CC0603MRX6S5BB226

DATA SHEET SURFACE MOUNT MULTILAYER CERAMIC CAPACITORS General purpose class II X6S 4 V TO 50 V 100 pF to 47µF Product specification – July 30, 2020 V.5 RoHS compliant & Halogen free Product specification Surface Mount Multilayer Ceramic Capacitors General Purpose X6S 4 V to 50 V 2 10 SCOPE ORDERING INFORMATION - GLOBAL PART NUMBER, This specification describes X6S series chip capacitors with leadfree terminations. All part numbers are identified by the series, size, tolerance, TC material, packing style, voltage, process code, termination and capacitance value. YAGEO BRAND ordering code APPLICATIONS PCs, Hard disk, Game PCs Power supplies DVD players Mobile phones Data processing GLOBAL PART NUMBER (PREFERRED ) CC XXXX X X (1) X6S (2) (3) X BB XXX (4) (5) (1) SIZE – INCH BASED (METRIC) 0201 (0603) 0402 (1005) FEATURES Supplied in tape on reel Nickel-barrier end termination RoHS compliant Halogen free compliant 0603 (1608) 0805 (2012) 1206 (3216) 1210 (3225) (2) TOLERANCE K = ± 10% M = ± 20% (3) PACKING STYLE R = Paper/PE taping reel; Reel 7 inch K = Blister taping reel; Reel 7 inch P = Paper/PE taping reel; Reel 13 inch F = Blister taping reel; Reel 13 inch C = Bulk case (4) RATED VOLTAGE 4=4V 5 = 6.3 V 6 = 10 V 7 = 16 V 8 = 25 V 9 = 50 V (5) CAPACITANCE VALUE 2 significant digits+number of zeros The 3rd digit signifies the multiplying factor, and letter R is decimal point Example: 103 = 10 x 103 = 10,000 pF = 10 nF www.yageo.com Jul. 30, 2020 V.5 3 Product specification Surface Mount Multilayer Ceramic Capacitors General Purpose X6S 10 4 V to 50 V CONSTRUCTION The capacitor consists of a rectangular block of ceramic dielectric in which a number of interleaved metal electrodes are contained. This structure gives rise to a high capacitance per unit volume. The inner electrodes are connected to the two end terminations and finally covered with a layer of plated tin (NiSn). Thterminations are lead-free. A cross section of the structure is shown in Fig.1. terminations handbook, 4 columns electrodes MLB457 ceramic material Fig. 1 Surface mount multilayer ceramic capacitor construction DIMENSION OUTLINES Table 1 For outlines see fig. 2 TYPE 0201 L1 (mm) W (mm) 0.6 ± 0.03 0.3 ± 0.03 0.3 ± 0.03 0.6± 0.09 0.3 ± 0.09 0.3± 0.09 1.0 ± 0.05 0.5 ± 0.05 0.5 ± 0.05 1.0 ± 0.15 0.5 ± 0.15 0.5 ± 0.15 T (MM) L2 / L3 (mm) min. 0.10 max. 0.20 L4 (mm) For dimension see Table 1 min. 0.20 W T 0402 1.0 ± 0.20 0.5 ± 0.20 0.5 ± 0.20 1.6± 0.10 0.8 ± 0.10 0.8 ± 0.10 1.6 ± 0.15 0.8 ± 0.15 0.8 ± 0.15 1.6 ± 0.20 0.8 ± 0.20 0.8 ± 0.20 0805 2.0± 0.20 1.25 ± 0.20 1206 3.2 ± 0.30 0603 1210 0.15 0.30 0.40 L2 L4 L1 0.20 0.60 0.40 1.25 ± 0.20 0.25 0.75 0.55 1.6 ± 0.20 1.6 ± 0.20 0.25 0.75 1.40 3.2 ± 0.40 2.5 ± 0.30 2.5 ± 0.20 3.2 ± 0.40 2.5 ± 0.30 2.5 ± 0.30 0.25 0.75 1.40 L3 MBB211 Fig. 2 Surface mount multilayer ceramic capacitor dimension www.yageo.com Jul. 30, 2020 V.5 Product specification Surface Mount Multilayer Ceramic Capacitors General Purpose X6S 4 10 4 V to 50 V CAPACITANCE RANGE & THICKNESS FOR X6S Table 2 Sizes from 0201 to 0402 CAP. 0201 6.3V 0402 10V 16V 25V 6.3 V 0603 10 V 16 V 25 V 4V 6.3 V 10 V 16 V 25 V 