WSD40P10DN56
P-Ch MOSFET
Product Summery
General Description
The WSD40P10DN56 is the highest
performance trench P-ch MOSFET with
extreme high cell density , which provide
excellent RDSON and gate charge for most
of the synchronous buck converter
applications .
BVDSS
RDSON
ID
-100V
78mΩ
-30A
Applications
The WSD40P10DN56 meet the RoHS and
Green Product requirement,100% EAS
guaranteed with full function reliability approved.
z High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z Networking DC-DC Power System
Features
z Load Switch
z Advanced high cell density Trench technology
DFN5X6_8L Pin Configuration
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TC=25℃
ID@TC=100℃
IDM
Rating
Units
Drain-Source Voltage
-100
V
Gate-Source Voltage
±20
V
-30
A
-15
A
-75
A
1
Continuous Drain Current, -VGS @ -10V
1
Continuous Drain Current, -VGS @ -10V
Pulsed Drain Current
2
EAS
Single Pulse Avalanche Energy
157
mJ
IAS
Avalanche Current
-18.9
A
3
4
PD@TC=25℃
Total Power Dissipation
54
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Max.
Unit
RθJA
Thermal Resistance Junction-Ambient 1
---
62
℃/W
RθJC
Thermal Resistance Junction-Case1
---
2.3
℃/W
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Typ.
Page 1
Rev 3: Apr.2019
WSD40P10DN56
P-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
2
Static Drain-Source On-Resistance
Gate Threshold Voltage
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Min.
Typ.
Max.
Unit
VGS=0V , ID=-250uA
-100
---
---
V
Reference to 25℃ , ID=-1mA
---
-0.021
---
V/℃
VGS=-10V , ID=-10A
---
78
-1.2
-1.7
VGS=VDS , ID =-250uA
95
-2.5
mΩ
V
---
4.08
---
VDS=-48V , VGS=0V , TJ=25℃
---
---
1
VDS=-48V , VGS=0V , TJ=55℃
---
---
5
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=-10V , ID=-10A
---
24
---
S
Qg
Total Gate Charge (-4.5V)
---
44
---
Qgs
Gate-Source Charge
---
9
---
Qgd
Gate-Drain Charge
---
6
---
Turn-On Delay Time
---
12
---
---
27
---
---
79
---
Fall Time
---
53
---
Ciss
Input Capacitance
---
3029
---
Coss
Output Capacitance
---
129
---
Crss
Reverse Transfer Capacitance
---
76
---
Min.
Typ.
Max.
Unit
100
---
---
mJ
Min.
Typ.
Max.
Unit
---
---
-18
A
---
---
-1.2
V
Td(on)
Tr
Td(off)
Tf
VDS=-50V , VGS=-10V , ID=-20A
Rise Time
VDD=-30V , VGS=-10V ,
Turn-Off Delay Time
RG=6Ω, ID=-10A ,RG=30Ω.
VDS=-30V , VGS=0V , f=1MHz
mV/℃
uA
nC
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Conditions
5
Single Pulse Avalanche Energy
VDD=-25V , L=0.5mH , IAS=-10A
Diode Characteristics
Symbol
IS
VSD
Parameter
Conditions
1,6
Continuous Source Current
Diode Forward Voltage2
VG=VD=0V , Force Current
VGS=0V , IS=-1A , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t≦10sec.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is VDD=-25V,VGS=-10V,L=0.5mH,IAS=-10A
4.The power dissipation is limited by 150℃ junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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Page 2
Rev 3: Apr.2019
WSD40P10DN56
P-Ch MOSFET
Typical Characteristics
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs G-S Voltage
12
-IS Source Current(A)
10
8
6
TJ=25℃
TJ=150℃
4
2
0
0.2
0.4
0.6
0.8
1
-VSD , Source-to-Drain Voltage (V)
Fig.3 Typical S-D Diode Forward Voltage
Fig.4 Gate-Charge Characteristics
2.0
Normalized On Resistance
Normalized -VGS(th)
1.5
1.5
1
1.0
0.5
0.5
0
-50
0
50
100
TJ ,Junction Temperature ( ℃)
-50
150
Fig.5 Normalized VGS(th) vs TJ
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0
50
100
150
TJ , Junction Temperature (℃)
Fig.6 Normalized RDSON vs TJ
Page 3
Rev 3: Apr.2019
WSD40P10DN56
P-Ch MOSFET
Fig.7 Capacitance
Fig.8 Safe Operating Area
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
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Fig.11 Unclamped Inductive Waveform
Page 4
Rev 3: Apr.2019
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