YL160808-1R0K

Multilayer Chip Inductors -YL1608 Series ■ Features ● Monolithc structure for highly reliable surface mount applications. ● Excellent solderability and high heat resistance for either flow or reflow soldering. ● No cross coupling between inductors due to magnetic shield.Ideal for high density installation. ● Operating temperature:-40℃ ~ +85℃. ■ Applications ● Prevention of electromagnetic interference to signals on the secondary side of electric equipment ■ Product Identification ⑴ ：Type ⑵ ：Dimensions ⑶ ：Inductance value ⑷ ：Inductance Tolerance；N=±30%,M=±20%，K=±10% 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -1- Multilayer Chip Inductors -YL1608 Series ■ Shapes and Dimensions (Unit：mm) TYPE L W T A YL160808 [0603] 1.60±0.20 0.80±0.20 0.80±0.20 0.30±0.20 ■ YL1608 Series Inductance Part Number Test Freq. Min.SRF DCR MAX. Max.Rated (MHz) (MHz) (Ω) Current (mA) Q Min. (uH) YL160808-47N□ 0.047 10 50 260 0.30 50 YL160808-68N□ 0.068 10 50 250 0.30 50 YL160808-82N□ 0.082 10 50 245 0.30 50 YL160808-R10□ 0.100 15 25 240 0.50 50 YL160808-R12□ 0.120 15 25 205 0.50 50 YL160808-R15□ 0.150 15 25 180 0.60 50 YL160808-R18□ 0.180 15 25 165 0.60 50 YL160808-R22□ 0.220 15 25 150 0.80 50 YL160808-R27□ 0.270 15 25 136 0.80 80 YL160808-R33□ 0.330 15 25 125 0.85 35 YL160808-R39□ 0.390 15 25 110 1.00 35 YL160808-R47□ 0.470 15 25 105 1.35 35 YL160808-R56□ 0.560 15 25 95 1.55 35 YL160808-R68□ 0.680 15 25 90 1.70 35 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -2- Multilayer Chip Inductors -YL1608 Series ■ YL1608 Series Inductance Part Number Test Freq. Min.SRF DCR MAX. Max.Rated (MHz) (MHz) (Ω) Current (mA) Q Min. (uH) YL160808-R82□ 0.820 15 25 85 2.10 35 YL160808-1R0□ 1.0 35 10 75 0.60 25 YL160808-1R1□ 1.1 35 10 75 0.60 25 YL160808-1R2□ 1.2 35 10 65 0.80 25 YL160808-1R5□ 1.5 35 10 60 0.80 25 YL160808-1R8□ 1.8 35 10 55 0.95 25 YL160808-2R2□ 2.2 35 10 50 1.15 15 YL160808-2R7□ 2.7 35 10 45 1.35 15 YL160808-3R3□ 3.3 35 10 40 1.55 15 YL160808-3R9□ 3.9 35 10 35 1.70 15 YL160808-4R7□ 4.7 35 10 33 2.10 15 YL160808-5R6□ 5.6 35 4 22 1.55 5 YL160808-6R8□ 6.8 35 4 20 1.70 5 YL160808-8R2□ 8.2 35 4 18 2.10 5 YL160808-100□ 10 30 2 17 1.85 3 YL160808-120□ 12 30 2 15 2.10 3 YL160808-150□ 15 20 1 14 1.70 1 YL160808-180□ 18 20 1 13 1.85 1 YL160808-220□ 22 20 1 11 2.10 1 YL160808-270□ 27 20 1 10 2.75 1 YL160808-330□ 33 20 1 9 2.95 1 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -3- Multilayer Chip Inductors -YL1608 Series ■ Reliability test Items Requirements Test Methods and Remarks Operating Temperature Range -40℃ to + 85℃ Storage Temperature Range -40℃ to + 85℃ Terminal Strength Resistance to Flexure No removal or split of the termination or other defects shall occur No visible mechanical damage. ① Solder the inductor to the testing jig(glass epoxy board shown as the following figure)using eutectic solder.Then apply a force in the direction of the arrow. ② ③ ④ ⑤ ⑥ 2N force for 0603 series. 5N force for 1005 and 1608 series. 10N force for 2012 3216 3225 4532 series. Keep time :10±1s. Speed:1.0mm/s. ① Solder the inductor to the test jig(glass epoxy board) using a eutectic solder.Then apply a force in the direction of the arrow shown as the following figure. ② Flexure:2mm. ③ Pressurizing Speed:0.5mm/sec. ④ Keep time:≥30 sec. 