50 V 100 nF 0.3± 0.03 0.3± 0.03 220 nF 0.5± 0.05 0.5± 0.05 0.5± 0.05 470 nF 0.5± 0.05 0.5± 0.05 1 uF 0.5± 0.05 0.5± 0.05 0.8± 0.1 0.8± 0.1 0.8± 0.1 0.8± 0.1 0.8± 0.1 2.2 uF 0.5± 0.20 0.5± 0.20 0.8± 0.1 0.8± 0.1 0.8± 0.1 0.8± 0.2 4.7 uF 0.5± 0.15 0.8± 0.2 0.8± 0.2 10 uF 0.8± 0.2 0.8± 0.2 22 uF 0.8± 0.2 0.8± 0.2 47 uF Table 3 Sizes from 0805 to 1210 0805 CAP. 1210 1206 6.3 V 10 V 16 V 25 V 50 V 2.2 uF 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 4.7 uF 1.25± 0.2 1.25± 0.2 1.25± 0.2 1.25± 0.2 10 uF 1.25± 0.2 1.25± 0.2 1.25± 0.2 22 uF 1.25± 0.2 6.3 V 10 V 16 V 25 V 1.6± 0.2 1.6± 0.2 1.6± 0.2 1.6± 0.2 1.6± 0.2 1.6± 0.2 1.6± 0.2 6.3 V 10 V 2.5± 0.2 2.5± 0.2 16V 100 nF 220 nF 470 nF 1 uF 47 uF 100 uF www.yageo.com Jul. 30, 2020 V.5 Product specification Surface Mount Multilayer Ceramic Capacitors General Purpose X6S 5 10 4 V to 50 V THICKNESS CLASSES AND PACKING QUANTITY Table 4 SIZE CODE Ø 180 MM / 7 INCH Paper Blister Ø 330 MM / 13 INCH Paper Blister THICKNESS CLASSIFICATION TAPE WIDTH QUANTITY PER REEL QUANTITY PER BULK CASE 0201 0.3 ± 0.03 mm 8 mm 15,000 --- 50,000 --- --- 0402 0.5 ± 0.05 mm 8 mm 10,000 --- 50,000 --- 50,000 0603 0.8 ± 0.1 mm 8 mm 4,000 --- 15,000 --- 15,000 0805 1.25 ± 0.2 mm 8 mm --- 3,000 --- 10,000 5,000 1206 1.6 ± 0.2 mm 8 mm --- 2,000 --- 8,000 --- 1210 2.5± 0.2/0.3 mm 8 mm --- 500 --- --- --- ELECTRICAL CHARACTERISTICS X6S DIELECTRIC CAPACITORS; NISN TERMINATIONS Unless otherwise specified, all tests and measurements shall be made under standard atmospheric conditions for testing as given in 5.3 of IEC 60068-1: Temperature: 15 °C to 35 °C - Relative humidity: 25% to 75% - Air pressure: 86 kPa to 106 kPa Before the measurements are made, the capacitor shall be stored at the measuring temperature for a time sufficient to allow the entire capacitor to reach this temperature. The period as prescribed for recovery at the end of a test is normally sufficient for this purpose. - Table 5 VALUE DESCRIPTION Capacitance range 100 nF to 100 µF Capacitance tolerance ± 10% and ± 20% Dissipation factor (D.F.) ≤10% Insulation resistance after 1 minute at Ur (DC) Rins × Cr ≥ 100 / 50 Ω.F * Maximum capacitance change as a function of temperature (temperature characteristic/coefficient): ± 22% Operating temperature range: –55 °C to +105 °C Note: Rins × Cr ≥ 100 Ω.F Rins × Cr ≥ 50 Ω.F 0201: 100nF to 470nF 0201: 1uF 0402: 470nF, 1uF/ 6.3V to 10V 0402: 220nF, 1uF/ 16V to 25V, 2.2uF, 4.7uF to 10uF/ 6.3V 0603: 1uF, 2.2uF/ 6.3V to 16V, 4.7uF/ 6.3V to 16V 0603: 2.2uF/ 25V, 4.7uF/ 25V, 10uF to 22uF 0805: 2.2uF, 4.7uF to 10uF/ 6.3V to 16V 0805: 4.7uF/ 50V, 10uF/ 25V, 22uF to 47uF 1206: 10uF/ 6.3V to 16V, 22uF/ 6.3V to 10V 1206: 10uF/ 25V, 22uF/ 16V, 47uF to 100uF 1210: 47uF to 100uF www.yageo.com Jul. 30, 2020 V.5 Product specification Surface Mount Multilayer Ceramic Capacitors General Purpose X6S 4 V to 50 V 6 10 SOLDERING RECOMMENDATION Table 6 SOLDERING METHOD Reflow SIZE ≤ 0402 0603 0805 1206 ≥ 1210 Reflow only ≥ 1.0 µF ≥ 2.2 µF ≥ 4.7 µF Reflow only --- < 1.0 µF < 2.2 µF < 4.7 µF --- Reflow/Wave TESTS AND REQUIREMENTS Table 7 Test procedures and requirements TEST TEST METHOD PROCEDURE REQUIREMENTS