TPAOZ8804ADI

TPAOZ 8804ADI 4-Line Ultra Low Capacitance TVS Diode Array www.sot23.com.tw Features Mechanical Characteristics  Ultra low capacitance: 0.3pF typical(IO/ to I/O)  Package: DFN2510(2.5X1.0X0.5mm)  Low operating voltage: 5V Ultra low leakage: nA level  Low clamping voltage   Case Material: “Green” Molding Compound.  Up to 4 lines protects  Moisture Sensitivity: Level 3 per J-STD-020  Terminal Connections: See Diagram Below  Leadless flow-through package  Complies with following standards:  – IEC 61000-4-2 (ESD) immunity test  Contact discharge: ±20kV  – IEC61000-4-5 (Lightning) 3A (8/20μs) HDMI 1.4& 2.0, USB 2.0 & 3.0 and MDDI ports Monitors and flat panel displays Set-top box and Digital TV Video graphics cards BL  IC Applications Air discharge: ±20kV   Ordering Information PU  Qty per Reel Reel Size TPAOZ8804ADI 3000 7” TE CH Part Number Digital Video Interface (DVI) Notebook Computers Dimensions and Pin Configuration TPAOZ 8804ADI 4-Line Ultra Low Capacitance TVS Diode Array www.sot23.com.tw Absolute Maximum Ratings (Tamb=25°C unless otherwise specified) Parameter Symbol Value Unit Peak Pulse Power (8/20µs) Ppk 60 W Peak Pulse Current (8/20µs) Ipp 3 A ESD per IEC 61000−4−2 (Air) Storage Temperature Range ±20 C H PU BL IC ESD per IEC 61000−4−2 (Contact) Operating Temperature Range ±20 VESD kV TJ −55 to +125 °C Tstg −55 to +150 °C Electrical Characteristics (TA=25°C unless otherwise specified) Parameter Symbol Reverse Working Voltage Breakdown Voltage Junction Capacitance Max Unit 5 V Test Condition 9 V IT = 1mA IR 0.2 μA VRWM = 5V VC 9 V IPP = 1A (8 x 20µs pulse) VC 18 V IPP = 3A (8 x 20 s pulse) pF VR = 0V, f = 1MHz IO to IO TE Clamping Voltage Typ VRWM VBR Reverse Leakage Current Clamping Voltage Min CJ 6 0.35 2 TPAOZ 8804ADI 4-Line Ultra Low Capacitance TVS Diode Array www.sot23.com.tw TE CH PU BL IC Typical Performance Characteristics (TA=25°C unless otherwise Specified) WWW.TECHPUBLIC.COM.TW 3 TPAOZ 8804ADI 4-Line Ultra Low Capacitance TVS Diode Array www.sot23.com.tw DFN2510-10 Package Outline Drawing D DIMENSIONS MILLIMETERS MIN NOM MAX MIN INCHES NOM MAX E SYM 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.15 0.20 0.25 0.006 0.008 0.010 b1 0.35 0.40 0.45 0.014 0.016 0.018 b2 0.20 0.25 0.30 0.008 0.010 0.012 c 0.10 0.15 0.20 0.004 0.006 0.008 D 2.45 2.50 2.55 0.098 0.100 0.102 b1 Nd b2 0.95 PU E L L R Nd 0.020BSC 2.00BSC 0.080BSC 0.35 1.00 1.05 0.038 0.040 0.042 0.40 0.45 0.014 0.016 0.018 L1 0.075REF 0.003REF L2 0.050REF 0.002REF h 0.08 0.12 0.15 0.003 0.005 0.006 R 0.05 0.10 0.15 0.002 0.004 0.006 TE BOTTOM VIEW CH L2 L1 PIN 1 e 0.50BSC BL e SIDE VIEW b 0.45 IC A1 c A TOP VIEW A Suggested Land Pattern X1 X2 SYM Y Z X3 4 DIMENSIONS MILLIMETERS INCHES X1 0.200 0.008 X2 0.400 0.016 X3 0.500 0.020 Y 0.600 0.024 Z 1.400 0.056 WWW.TECHPUBLIC.COM.TW