152SHB1R0BCLE

CERAMIC CAPACITORS General characteristics SH Series Super HiQ FEATURES ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS • Lowest ESR in class, High Self-Resonant Frequencies, RF capacitors • Highest working voltage in class: 1,500V • Standard EIA sizes: 0402 - 1111 • Capacitance range: 0.1pF - 1,000pF • NPO, RoHS & REACH compliant • Operating temperature up to 125°C* • Laser Marked (optional) Electrical specifications Parameter Capacitance Value 0.2pF - 1,000pF A, B, C, D below 10pF F, G, J, K above 10pF See capacitance range chart 0 ±30ppm/°C, –55°C to +125°C For SHF and SHS: 0 ±30ppm/°C, –55°C to +150°C 105 MΩ min. 2.5 x WVDC for WVDC ≤ 500V 1.8 x WVDC for extended range values ≥ 820pF 1.5 x WVDC for WVDC > 500V none none Tolerances Working voltage (WVDC) Temperature coefficient Insulation Resistance APPLICATIONS Dielectric Withstanding (test voltage applied for 5 seconds) • Cellular Base Station Equipments • Broadband Wireless Service • Point to Point / Multipoint Radios • RF Generators (NMR…) Aging Piezo Effect Environmental specifications Parameter Value 2,000 hours, +125°C at 2 x WVDC (standard WVDC range) And SHB up to 100pF: 1,000 hours, 175°C at 500V 240 hours, 85% relative humidity at 85°C Moisture Resistance Test 1 (ESA/SCC n°3009) 56 days, 93% relative humidity at 40°C Moisture Resistance Test 2 0V, 5V, WVDC * The temperature range for the SHB up to 100pF is upgrated from +125°C to +175°C. The temperature withstanding for SHF and SHS is 150°C for the whole capacitance range. CIRCUIT APPLICATIONS Life Test • Filter Networks • Matching Networks • Tuning, Coupling and DC Blocking PHYSICAL CHARACTERISTICS • Chip capacitors for surface mounting with: - Copper barrier and tinning or Silver/Palladium (non magnetic) - Nickel barrier and tinning • Ribbon leads for surface mounting Capacitance Breakdown voltage Vpeak (V) 15 pF 39 pF 100 pF Typical Breakdown Voltage SHB 45 MHz DC = 1% 2700 2000 1400 HOW TO ORDER 501 SH B 100 J S - L E Voltage code Dielectric Size code Capacitance code Tolerance code Termination code Ribbon code Marking code Tape and reel 250 = 25V 500 = 50V 101 = 100V 201 = 200V 251 = 250V 301 = 300V 501 = 500V 601 = 600V 102 = 1,000V 152 = 1,500V SH = NPO: (0±30) ppm/°C L = 0402 S = 0603 A = 0505 F = 0805 N = 1206 T = 1210 B = 1111 Please refer to Cap. Code given in capacitance range chart. A = ±0.05pF B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% S = Standard: tin-plated nickel -: no lead or ribbon -: no marking Available on sizes 0505, 0603 and 1111: C = Non-magnetic: tin-plated copper Available on size 1111: 1 = Micro-strip ribbons 6 = Radial Wires See note 1 Please refer to voltage given in capacitance range chart Available on sizes 0505, 0805 (from 0.5pF to 150pF, consult us for higher cap. value), 1206 and 1210: A = Non-magnetic: silver/palladium See note 3 -RoHS -: no tape and reel The RoHS tag is not part of the Available on sizes E = Tape and reel reference 0505 and 1111: packaging L = laser marking Number of compo- Tag added at the nents per reel: end of P/N SHL: 10,000 for information SHA: 3,000 SHS: 4,000 SHF: 4,000 SHN: 3,000 SHT: 3,000 SHB: 1,000 Examples: 501 SHB 470 J1L any termination material could be used. 501 SHB 470 JC1L only non-magnetic termination materials could be used. Please consult us for specific requirements. www.exxelia.com 147 info@exxelia.com Page revised 06/20 RF CAPACITORS See note 2 Note 1: For capacitance values less than 10pF, tolerances B, C and D available. Tolerance code A available for: L case for capacitance values of 0.2pF - 1.9pF. A case for capacitance values of 0.2pF - 4.7pF. S case for capacitance values of 0.2pF 9.1pF. F case for capacitance values of 0.3pF - 2.2pF. N case for capacitance values of 0.5pF - 1.8pF. B case for capacitance values of 0.2pF - 3.3pF. For capacitance values of 10pF or higher, tolerances F, G, J and K available. Note 2: All terminations are backward compatible and lead-free. The non-magnetic terminations are all Magnetism-free Rated. Note 3: When coding ribbons for the description of the part, the termination has to be mentioned for MR certified types to ensure that only non-magnetic materials are used. Note 4: Ribbon lead styles capacitors are not available in Tape and Reel. CERAMIC CAPACITORS Taping SH Series : dimensions Super HiQ TYPICAL PERFORMANCE DATA S-Parameters available with ABC software. SHA (SIZE 0505): TYPICAL ESR VERSUS FREQUENCY SHB (SIZE 1111): TYPICAL ESR VERSUS FREQUENCY ESR (Ω) ESR (Ω) 10 pF 27 pF 33 pF 10 pF 56 pF 68 pF 0.10 0.10 0.01 0.01 100 1,000 100 Frequency (MHz) SHS (SIZE 0603): TYPICAL ESR VERSUS FREQUENCY Frequency (MHz) 1,000 SHS (SIZE 0603): TYPICAL Q FACTOR VERSUS FREQUENCY ESR (Ω) 10,000 Q factor 1,000 0.10 100 10 3.3 pF 10 pF 47 pF 0.01 0 1 500 1,000 1,500 2,000 Frequency (MHz) 2,500 500 SHF (SIZE 0805): TYPICAL ESR VERSUS FREQUENCY 