TPESD5304D-10

TPESD5304D-10 Ultra Low Capacitance TVS Arrays www.sot23.com.tw Features Mechanical Characteristics u 150 Watts Peak Pulse Power per Line (tp=8/20μs) u Protects two or four I/O lines u Package: DFN2510-10 (2.5×1.0×0.5mm) u Low capacitance: 0.3pF typical (I/O to I/O) u Lead Finish: Matte Tin u Low operating voltage: 5V u Case Material: “Green” Molding Compound. u RoHS Compliant u UL Flammability Classification Rating 94V-0 u IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) u Moisture Sensitivity: Level 3 per J-STD-020 u IEC61000-4-4 (EFT) 40A (5/50ηs) u Terminal Connections: See Diagram Below u IEC61000-4-5 (Lightning) 5A (8/20μs) IC Applications Qty per Reel 3000 7” u Digital Visual Interface (DVI) u Unified Display Interface (UDI) u MDDI Ports u PCI Express u Serial ATA CH TPESD5304D-10 Reel Size PU Part Number High Definition Multimedia Interface (HDMI) BL Ordering Information u TE Dimensions and Pin Configuration 10 9 8 7 6 1 2 3 4 5 Pin Identification 1, 2, 4, 5 Input Lines 6, 7, 9, 10 Output Lines (No Internal Connection) 3, 8 Ground Pin 1 Pin 2 Pin 4 Pin 5 3, 8 4-Line Protection WWW.TECHPUBLIC.COM.TW TPESD5304D-10 Ultra Low Capacitance TVS Arrays www.sot23.com.tw Absolute Maximum Ratings (Tamb=25°C unless otherwise specified) Parameter Symbol Value Unit Peak Pulse Power (8/20µs) Ppk 150 W Peak Pulse Current (8/20µs) IPP 5 A ESD per IEC 61000−4−2 (Air) ±15 VESD ESD per IEC 61000−4−2 (Contact) TJ −55 to +125 °C IC Operating Temperature Range kV ±8 Storage Temperature Range Tstg −55 to +150 °C Symbol Reverse Working Voltage VBR Reverse Leakage Current Clamping Voltage 0.01 CJ Junction Capacitance CJ 0.3 Unit Test Condition V Any I/O pin to ground V IT = 1mA, any I/O pin to ground 0.5 µA VRWM = 5V, any I/O pin to ground 9 V IPP = 1A (8 x 20µs pulse), any I/O pin to ground 16 V IPP = 5A (8 x 20µs pulse), any I/O pin to ground 0.4 pF VR = 0V, f = 1MHz, between I/O pins 0.8 pF VR = 0V, f = 1MHz, any I/O pin to ground 6 VC Junction Capacitance Max 5 VC TE Clamping Voltage IR Typ CH Breakdown Voltage VRWM Min PU Parameter BL Electrical Characteristics (TA=25°C unless otherwise specified) WWW.TECHPUBLIC.COM.TW TPESD5304D-10 Ultra Low Capacitance TVS Arrays Characteristic Curves 8/20μs Pulse Waveform Fig2. ESD Pulse Waveform (according to IEC 61000-4-2) tr 100 Peak Value IPP 80 100% TEST WAVEFORM PARAMETERS tr=8μs td=20μs Percent of Peak Pulse Current % 60 40 td=t IPP/2 20 0 0 5 10 15 20 25 tr = 0.7~1ns Time (ns) 60ns Fig4. Normalized Capacitance vs. Reverse Voltage PU Non - Repetitive Peak Pulse Power vs. Pulse Time CH 10 1 0.1 TE Peak Pulse Power - PPK (kW) 10% 30ns 30 t - Time (μs) Fig3. 90% BL IPP - Peak Pulse Current - % of IPP 120 IC Fig1. www.sot23.com.tw 0.01 0.1 1 10 100 1000 Pulse Duration - tp (μs) WWW.TECHPUBLIC.COM.TW TPESD5304D-10 Ultra Low Capacitance TVS Arrays www.sot23.com.tw Application Information   1 2 3 GND 8 4 1 2 3 GND 8 4 IC BL 5 IC 5 1 2 3 8 PU GND 4 5 TE CH     ESD protection for HDMI port     TMDS_D2+ TMDS_D2_   TMDS_GND   TMDS_D1+   TMDS_D1_   TMDS_D0+   TMDS_D0_   TMDS_GND TMDS_CK+   TMDS_CK_   CE_REMOTE   DDC_CLK     DDC_DAT   HOTPLUG_DET       WWW.TECHPUBLIC.COM.TW TPESD5304D-10 Ultra Low Capacitance TVS Arrays www.sot23.com.tw Outline Drawing - DFN2510-10 D B DIM E A SEATING PLANE aaa C A2 b1xN bbb R0.125 1 2 C A B PU E/2 C A1 A A1 A2 b b1 D E e L N aaa bbb BL PIN 1 INDICATOR (LASER MARK) DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.50 0.58 0.65 0.00 .001 .002 0.00 0.03 0.05 (.005) (0.13) .006 .008 .010 0.15 0.20 0.25 .014 .016 .018 0.35 0.40 0.45 .094 .098 .102 2.40 2.50 2.60 .035 .039 .043 0.90 1.00 1.10 .020 BSC 0.50 BSC .012 .015 .017 0.30 0.38 0.425 8 8 0.08 .003 0.10 .004 IC A LxN 2X R0.075 7 PLACES CH N bxN e bbb C A B TE D/2 Land Pattern - DFN2510-10 P1 P DIMENSIONS Y Z (C) (Y1) G X X1 DIM C G P P1 X X1 Y Y1 Z INCHES (.034) .008 .020 .039 .008 .016 .027 (.061) .061 MILLIMETERS (0.875) 0.20 0.50 1.00 0.20 0.40 0.675 (1.55) 1.55 WWW.TECHPUBLIC.COM.TW