HC1808CG181J302

Multilayer Ceramic Chip Capacitors High Voltage Type ≥1KV HC Series FEATURE  High voltage rating in a given case size.  High reliability and thermal stability.  Application: DC to DC converter, High Voltage Coupling/DC blocking, Back-lighting inverters, LAN/WLAN interface, Power supplies, Snubbers in HF power convertors. PART NUMBERING SYSTEM HC 1812 XR 822 K 102 (1) (2) (3) (4) (5) (6) No Item (1) Meritek Series (2) Size (3) Dielectric Digit Description HC 1812 XR (4) Capacitance (5) Tolerance (6) Rated Voltage RoHS Reference High-Voltage Ceramic Chip Capacitor High voltage application with ≧ 1KVdc 1812 inch (4532 mm) 0805,1206,1210,1808, 1825,2211,2220,2225 X7R CG: C0G(NP0), XR: X7R, XF: X5R, YV: Y5V 822: 82x10 pF = 8200pF 103: 10x103pF, 4R7: 4.7pF (K): ±10% F: ±1%,G: ±2%,J: ±5%,K: ±10%,M: ±20% Working Voltage: 1000VDC 152: 1.5KVDC, 202: 2.0KVDC, 3KVDC, 4KVDC 2 822 K 102 DIMENSIONS Thickness Size Inch (mm) L (mm) W (mm) 0603 (1608) 1.60±0.20 0.80±0.15 0.40±0.15 0805 (2012) 2.10±0.20 1.25±0.20 0.50±0.20 1206 (3216) 3.30±0.30 1.60+0.30/-0.10 1210 (3225) 3.30±0.40 2.50±0.30 1808 (4520) 4.60±0.50 2.00±0.20 1812 (4532) 4.60±0.50 3.20±0.30 1825 (4563) 4.60±0.50 6.30±0.40 2220 (5750) 5.70±0.50 5.00±0.40 0.85±0.35 2225 (5763) 5.70±0.50 6.30±0.40 0.85±0.35 T (mm) code See Thickness Specification Reference Table below MB min (mm) 0.60±0.20 0.75±0.35 0.75±0.35 0.75±0.35 0.75±0.35 THICKNESS SPECIFICATION REFERENCE Code A B C D E F G H Thickness (mm) 0.60 ± 0.10 0.8 + 0.15/-0.10 1.25 ± 0.10 1.40 ± 0.15 1.60 ± 0.20 2.00 ± 0.20 2.50 ± 0.30 2.80 ± 0.30 Code I J K L M N O P Thickness (mm) 1.25 ± 0.20 1.15 ± 0.15 0.50 ± 0.20 0.30 ± 0.03 0.95 ± 0.10 0.50 ± 0.05 3.50 ± 0.20 1.60 +0.3/-0.10 Code Q R S T U V X Z Thickness (mm) 0.50 + 0.02/-0.05 3.10 ± 0.30 0.80 ± 0.07 0.85 ± 0.10 0.50 ± 0.10 0.20 ± 0.02 0.80 ± 0.10 0.25 ± 0.03 Rev. 7d Multilayer Ceramic Chip Capacitors High Voltage Type ≥1KV HC Series ELECTRICAL CHARACTERISTICS Properties Characteristics Dielectric C0G(NP0) X7R Size 0805, 1206, 1210, 1808, 1812, 1825, 2220, 2225 0603, 0805, 1206, 1210,1808, 1812, 1825, 2220, 2225 Rated Voltage 1KV, 1.5KV, 2KV, 3KV,4KV 1KV, 1.5KV, 2KV, 3KV,4KV Capacitance Range 0.5pF ~ 12nF 100pF ~ 330nF Capacitance Tolerance See Capacitance Tolerance ReferenceTable Below Cap. Range Cap < 30pF Cap ≥ 30pF Dissipation Factor Q Spec. Q ≥ 400+20C Q ≥ 1000 ≤2.5% Measured at the condition of 30~70% related humidity.  Preconditioning : Preform a heat treatment at 150±10⁰C for an hour, then leave in ambient condition for 24±2 hours before measurement For 25⁰C at ambient temperature Cap. & D.F. Test Condition (30~70% Relative Humidity) Cap. Range Cap≤1000pF Cap>1000pF Test Condition 1.0±0.2Vrms, 1.0MHz±10% 1.0±0.2Vrms, 1.0KHz±10% 1.0±0.2Vrms, 1.0KHz±10%, at 25⁰C ambient temperature ≥100GΩ or RC≥5000Ω-F Whichever is smaller Insulation Resistance Operation Temperature ≥10GΩ or RC≥100Ω-F Whichever is smaller -55°C ~ +125°C Temperature Coefficient ±15% ±30ppm/⁰C Termination Cu (or Ag)/Ni/Sn (lead-free) CAPACITANCE TOLERANCE REFERENCE Code Description Code Description Code Description Code Description A ±0.05 pF F ±1 % J ±5 % N -5%~10% B ±0.10 pF G ±2 % K ±10 % P ±0.02 pF C ±0.25 pF H ±3 % L 0%~10% Q ±0.03 pF D ±0.50 pF I -10%~0% M ±20 % Z -20%~80% Rev. 7d Multilayer Ceramic Chip Capacitors High Voltage Type ≥1KV HC Series RELIABILITY TEST CONDITIONS AND REQUIREMENTS Item Visual and Dimensions Test Condition Requirements  No remarkable defect.  Dimensions to confirm to individual specification sheet. ---  Shall not exceed the limits given in the detailed spec. Capacitance Q/ D.F. (Dissipation Factor) Temperature Coefficient Class I: C0G(NP0) Cap≤1000pF, 1.0±0.2Vrms, 1MHz±10% Cap>1000pF, 1.0±0.2Vrms, 1KHz±10% Class II: (X7R) 1.0±0.2Vrms, 1kHz±10%  With no electrical load. T.C. C0G(NP0) X7R Dielectric Operation Temp. -55~125°C at 25°C -55~125°C at 25°C  To apply voltage at 500VDC for 60 sec. Insulation Resistance Solderability Dielectric Strength  Solder temperature: 235±5°C for (1206~1210)  Solder temperature: 245±5°C for (1808~2225)  Dipping time: 2±0.5 sec. Resistance to Soldering Heat Temperature Cycle  Conduct the five cycles according to the temperatures and time. Step Temp. (°C) Time (min.) 1 Min. operating temp. +0/-3 30±3 2 Room temp. 2~3 3 Max. Operating temp. +3/-0 30±3 4 Room temp. 2~3  Before initial measurement (Class II only): Perform 150+0/-10°C for 1 hr and then set for 48±4 hrs at room temp.  Measurement to be made after keeping at room temp. for 24±2 hrs (Class I) or 48±4 hrs (Class II). Vibration Resistance  Vibration frequency: 10~55 Hz/min.  Total amplitude: 1.5mm  Test time: 6 hrs. (Two hrs. each in three mutually perpendicular directions.) Class I(NP0) All Class II(X7R) ≥ 100 Q/D.F. Remark Q≥1000 Q≥400+20C D.F. < 2.5% D.F. < 3.0% Cap≥30pF Cap