Mounting IEC 60384- 4.3 21/22 The capacitors may be mounted on printed-circuit boards or ceramic substrates No visible damage Any applicable method using × 10 magnification In accordance with specification Visual Inspection and Dimension Check 4.4 Capacitance (1) 4.5.1 Class 2: Within specified tolerance At 20 °C, 24 hrs after annealing Cap ≤ 1 µF, f = 1 KHz, measuring at voltage 1 Vrms at 20 °C Cap > 1 µF, f = 1 KHz for C ≤ 10 µF, rated voltage > 6.3 V, measuring at voltage 1 Vrms at 20 °C f = 1 KHz, for C ≤ 10 µF, rated voltage ≤ 6.3 V, measuring at voltage 0.5 to 1 Vrms at 20 °C f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C Dissipation Factor (D.F.) (1) 4.5.2 Class 2: In accordance with specification At 20 °C, 24 hrs after annealing Cap ≤ 1 µF, f = 1 KHz, measuring at voltage 1 Vrms at 20 °C Cap > 1 µF, f = 1 KHz for C ≤ 10 µF, rated voltage > 6.3 V, measuring at voltage 1 Vrms at 20 °C f = 1 KHz, for C ≤ 10 µF, rated voltage ≤ 6.3 V, measuring at voltage 0.5 Vrms at 20 °C f = 120 Hz for C > 10 µF, measuring at voltage 0.5 Vrms at 20 °C Insulation Resistance 4.5.3 At Ur (DC) for 1 minute In accordance with specification NOTE 1. The figure indicates typical inspection. Please refer to individual specifications. www.yageo.com Jul. 30, 2020 V.5 Product specification Surface Mount Multilayer Ceramic Capacitors TEST TEST METHOD Temperature 4. Characteristic General Purpose X6S PROCEDURE REQUIREMENTS Capacitance shall be measured by the steps shown in the following table. Class1: ∆ C/C: ± 30ppm The capacitance change should be measured after 5 min at each specified temperature stage. Class2: X6S: ∆ C/C: ±22% Step Temperature(°C) a 25± 2 b Lower temperature± 3°C c 25± 2 d Upper Temperature± 2°C e 25± 2 4 V to 50 V 7 10 (1) Class I Temperature Coefficient shall be calculated from the formula as below C2 - C1 Temp, Coefficient = 106 [ppm/°C] C1 xΔT C1: Capacitance at step c C2: Capacitance at 125°C ∆T: 100°C(=125°C-25°C) (2) Class II Capacitance Change shall be calculated from the formula as below C2 - C1 ∆C = x 100% C1 C1: Capacitance at step c C2: Capacitance at step b or d Adhesion Bending Strength IEC 6038421/22 4.7 A force applied for 10 seconds to the line joining the terminations and in a plane parallel to the substrate Force size ≥ 0603: 5N size = 0402: 2.5N size = 0201: 1N 4.8 Mounting in accordance with IEC 60384-22 paragraph 4.3 No visible damage Conditions: bending 1 mm at a rate of 1 mm/s, radius jig 5 mm ∆C/C Class2: X6S: ± 10% www.yageo.com Jul. 30, 2020 V.5 Product specification Surface Mount Multilayer Ceramic Capacitors TEST TEST METHOD Resistance to Soldering Heat 4.9 General Purpose X6S 4 V to 50 V 8 10 PROCEDURE REQUIREMENTS Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at room temperature Dissolution of the end face plating shall not exceed 25% of the length of the edge concerned Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute Preheating: for size >1206: 100 °C to 120 °C for 1 minute and 170 °C to 200 °C for 1 minute Solder bath temperature: 260 ± 5 °C Dipping time: 10 ± 0.5 seconds ∆C/C Class2: X6S: ± 10% D.F. within initial specified value Rins within initial