TPNUP4114UCW1T2G

TPNUP4114UCW 1T2G 4-line Ultra Low Capacitance TVS Diode Array www.sot23.com.tw Features

Mechanical Characteristics Package:SOT363 Lead Finish :Matte Tin
UL Flammability Classification Rating 94V-0 ESD Protect for 4 high-speed I/O channels Provide ESD protection for each channel to

IEC 61000-4-2 (ESD) ±18kV (air), ±14kV (contact) IEC 61000-4-4 (EFT) (5/50ns) Level-3, 20A for I/O, 80A for Power IEC 61000-4-5 (Lightning) 6.5A (8/20µs) For below 5V operating voltage Low capacitance : 1.5pF typical
Fast turn-on and Low clamping voltage
Array of surge rated diodes with internal equivalent TVS diode
Small package saves board space
Solid-state silicon-avalanche and active circuit triggering technology
Green part available
Applications
BL Ordering Information 3000 Reel Size CH 7” PU Qty per Reel Dimensions and Pin Configuration TE Part Number TPE05L4C6 TPNUP4114UCW1T2G IC USB2.0 Power and Data lines protection
Notebook and PC Computers
Monitors and Flat Panel Displays
IEEE 1394 Firewire Ports
Video Graphics Cards
SIM ports
CH3 VP CH4 VP CH1 CH2 CH3 CH4 VN CH1 VN CH2 Circuit and Pin Schematic WWW.TECHPUBLIC.COM.TW TPNUP4114UCW 1T2G 4-line Ultra Low Capacitance TVS Diode Array Absolute Maximum Ratings (Tamb=25°C unless otherwise specified) PARAMETER PARAMETER RATING UNITS IPP 6.5 A VDC VESD V kV TSOL 6 18 14 30 30 260 (10 sec.) TOP -55 to +85 o o Peak Pulse Current (tp =8/20µs) Operating Supply Voltage (VDD-GND) ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact) ESD per IEC 61000-4-2(Air)(VDD-GND) ESD per IEC 61000-4-2(Contact) (VDD-GND) Lead Soldering Temperature Operating Temperature VESD_VDD kV o C C TSTO -55 to +150 DC Voltage at any I/O pin VIO (GND – 0.5) to (VDD + 0.5) IC Storage Temperature C V Electrical Characteristics (TA=25°C unless otherwise specified) SYMBOL VRWM Channel Leakage Current Reverse Breakdown Voltage Forward Voltage ICH_Leak Clamping Voltage VCL ESD Clamping Voltage –VDD ESD Dynamic Turn-on Resistance –I/O ESD Dynamic Turn-on Resistance –VDD Channel Input Capacitance Channel to Channel Input Capacitance Variation of Channel Input Capacitance PU CH VBV VPin 5 = 5V, VPin 2 = 0V, T=25 oC, VCH = 0 ~ 5V IBV = 1mA, T=25 oC Pin 5 to Pin 2 IF = 15mA, T=25 oC Pin 2 to Pin 5 IPP=5A, tp=8/20µs, T=25 oC Any Channel pin to Ground IEC 61000-4-2 +6kV, T=25 oC, Contact mode, Any Channel pin to Ground IEC 61000-4-2 +6kV, T=25 oC, Contact mode, VDD pin to Ground IEC 61000-4-2 0~+6kV, T=25 oC, Contact mode, Any Channel pin to Ground TE ESD Clamping Voltage –I/O Vclamp_io Vclamp_VDD Rdynamic_io Rdynamic_VDD CIN CCROSS △CIN MIN TYP MAX 5 UNITS V 5 µA 1 µA 9 V 0.8 1 V 8.1 9 V VRWM = 5V, T=25 oC, Pin 5 to pin 2 ILeak VF CONDITIONS Pin 5 to pin 2, T=25 oC BL PARAMETER Reverse Stand-Off Voltage Reverse Leakage Current IEC 61000-4-2 0~+6kV, T=25 oC, Contact mode, VDD pin to Ground Vpin5 = 5V, Vpin2 = 0V, VIN = 2.5V, f = 1MHz, T=25 oC, Any Channel pin to Ground Vpin5 = 5V, Vpin2 = 0V, VIN = 2.5V, f = 1MHz, T=25 oC , Between Channel pins Vpin5 = 5V, Vpin2 = 0V, VIN = 2.5V, f = 1MHz, T=25 oC , Channel_x pin to Ground - Channel_y pin to Ground 6 12.5 V 9 V 0.35 Ω 0.2 Ω pF 1.5 0.12 0.14 pF 0.05 0.07 pF WWW.TECHPUBLIC.COM.TW TPNUP4114UCW 1T2G 4-line Ultra Low Capacitance TVS Diode Array www.sot23.com.tw PROTECTION PRODUCTS Typical charateristics Fig2. ESD Pulse Waveform (according to IEC 61000-4-2) Fig1. 8/20µ s Pulse Waveform 120 80 60 40 td=t IPP/2 0 0 5 10 15 20 25 30 Time (ns) 30ns 60ns CH Power Derating Curve 110 100 90 80 70 60 50 40 30 20 10 0 TE % of Rated Power tr = 0.7~1ns PU t - Time ( s) Fig3. 10% BL 20 90% IC IPP - Peak Pulse Current - % of IPP 100 100% TEST WAVEFORM PARAMETERS tr=8 s td=20 s Peak Value IPP Percent of Peak Pulse Current % tr 0 25 50 75 100 125 150 Ambient Temperature –TA (ºC) WWW.TECHPUBLIC.COM.TW TPNUP4114UCW 1T2G 4-line Ultra Low Capacitance TVS Diode Array www.sot23.com.tw Outline Drawing - SOT363 DIM D e1 A A1 A2 b c D E1 E e e1 L L1 N 01 aaa bbb ccc N E/2 E1 1 ccc C 2X N/2 TIPS E 2 e B D A2 A SEATING PLANE bxN bbb 1.10 0.00 0.10 0.70 0.90 1.00 0.15 0.30 0.08 0.22 1.80 2.00 2.20 1.15 1.25 1.35 2.10 BSC 0.65 BSC 1.30 BSC 0.26 0.36 0.46 (0.42) 6 0° 8° 0.10 0.10 0.30 H A1 C .043 .000 .004 .028 .035 .039 .012 .006 .003 .009 .071 .079 .087 .045 .049 .053 .083 BSC .026 BSC .051 .010 .014 .018 (.017) 6 8° 0° .004 .004 .012 BL aaa C DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX IC A C A-B D GAGE PLANE PU 0.15 SEE DETAIL 01 (L1) DETAIL A A CH SIDE VIEW L c TE Land Pattern -SOT363 X DIM C G Y Z C G P X Y Z DIMENSIONS INCHES MILLIMETERS (.073) .039 .026 .016 .033 .106 (1.85) 1.00 0.65 0.40 0.85 2.70 P WWW.TECHPUBLIC.COM.TW