ESD0P2RF-02LRH-TP
0.18pf 1-Line Ultra Low Capacitance TVS Diode Array
www.sot23.com.tw
Features
Mechanical Characteristics
Ultra small package: 1.0x0.6x0.5mm
Package: DFN1006-2 (0402)
Ultra low capacitance: 0.18pF typical
Lead Finish: Matte Tin
Ultra low leakage: nA level
Case Material: “Green” Molding Compound.
Low operating voltage: 5V
Moisture Sensitivity: Level 3 per J-STD-020
Low clamping voltage
Terminal Connections: See Diagram Below
Shipping Qty : 10000pcs/7Inch Tape & Reel
2-pin leadless package
Applications
Lead Finish: NiPdAu
Smart phones
Display Ports
BL
RoHS Compliant
MDDI Ports
USB Ports
Digital Video Interface (DVI)
PCI Express and Serial SATA Ports
TE
CH
IC
Complies with following standards:
– IEC 61000-4-2 (ESD) immunity test
Air discharge: ±15kV
Contact discharge: ±8kV
– IEC61000-4-5
-4- (Lightning) 3A (8/20μs)
PU
Dimensions and Pin Configuration
1.0
0.60
0.65
0.50
WWW.TECHPUBLIC.COM.TW
ESD0P2RF-02LRH-TP
0.18pf 1-Line Ultra Low Capacitance TVS Diode Array
www.sot23.com.tw
Absolute Maximum Ratings (Tamb=25°C unless otherwise specified)
Parameter
Symbol
Value
Unit
Peak Pulse Power (8/20µs)
Ppk
60
W
Peak Pulse Current (8/20µs)
Ipp
3
A
ESD per IEC 61000−4−2 (Air)
Storage Temperature Range
kV
±8
CH
PU
BL
IC
ESD per IEC 61000−4−2 (Contact)
Operating Temperature Range
±15
VESD
TJ
−55 to +125
°C
Tstg
−55 to +150
°C
Electrical Characteristics (TA=25°C unless otherwise specified)
Parameter
Symbol
Reverse Working Voltage
Breakdown Voltage
Junction Capacitance
Max
Unit
5
V
Test Condition
9
V
IT = 1mA
IR
0.2
μA
VRWM = 5V
VC
12
V
IPP = 1A (8 x 20µs pulse)
VC
19
V
IPP = 3A (8 x 20 s pulse)
0.25
pF
VR = 0V, f = 1MHz IO to IO
TE
Clamping Voltage
Typ
VRWM
VBR
Reverse Leakage Current
Clamping Voltage
Min
CJ
6
7.5
0.18
2
WWW.TECHPUBLIC.COM.TW
ESD0P2RF-02LRH-TP
0.18pf 1-Line Ultra Low Capacitance TVS Diode Array
www.sot23.com.tw
TE
CH
PU
BL
IC
Typical Performance Characteristics (TA=25°C unless otherwise Specified)
WWW.TECHPUBLIC.COM.TW
3
ESD0P2RF-02LRH-TP
0.18pf 1-Line Ultra Low Capacitance TVS Diode Array
www.sot23.com.tw
DFN1006-2 Package Outline Drawing (0402)
h
h
A
A1
0.00
0.02
0.05
0.000
0.001
0.002
b
0.45
0.50
0.55
0.018
0.020
0.022
c
0.12
0.15
0.18
0.005
0.006
0.007
D
0.95
1.00
1.05
0.037
0.039
0.041
SYM
-
b
E
-
DIMENSIONS
MILLIMETERS
INCHES
MIN
NOM
MAX
MIN
NOM
MAX
0.45
0.50
0.55
0.018
0.020
0.022
L
A1
c
A
Bottom View
e
IC
e
D
0.65 BSC
0.55
L
0.20
h
0.07
0.60
0.65
0.022
0.024
0.026
0.25
0.30
0.008
0.010
0.012
0.12
0.17
0.003
0.005
0.007
TE
CH
PU
BL
E
0.026 BSC
Suggested Land Pattern
╋
Y3
Y2
SYM
Y1
Z
DIMENSIONS
MILLIMETERS
INCHES
X
0.60
0.024
Y1
0.50
0.020
Y2
0.30
0.012
Y3
0.80
0.032
Z
1.30
0.052
╋
X
4
WWW.TECHPUBLIC.COM.TW
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