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -4- Multilayer Chip Inductors -YL1608 Series ■ Reliability test Items Vibration Requirements Test Methods and Remarks ① No visible mechanical damage. ② Inductance change: Within ±10%. ① Solder the inductor to the testing jig using eutectic solder. ③ Q factor change: Within ±30%. Dropping Temperature Solderability Resistance to Soldering Heat ① No visible mechanical damage. ② Inductance change:Within ±20%. ③ Q factor change: Within ±30%. Inductance change should be within ±20% of initial value measuring at 20℃. Drop chip inductor 10 times on a concrete floor from a height of 100 cm. Temperature range: -40℃ to +85℃ Reference temperature:+20℃ ① No visible mechanical damage. ② Wetting shall exceed 95% coverage. ① Solder temperature: 240±2℃. ① No visible mechanical damage. ② Wetting shall exceed 95% coverage. ① Solder temperature: 260±3℃. ③ Inductance change:Within ±10%. ④ Q factor change: Within ±30%. Thermal Shock ② The inductor shall be subjected to a simple harmonic motion having total amplitude of 1.5 mm, the frequency being varied uniformly between the approximate limits of 10 and 55 Hz. ③ The frequency range from 10 to 55 Hz and return to 10 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours). ① No visible mechanical damage. ② Inductance change: Within ±10%. ③ Q factor change: Within ±30%. 深圳市益嘉源电子有限公司 http://www.yjycoin.com ② Duration: 3 sec. ③ Solder: Sn/3.0Ag/0.5Cu. ④ Flux: 25% Resin and 75% ethanol in weight. ② Duration: 5 sec. ③ Solder: Sn/3.0Ag/0.5Cu. ④ Flux: 25% Resin and 75% ethanol in weight. ⑤ The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① Temperature and time: -40℃ for 30±3 min →85℃ for 30±3min. ② Transforming interval: Max.20 sec. ③ Tested cycle: 100 cycles. ④ The chip shall be stabilized at normal condition for 1~2 hours before measuring. Tel:0755-27803896 Mob:(86)13682526134 -5- Multilayer Chip Inductors -YL1608 Series ■ Reliability test Items Resistance to Low Temperature Requirements ① No visible mechanical damage. ② Inductance change: Within ±10%. ③ Q factor change: Within ±30%. Resistance to High Temperature ① No visible mechanical damage. ② Inductance change: Within ±10%. ③ Q factor change: Within ±30%. Damp Heat (Steady States) ① No visible mechanical damage. ② Inductance change: Within ±10%. ③ Q factor change: Within ±30%. Loading Under Damp Heat ① No visible mechanical damage. ② Inductance change: Within ± 10% for inductance ≤12 μH, Within ± 15% for inductance ≥ 15μH. ③ Q factor change: Within ±30%. Loading at High Temperature (Life Test) ① No visible mechanical damage. ② Inductance change: Within ± 10% for inductance ≤ 12 μ H, Within±15% for inductance≥ 15μH. Test Methods and Remarks ① Temperature: -40±2℃. ② Duration: 1000+24 hours. ③ The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① Temperature: 85±2℃. ② Duration: 1000+24 hours. ③ The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① Temperature: 60±2℃. ② Humidity: 90% to 95% RH. ③ Duration: 1000+24 hours. ④ The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① ② ③ ④ ⑤ Temperature: 60±2℃. Humidity: 90% to 95% RH. Duration: 1000+24 hours. Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. ① ② ③ ④ Temperature: 85±2℃. Duration: 1000+24 hours. Applied current: Rated current. The chip shall be stabilized at normal condition for 1~2 hours before measuring. ③ Q factor change: Within ±30%. 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -6- Multilayer Chip Inductors -YL1608 Series ■ Taping Dimensions(Unit:mm) TYPE Chip Thickness W A B D P YL160808 0.80 8.0 1.00 1.80 3.50 4.0 K Max T Max 1.10 0.30 MPQ 4000 ■ Reel Dimensions(Unit:mm) TYPE W W1 A B C D 178±2.0 8.40±1.50 4.3±0.20 5.0±0.10 3.0±0.10 58±2.0 178±2.0 12.40±1.50 4.3±0.20 5.0±0.10 3.0±0.10 58±2.0 YL Series 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -7- Multilayer Chip Inductors -YL1608 Series ■ Leader and Blank portion 1．Missing chips number within 0.1% of the number per reel or 1pcs, whichever is greater, and are not continuous. 2．The top tape and bottom tape shall not protrude beyond the edges of the tape and shall not cover sprocket hole. 3．Cumulative tolerance of sprocket holes, 10 pitches: ±0.3mm. 4．Peeling off force: 10gf to 100gf in the direction show below for 8mm carrier tapes and 10gf to 130gf for 12mm to 56mm wide carrier tapes. 深圳市益嘉源电子有限公司 http://www.yjycoin.com Tel:0755-27803896 Mob:(86)13682526134 -8-