CSNP4GCR01-BOW

CSNP4GCR01-BOW Version：V1.1 JAN20, 2021 CSNP4GCR01-BOW Revision History Version Date Description V1.0 16/03/2020 Origin Draft V1.1 20/01/2021 Updated operating temperature CSNP4GCR01-BOW Contents REVISION HISTORY ................................................................................................................................................................................... I 1. INTRODUCTION ................................................................................................................................................................................... 1 1.1 OVERVIEW ............................................................................................................................................................................................................... 1 1.2 FEATURES ................................................................................................................................................................................................................ 1 1.3 BLOCK DIAGRAM .................................................................................................................................................................................................... 1 2. PRODUCT SPECIFICATIONS............................................................................................................................................................... 2 2.1 PIN ASSIGNMENTS (TOP VIEW) ............................................................................................................................................................................. 2 2.2 PACKAGE DIMENSIONS .......................................................................................................................................................................................... 2 3. PERFORMANCE .................................................................................................................................................................................... 4 4. DC CHARACTERISTICS ........................................................................................................................................................................ 5 5. AC CHARACTERISTICS ........................................................................................................................................................................ 6 5.1 BUS TIMING (DEFAULT MODE).............................................................................................................................................................................. 6 5.2 BUS TIMING (HIGH-SPEED MODE) ....................................................................................................................................................................... 6 6. REFERENCE DESIGN............................................................................................................................................................................. 8 CSNP4GCR01-BOW 1. Introduction 1.1 Overview CSNP4GCR01-BOW is an 4Gb density of embedded storage based on NAND Flash and SD controller. This product has many advantages comparing to raw NAND, it has embedded bad block management, and stronger embedded ECC. CSNP4GCR01-BOW is LGA-8 package. The size is 8mm x 6mm x0.75mm. 1.2 Features l Interface: Standard SD Specification Version 2.0 with 1-I/O and 4-I/O. l Power supply: Vcc = 2.7V - 3.6V l Default mode: Variable clock rate 0 - 25 MHz, up to 12.5 MB/sec interface speed (using 4 parallel data lines) l High-Speed mode: Variable clock rate 0 - 50 MHz, up to 25 MB/sec interface speed (using 4 parallel data lines) l Operating Temperature: -30°C to +85°C l Storage Temperature: -40°C to +85°C l Standby Current：< 200uA 1.3 Block Diagram 1 CSNP4GCR01-BOW 2. Product Specifications 2.1 Pin Assignments (Top View) PIN# SD MODE TYPE1 DESCRIPTION NAME 1 SDD2 I/O/PP 2 3 NAME Data Line [Bit2] SPI MODE TYPE DESCRIPTION RSV Reserved 3 2 CD/SDD3 I/O/PP SDNAND Detect/ Data Line [Bit3] CS I Chip Select (Neg True) 3 SCLK I Clock SCLK I Clock 4 VSS S Supply Voltage Ground VSS S Supply Voltage Ground 5 CMD PP Command/Response DI I Data In 6 SDD0 I/O/PP Data Line [Bit0] DO O/PP Data Out 7 SDD1 I/O/PP Data Line [Bit1] RSV 8 VCC S Supply Voltage VCC Reserved S Supply Voltage 1) S: power supply; I: input; O: output using push-pull drivers; PP: I/O using push-pull drivers; 2) The extended SDD lines (SDD1-SDD3) are input on power up. They start to operate as SDD lines after SET_BUS_WIDTH command. The Host shall keep its own SDD1-SDD3 lines in input mode, as well, while they are not used. It is defined so, in order to keep compatibility to SDNAND. 2.2 Package Dimensions TOP VIEW SIDE VIEW 2 CSNP4GCR01-BOW Common Dimensions Symbol Min Nom Max A 0.65 0.75 0.85 B 1.17 1.27 1.37 C 6.90 7 7.10 D 7.90 8 8.10 E 5.90 6 6.10 F 10.90 11 11.1 H 0.75 0.85 0.95 SDNAND Package Dimensions (unit: mm) 3 Note CSNP4GCR01-BOW 3. Performance Parameter Temperature Range Work Model -30°~ 85℃ Storage Model - 40°~ 85℃ Work Model 8% to 95%, Non-condensing Storage Model 8% to 95%, Non-condensing Humidity 4 CSNP4GCR01-BOW 4. DC Characteristics Symbol PARAMETER VIL Input low voltage VIH Input high voltage VOL Output low voltage VOH Output high voltage IIN Input leakage current IOUT CONDITIONS MIN IOP Operation current UNITS VSS-0.3 0.25VCC V 0.625VCC VCC+0.3 V 0.125VCC V @VCC_min IOH=100μA 0.75VCC @VCC_min VIN=VCC or 0 current Standby current MAX IOL=100μA Tri-state output leakage ISTBY TYP 3.3V@clock stop 3.3v@50MHz (Write) 3.3v@50MHz (Read) 5 V -10 +/-1 10 μA -10 +/-1 10 μA 150 200 μA 15 25 mA 15 25 mA CSNP4GCR01-BOW 5. AC Characteristics 5.1 Bus Timing (Default Mode) SYMBOL PARAMETER MIN MAX UNIT FSD SD clock frequency 0 25 MHz TWL Clock low time 10 ns TWH Clock high time 10 ns TTLH Clock rise time 10 ns TTHL Clock fall time 10 ns TISU Input setup time 5 ns TIH Input hold time 5 ns TODLY Output delay time 0 14 5.2 Bus Timing (High-speed Mode) 6 ns NOTE CSNP4GCR01-BOW SYMBOL PARAMETER MIN MAX UNIT FSD SD clock frequency 0 25 MHz TWL Clock low time 10 ns TWH Clock high time 10 ns TTLH Clock rise time 10 ns TTHL Clock fall time 10 ns TISU Input setup time 5 ns TIH Input hold time 5 ns TODLY Output delay time 0 TOH Output hold time 2.5 14 ns ns 7 NOTE CSNP4GCR01-BOW 6. Reference Design Note： RDAT and RCMD (10K~100 kΩ) are pull-up resistors protecting the CMD and the DAT lines against bus floating when SDNAND is in a high-impedance mode. The host shall pull-up all DAT0-3 lines by RDAT, even if the host uses the SDNAND as 1-bit mode only in SD mode. It is recommended to have 2.2uF capacitance on VCC. RCLK reference 0~120 Ω. 8