形码 GT 输入法  字号： 12x12、16x16 点阵 4 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 1.2 芯片内容 字库 字号 字符数 字体 排列方式 ASCII 5x7 96 标准 Y-竖置横排 ASCII 7x8 96 标准 Y-竖置横排 ASCII 8x16 96 标准 Y-竖置横排 ASCII 8x16 96 粗体 Y-竖置横排 ASCII 12 点阵不等宽 96 圆角字体 Y-竖置横排 ASCII 16 点阵不等宽 96 圆角字体 Y-竖置横排 GB2312 汉字 12x12 6763+470 宋体 Y-竖置横排 GB2312 汉字 16x16 6763+470 宋体 Y-竖置横排 Unicode 12x12 20902+6582 宋体 Y-竖置横排 Unicode 16x16 20902 宋体 Y-竖置横排 12x27 60 标准 W-横置横排 16x20 107 标准 W-横置横排 字符集 ASCII 字符集 GB2312 字符集 Unicode V3.0 / V1.0 字符 集 条形码字符 其它图符集 EAN13 条形码字符 CODE128 Unicode→GB2312 转码表 GB2312→Unicode 内码转换表 高通输入法码表 5 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 1.3 字型样张 1.3.1 汉字点阵字符 点阵 字体 12 点 宋体 标准 中文字体样张图 国标 16 点 宋体 1.3.2 ASCII 点阵字符 点阵 字体 5x7 标准 7x8 标准 8x16 标准 标准 ASCII 字符样张 ASCII 8x16 粗体 12 点 圆角 16 点 圆角 6 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 2 操作指令 2.1 Instruction Parameter(指令参数) Instruction Code(One-Byte) Instruction Description READ Read Data Bytes 0000 0011 FAST_READ Read Data Bytes at Higher Speed 0000 1011 Address Bytes Dummy Bytes Data Bytes 03 h 3 — 1 to ∞ 0B h 3 1 1 to ∞ 所有对本芯片 SPI 接口的操作只有 2 个，那就是 Read Data Bytes (READ “一般读取”)和 Read Data Bytes at Higher Speed (FAST_READ “快速读取点阵数据”)。. 2.2 Read Data Bytes（一般读取） Read Data Bytes 需要用指令码来执行每一次操作。READ 指令的时序如下(图)：  首先把片选信号（CS#）变为低，紧跟着的是 1 个字节的命令字（03 h）和 3 个字节的地 址和通过串行数据输入引脚（SI）移位输入，每一位在串行时钟（SCLK）上升沿被锁存。  然后该地址的字节数据通过串行数据输出引脚（SO）移位输出，每一位在串行时钟（SCLK） 下降沿被移出。  读取字节数据后，则把片选信号（CS#）变为高，结束本次操作。 如果片选信号（CS#）继续保持为底，则下一个地址的字节数据继续通过串行数据输出引脚 （SO）移位输出。 图：Read Data Bytes (READ) Instruction Sequence and Data-out sequence: 7 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 2.3 Read Data Bytes at Higher Speed（快速读取点阵数据） Read Data Bytes at Higher Speed 需要用指令码来执行操作。READ_FAST 指令的时序如下(图)：  首先把片选信号（CS#）变为低，紧跟着的是 1 个字节的命令字（0B h）和 3 个字节的地 址以及一个字节 Dummy Byte 通过串行数据输入引脚（SI）移位输入，每一位在串行时钟 （SCLK）上升沿被锁存。  然后该地址的字节数据通过串行数据输出引脚（SO）移位输出，每一位在串行时钟（SCLK） 下降沿被移出。  如果片选信号（CS#）继续保持为底，则下一个地址的字节数据继续通过串行数据输出引 脚（SO）移位输出。例：读取一个 15x16 点阵汉字需要 32Byte，则连续 32 个字节读取后 结束一个汉字的点阵数据读取操作。 如果不需要继续读取数据，则把片选信号（CS#）变为高，结束本次操作。 图：Read Data Bytes at Higher Speed (READ_FAST) Instruction Sequence and Data-out sequence: 8 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 2.4 深度睡眠模式指令（B9H） 一旦字库芯片进入深度睡眠模式，所有的命令将被忽略，除了唤醒深度睡眠模式指令，首先 首先 CS#为低电平，输入 B9H 命令，然后然后 CS#变为高电平并持续 TDP 的时间(TDP=25us)， 在 TDP 的持续时间内，字库芯片进入深层关机模式。 深度睡眠模式指令的时序波形图 2.5 唤醒深度睡眠模式指令（ABH） 首 先 CS# 为 低 电平 ， 向 字 库芯 片 发 送 ABH 指 令 ，然 后 CS# 变 为 高电 平 并 持 续 Tres1 的 时 间 (Tres1=25us)，字库芯片将恢复正常运行，CS#引脚必须在 Tres1 时间内保持高电平。 