S3M

S3A-S3M SURFACE MOUNT GENERAL RECTIFIER SMB/DO-214AA FEATURES • • • • • • Plastic package has underwrites laboratory flammability Classification 94V-0 For surface mounted applications Low profile package Built-in strain relief, ideal for automated placement Glass Passivated chip junction High temperature soldering: 250℃/10 second at terminals MECHANICAL DATA • • • • Case: JEDED DO-214AA molded plastic over glass passivated chip Terminals: Solder plated, Solderable per MIL-STD-750, method 2026 Polarity: Color band denotes cathode end Weight: 0.007ounce, 0.25 gram Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS • Ratings at 25℃ ambient temperature unless otherwise specified Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at TL =100℃ (NOTE 3) Peak Forward Surge Current 8.3ms single half sine wave superimposed on rated load (JEDEC method) T L=100℃ Maximum Instantaneous Forward Voltage at 3.0A Maximum DC Reverse Current at rated DC Blocking Voltage TA = 25℃ TA = 125℃ Typical Reverse Recovery Time (NOTE 1) Typical junction capacitance (NOTE 2) Typical Thermal Resistance (NOTE 3) Operating and Storage Temperature Range SYMBOLS VRRM VRMS VDC S3A 50 35 50 S3B 100 70 100 S3D 200 140 200 S3G 400 280 400 S3K 800 560 800 S3M 1000 700 1000 UNIT Volts Volts Volts I(AV) 3.0 Amps IFSM 100 Amps VF Volts Trr 1.15 10.0 250 2.5 CJ RθJL RθJA TJ,TSTG 60 47 13 -55 to +150 pF IR Notes: 1. Reverse recovery test conditions: IF =0.5A, IR =1.0A, Irr =0.25A 2. Measured at 1.0MHz and applied reverse voltage of 4.0 Volts 3. Thermal resistance from Junction to ambient and from junction to lead mounted on P.C.B.with 0.3×0.3″(8.0 × 8.0mm) copper pad areas. www.slkormicro.com S3J 600 420 600 1 µA µs ℃/W ℃ S3A-S3M RATINGS AND CHARACTERISTIC F1G.2-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 200 3.5 3.0 2.5 2.0 1.5 1.0 P.C.B MOUNTED on 0.3X0.3″(8.0X8.0mm) COPPER PAD AREAS 0.5 T L =100℃ CURRENT, AMPERES Resistive or Inductive Load PEAK FORWARD SURGE AVERAGE FORWARD CURRENT AMPERES F1G.1-FORWARD CURRENT DERATING CURVE 8.3ms Single Half Sine-Wave (JEDEC Method) 100 0 50 60 70 80 90 100 110 120 130 140 150 160 10 LEAD TEMPERATURE,( ℃) 1 10 100 NUMBER OF CYCLES AT 60Hz F1G.4-TYPICAL REVERSE CHARACTERISTICS 100 INSTANTANEOUS REVERSE CURRENT, MICROAMPERES INSTANTANEOUS FORWARD CURRENT, AMPERES F1G.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 10 T J =25℃ Pulse Width=300us 1% Duty Cycle 1.0 0.1 0.01 0.6 0.7 0.8 0.9 1.0 1.1 1.2 100 TJ =125℃ 10 1.0 T J =25℃ 0.1 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) 1.3 TRANSIENT THERMAL IMPEDANCE(℃ /W) JUNCTION CAPACITANCE,(pF) INSTANTANEOUS FORWARD VOLTAGE, VOLTS F1G.5-TYPICAL JUNCTION CAPACITANCE 100 T J =25℃ f=1MHz Vsig=50mVp-p 10 1 1.0 10 100 REVRESE VOLTAGE, VOLTS www.slkormicro.com 2 F1G.6-TYPICAL TRANSIENT THERMAL IMPEDANCE 100 Mounted ON 0.20X0.27″(5X7mm) COPPER PAD AREAS 10 1 0.1 0.01 0.1 1.0 10 T, PULSE DURATION, SEC. 100