specified value Recovery time: 24 ± 2 hours Solderability 4.10 Preheated the temperature of 80 °C to 140 °C and maintained for 30 seconds to 60 seconds. The solder should cover over 95% of the critical area of each termination 1. Temperature: 235± 5°C / Dipping time: 2 ± 0.5 s 2. Temperature: 245± 5°C / Dipping time: 3 ± 0.5 s (lead free) Depth of immersion: 10mm Rapid Change of Temperature IEC 6038421/22 4.11 Preconditioning; 150 +0/–10 °C for 1 hour, then keep for 24 ± 1 hours at room temperature 5 cycles with following detail: 30 minutes at lower category temperature 30 minutes at upper category temperature Recovery time 24 ± 2 hours No visual damage ∆C/C Class2: X6S: ± 15% D.F. meet initial specified value Rins meet initial specified value www.yageo.com Jul. 30, 2020 V.5 Product specification Surface Mount Multilayer Ceramic Capacitors TEST Damp Heat with Ur Load TEST METHOD 4.13 REQUIREMENTS No visual damage after recovery 4. 5. 4.14 4 V to 50 V 1. Preconditioning, class 2 only: 3. IEC 6038421/22 X6S PROCEDURE 2. Endurance General Purpose 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp Initial measure: Spec: refer to initial spec C, D, IR Damp heat test: 500 ± 12 hours at 40 ± 2 °C; 90 to 95% R.H. 1.0 Ur applied Recovery: Class 2: 24 ± 2 hours Final measure: C, D, IR P.S. If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be preconditioned according to “IEC 60384 4.1” and then the requirements shall be met. 1. Preconditioning, class 2 only: 150 +0/-10 °C /1 hour, then keep for 24 ± 1 hour at room temp 2. Initial measure: Spec: refer to initial spec C, D, IR 3. Endurance test:: Temperature: X6S: 105 °C Specified stress voltage applied for 1,000 hours: Applied 1.5 x Ur. Applied 1 Ur: 0201: 1uF 0402: 4.7uF, 10uF 9 10 ∆C/C Class2: ± 20% D.F. Class2: 2 x initial value max Rins Class2: Rins x Cr ≥ 5s whichever is less No visual damage ∆C/C Class 2: ± 20% D.F. Class 2: 2 x initial value max Rins Class 2: Rins x Cr ≥ 10s 0603: 10uF, 22uF 0805: 10uF/ 25V, 22uF/ 16V Recovery time: 24 ± 2 hours 4. Final measure: C, D, IR P.S. If the capacitance value is less than the minimum value permitted, then after the other measurements have been made the capacitor shall be preconditioned according to “IEC 60384 4.1” and then the requirements shall be met. Voltage Proof IEC 60384-1 4.6 Specified stress voltage applied for 1~5 seconds Ur ≤ 100 V: series applied 2.5 Ur No breakdown or flashover Charge/Discharge current is less than 50 mA www.yageo.com Jul. 30, 2020 V.5 Product specification Surface Mount Multilayer Ceramic Capacitors General Purpose X6S 4 V to 50 V 10 10 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Version 5 Jun. 2, 2020 - - Product range updated Version 4 Aug 7, 2017 - - 0402 Dimension update Version 3 Jul 19, 2017 - - Product range updated Version 2 Feb. 20, 2017 - - Dimension & capacitance update Version 1 Sep. 16, 2015 - - Dimension & capacitance update Version 0 Nov. 18, 2014 - - New datasheet for general purpose High Cap X6S www.yageo.com Jul. 30, 2020 V.5 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: YAGEO: CC0201KRX6S5BB104 CC0201KRX6S6BB104 CC0603MRX6S5BB226 CC0805KKX6S6BB106