唤醒深度睡眠模式指令的时序波形图 9 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 3 引脚描述与电路连接 3.1 引脚配置 DNF8-2X3 3.2 引脚描述 DFN8-2X3 NO. 名称 I/O 1 GND 2 NC 3 SI I 串行数据输入 (Serial data input) 4 SCLK I 串行时钟输入（Serial clock input） 5 HOLD# I 总线挂起（Hold, to pause the device without） 6 VDD 7 CS# I 片选输入（Chip enable input） 8 SO O 串行数据输出 (Serial data output) 描述 地(Ground) 悬空 电源(+ 3.3V Power Supply) 串行数据输出（SO）：该信号用来把数据从芯片串行输出，数据在时钟的下降沿移出。 串行数据输入（SI）：该信号用来把数据从串行输入芯片，数据在时钟的上升沿移入。 串行时钟输入（SCLK）：数据在时钟上升沿移入，在下降沿移出。 片选输入（CS#）：所有串行数据传输开始于CS#下降沿，CS#在传输期间必须保持为低电平， 在两条指令之间保持为高电平。 10 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 总线挂起输入（HOLD#）： 该信号用于片选信号有效期间暂停数据传输，在总线挂起期间，串行数据输出信号处于高阻态， 芯片不对串行数据输入信号和串行时钟信号进行响应。 当HOLD#信号变为低并且串行时钟信号（SCLK）处于低电平时，进入总线挂起状态。 当HOLD#信号变为高并时串行时钟信号（SCLK）处于低电平时，结束总线挂起状态。 HOLD CONDITION ACTIVATION: CE# 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK parameter HOLD# HOLD CONDITION HOLD CONDITION 3.3 SPI 接口与主机接口参考电路示意图 SPI 与主机接口电路连接可以参考下图（#HOLD 管脚建议接 2K 电阻 3.3V 拉高）。 GT2X SPI 接口与主机接口参考电路示意图 11 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 4 电气特性 4.1 绝对最大额定值 Symbol Parameter Min. Max. Unit TOP Operating Temperature -40 85 ℃ TSTG Storage Temperature -65 150 ℃ VDD Supply Voltage -0.3 3.6 V VIN Input Voltage -0.3 VDD+0.3 V GND Power Ground -0.3 0.3 V Condition 4.2 DC 特性 Condition：TOP =-40℃ to 85℃，GND=0V Symbol Parameter Min. Max. Unit Condition IDD VDD Supply Current(active) 5 15 mA ISB VDD Standby Current 5 15 uA /CS=VDD,VIN= VDD or VSS Icc2 Deep Power-Down Current 1 5 uA /CS=VDD,VIN= VDD or VSS VIL Input LOW Voltage -0.5 0.2VDD V VIH Input HIGH Voltage 0.7VDD VDD+0.4 V VOL Output LOW Voltage 0.2 (IOL=1.6mA) V VDD=2.7~3.6V VOH Output HIGH Voltage VDD-0.2 (IOH=-100uA) ILI Input Leakage Current 0 ±2 uA ILO Output Leakage Current 0 ±2 uA V Note：IIL：Input LOW Current，IIH：Input HIGH Current， IOL：Output LOW Current，IOH：Output HIGH Current， 4.3 AC 特性 Symbol Alt. Parameter Min. Max. Unit Fc Fc Clock Frequency D.C. 50 MHz tCH tCLH Clock High Time 4.5 ns tCL tCLL Clock Low Time 4.5 ns tCLCH Clock Rise Time(peak to peak) 0.2 V/ns tCHCL Clock Fall Time (peak to peak) 0.2 V/ns CS# Active Setup Time (relative to SCLK) 5 ns CS# Not Active Hold Time (relative to SCLK) 5 ns tSLCH tCSS tCHSL tDVCH tDSU Data In Setup Time 2 ns tCHDX tDH Data In Hold Time 5 ns t CHSH CS# Active Hold Time (relative to SCLK) 5 ns t SHCH CS# Not Active Setup Time (relative to SCLK) 5 ns 12 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 t SHSL tCSH CS# Deselect Time 30 ns t SHQZ tDIS Output Disable Time 6 ns t CLQV tV Clock Low to Output Valid 6 ns t CLQX