0.2 1,000 Frequency (MHz) 1,500 2,000 SHF (SIZE 0805): TYPICAL Q FACTOR VERSUS FREQUENCY ESR (Ω) 10,000 0.15 1,000 0.1 100 0.05 Q factor 10 1 pF 10 pF 100 pF 0 500 1 1,000 Frequency (MHz) 1,500 2,000 500 1,000 Frequency (MHz) 1,500 2,000 DIMENSIONS in inches (mm) Micro-strip ribbon leads (Type 1) Chips www.exxelia.com 148 Radial leads: available on all sizes (Type 6) info@exxelia.com Page revised 06/20 CERAMIC CAPACITORS General characteristics SH Series Super HiQ STANDARD RATINGS 0402 L 0.039 ± 0.006 (1 ± 0.15) 0603 S 0.063 ± 0.01 (1.6 ± 0.25) 0505 A 0.055 ± 0.01 (1.4 ± 0.25) 0805 F 0.08 ± 0.01 (2.03 ± 0.25) 1206 N 0.125 ± 0.01 (3.18 ± 0.25) 1210 T 0.125 ± 0.01 (3.18 ± 0.25) 1111 B 0.110 ± 0.016 (2.80 ± 0.40) W 0.02 ± 0.006 (0.5 ± 0.15) 0.032 ± 0.01 (0.8 ± 0.25) 0.055 ± 0.01 (1.4 ± 0.25) 0.05 ± 0.01 (1.27 ± 0.25) 0.062 ± 0.01 (1.58 ± 0.25) 0.095 ± 0.01 (2.41 ± 0.25) 0.110 ± 0.016 (2.80 ± 0.40) T 0.02 max (0.51 max) 0.036 max (0.9 max) 0.056 max (1.4 max) 0.05 max (1.27 max) 0.05 max (1.27 max) 0.06 max (1.52 max) 0.103 max (2.60 max) 0.01 ± 0.006 (0.25 ± 0.15) Standard 0.014 ± 0.008 (0.35 ± 0.2) Standard 0.01 ± 0.006 (0.25 ± 0.15) Standard 0.02 ± 0.012 (0.5 ± 0.3) Standard 0.02 ± 0.01 (0.5 ± 0.25) Standard 0.02 ± 0.01 (0.5 ± 0.25) Standard 0.016 ± 0.010 (0.40 ± 0.25) Standard Extended Dimensions inches (mm) L e Value (pF) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.4 2.7 3.0 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 11 12 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 1,000 Cap. Code 0R1 0R2 0R3 0R4 0R5 0R6 0R7 0R8 0R9 1R0 1R1 1R2 1R3 1R4 1R5 1R6 1R7 1R8 1R9 2R0 2R1 2R2 2R4 2R7 3R0 3R3 3R6 3R9 4R3 4R7 5R1 5R6 6R2 6R8 7R5 8R2 9R1 100 110 120 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 101 111 121 131 151 161 181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 50 - 250V 250V 500V 250V 1,500V 300V 1,000V 200V 600V 500V 250V 50 - 200V 500V 25 - 50V 200V 200V 100V 200V 150V R12N Series (See page 26) 100V 100V 50V R12N Series (See page 26) 300V 50V Special values, tolerances, higher WVDC and matching available, please consult factory. www.exxelia.com 149 info@exxelia.com Page revised 01/11 RF CAPACITORS Size Size code CERAMIC CAPACITORS Taping : dimensions General Information CAPACITOR TERMINATIONS AND SOLDERING RECOMMENDATIONS condition. The vapor phase and IR reflow soldering are less aggressive, inducing more restricted thermal shocks. This is the reason why they are preferred to the wave soldering method for reliable applications. In all cases, proper pre-heating is essential. I. TERMINATION TYPES The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of the maximum soldering temperature. While multilayer ceramic capacitors can withstand the peak soldering temperatures for short durations, they should be minimized whenever possible. Our capacitors are delivered with one of the following terminations (for technical reasons, only a limited number of termination types are available in certain cases). All our terminations are backward compatible. Parameter Value Comment Termination Materials A C S non-magnetic (silver-palladium) non-magnetic (pure tin over copper barrier) lead-free (pure tin over nickel barrier) Above precaution given for SMD types are applicable for the implementation of large bare chips (1515 and above). But in general, large bare chips above 2225 are not recommended to be mounted on epoxy printed board due to the thermal expansion mismatch between ceramic capacitor body and epoxy. This is the reason why leaded components will be preferred especially for reliable applications. For information, the typical thermal profiles of these three soldering processes are given hereafter. These typical diagrams are only given as an aid to SMD users in determining specific processes linked to their instrumentations and to their own experience. NB: • terminations type C recommended for non magnetic applications. • termination type A available for non magnetic applications (for historical reason, we have also another code, the code “P”, for the same type of termination. The parts that were designed-in before 2005 might still have a code “P” instead of “A” in the part numbering. But both codes correspond to the same type of termination). NB: reference documents are IEC 61760-1, CECC30000 and IEC68 standards. Please, refer to this standard for more information. III.1.1. Vapour Phase Soldering II. SPECIFICATIONS 250°C Care must be taken when using particular terminations: if the terminations are heated up above a particular temperature and/or for too long a period of time, there is a risk of leaching (dissolution of the termination revealing the inner electrodes). 20s ... 40s 230°C 217°C 200°C ca. 60s ... 130s >217°C 150°C The chart below gives the resistance to soldering heat per termination type, based on a SAC387 solder bath at 260°C. Ramp down rate