tHO Output Hold Time 0 ns t HLCH HOLD# Setup Time (relative to SCLK) 5 ns t CHHH HOLD# Hold Time (relative to SCLK) 5 ns t HHCH HOLD Setup Time (relative to SCLK) 5 ns t CHHL HOLD Hold Time (relative to SCLK) 5 ns t HHQX tLZ HOLD to Output Low-Z 6 ns t HLQZ tHZ HOLD# to Output High-Z 6 ns 13 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 4.4 上电时序 Symbol Parameter Min Max unit T VSL VCC(min)To/CS Low 10 T PUW Time Delay From VCC(min)To Write Instruction 1 10 ms VWI Trite Inhibit Voltage VCC(min) 1 2.5 v us 14 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 5 封装尺寸 封 装 类 型 封装尺寸 DFN8-2X3 2.0mmx 3.0mm (79milX118mil ) DFN8-2X3 15 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 6 字库排置（竖置横排） 6.1 点阵排列格式 每个汉字在芯片中是以汉字点阵字模的形式存储的，每个点用一个二进制位表示，存 1 的点， 当显示时可以在屏幕上显示亮点，存 0 的点，则在屏幕上不显示。点阵排列格式为竖置横排：即一 个字节的高位表示下面的点，低位表示上面的点（如果用户按 16bit 总线宽度读取点阵数据，请注意 高低字节的顺序），排满一行后再排下一行。这样把点阵信息用来直接在显示器上按上述规则显示， 则将出现对应的汉字。 6.2 5X16 点汉字排列格式举例 15X16 点汉字的信息需要 32 个字节（BYTE 0 – BYTE 31）来表示。该 15X16 点汉字的点阵数 据是竖置横排的，其具体排列结构如下图： 15 列 .......... BYTE 31 .......... BYTE 30 BYTE 17 BYTE 16 .......... B0 B1 B2 B3 B4 B5 B6 B7 B0 B1 B2 B3 B4 B5 B6 B7 BYTE 15 .......... B0 B1 B2 B3 B4 B5 B6 B7 B0 B1 B2 B3 B4 B5 B6 B7 BYTE 14 16 行 B0 B1 B2 B3 B4 B5 B6 B7 B0 B1 B2 B3 B4 B5 B6 B7 BYTE 1 BYTE 0 B0 B1 B2 B3 B4 B5 B6 B7 B0 B1 B2 B3 B4 B5 B6 B7 空白 6.3 16 点阵不等宽 ASCII（圆角字体）字符排列格式 16 点阵不等宽字符的信息需要 34 个字节（BYTE 0 – BYTE33）来表示。  存储格式 由于字符是不等宽的，因此在存储格式中 BYTE0~ BYTE1 存放点阵宽度数据，BYTE2-33 存放 竖置横排点阵数据。具体格式见下图： 点阵宽度数据 BYTE 0 BYTE 1 ASCII点阵数据 BYTE 2 B7 B6 B5 B4 B3 B2 B1 B0 B7 B6 B5 B4 B3 B2 B1 B0 B7 B6 B5 B4 B3 B2 B1 B0 .......... BYTE 33 B7 B6 B5 B4 B3 B2 B1 B0  存储结构 点阵存储宽度固定为 16，根据不同字符，其实际点阵宽度会小于 16，并会出现相应的空白 区。根据 BYTE0~ BYTE1 所存放点阵的宽度数据，可以对还原下一个字的显示或排版留作参考。 16 www.genitop.com 深圳高通半导体有限公司 例如：ASCII 圆角字符 B 0-33BYTE 的点阵数据是: GT23L16U2Y 标准点阵汉字库芯片 00 0C 00 F8 F8 18 18 18 18 18 F8 F0 00 00 00 00 00 00 00 7F 7F 63 63 63 63 63 67 3E 1C 00 00 00 00 00 其中： BYTE0~ BYTE1: 00 0C 为 ASCII 圆角字符 B 的点阵宽度数据，即：12 位宽度。 字符后面有 4 位空白区，可以在排版下一个字时考虑到这一点，将下一个字的起始位置前移。 （见下 图） BYTE2-33: 00 F8 F8 18 18 18 18 18 F8 F0 00 00 00 00 00 00 00 7F 7F 63 63 63 63 63 67 3E 1C 00 00 00 00 00 为 ASCII 圆角字符 B 的点阵数据。 17 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 7 点阵数据验证（客户参考用） 客户将芯片内“A”的数据调出与以下进行对比。若一致，表示 SPI 驱动正常工作；若不一致，请重 新编写驱动。 排置：Y（竖置横排）点阵大小 8X16 字母"A" 点阵数据：00 E0 9C 82 9C E0 00 00 0F 00 00 00 00 00 0F 00 18 www.genitop.com 深圳高通半导体有限公司 GT23L16U2Y 标准点阵汉字库芯片 深圳 OFFICE 地址：深圳市福田区车公庙泰然工贸园 210 栋 4G03 电话： 0755-83453881 83453855 传真： 0755-83453855-8004 19 www.genitop.com