HQ0402CG100G500

  HQ Series   Multilayer Ceramic Capacitors (High Q)   Feature     Surface mount device with high reliability Hi-Q and low ESR at high frequencies Low capacitance with tight tolerance Excellent temperature characteristics    Part Numbering System HQ 0603 CG 4R7 B 500 Meritek Series Chip Size: 0402 / 0603 / 0805 Dielectric: CG=C0G (NPO) Capacitance Capacitance expressed in Pico farads (pF). First two digits are significant figures. Third digit denotes number of zeros. 'R' denotes decimal point for values less than 10 pF ie. 4R7=4.2pF, 101=100pF Tolerance Code Value B ±0.1pF C ±0.25pF D ±0.5pF F ±1% F ±2% J ±5% Rated Voltage Code Value 160 16VDC 250 25VDC 500 101 201 251 501 631 50VDC 100VDC 200VDC 250VDC 500VDC 630VDC Dimensions  Size Inch (mm) 0402 (1005) 0603 (1608) 0805 (2012) L (mm) W (mm) 1.00±0.05 0.50±0.05 0.50±0.05 N 1.60±0.10 0.80±0.10 0.80±0.07 S 1.60 +0.15/-0.10 0.80 +0.15/-0.10 0.80 +0.15/-0.10 X 0.60±0.10 A 0.80±0.10 B 1.25±0.10 D 2.00±0.15 T (mm)/Symbol 1.25±0.10 MB (mm) 0.25 -0.5 0.40±0.15 0.50±0.20                       L T W MB MB Fig. 1 The outline of MLCC Constructions No. Name NP0  Ceramic material BaTiO3 based  Inner electrode AgPd alloy Inner layer    Termination Ag or Cu Middle layer Ni Outer layer Sn (Matt)   Fig. 11 The construction of MLCC     Rev. 7a   HQ Series   Multilayer Ceramic Capacitors (High Q) Capacitance Range   Capacitance DIELECTRIC SIZE 0.5pF (0R5) 0.6pF (0R6) 0.7pF (0R7) 0.8pF (0R8) 0.9pF (0R9) 1.0pF (1R0) 1.2pF (1R2) 1.5pF (1R5) 1.8pF (1R8) 2.2pF (2R2) 2.7pF (2R7) 3.3pF (3R3) 3.9pF (3R9) 4.7pF (4R7) 5.6pF (5R6) 6.8pF (6R8) 8.2pF (8R2) 10pF (100) 12pF (120) 15pF (150) 18pF (180) 22pF (220) 27pF (270) 33pF (330) 39pF (390) 47pF (470) 56pF (560) 68pF (680) 82pF (820) 100pF (101) 120pF (121) 150pF (151) 180pF (181) 220pF (221) 270pF (271) 330pF (331) 390pF (391) 470pF (471) 560pF (561) 680pF (681) 820pF (821) 1,000pF (102) 1,200pF (122) 1,500pF (152) 1,800pF (182) 2,200pF (222) 2,700pF (272) 3,300pF (332) NP0 16 N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N N N N N N N N N N N N N N N N N N N N N 0402 25 N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N N N N N N N N N N N N N N N N N N N N N 0603 50 N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N^ N N N N N N N N N N N N N N N N N N N N N 16 S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S S S S S S S S S S S S S S S S S S S S S S S S S X X X X X X 25 S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S S S S S S S S S S S S S S S S S S S S S S S S S X X X X X X 50 S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S^ S S S S S S S S S S S S S S S S S S S S S S S S S X X X X X X 1. 0402, Capacitance 1000pF, 1.0±0.2Vrms, 1KHz±10% * NP0: Cap≥30pF, Q≥1000; Cap0603) Termination * Test time: 10±1 sec. Vibration * Vibration frequency: 10~55 Hz/min. * No remarkable damage. Resistance * Total amplitude: 1.5mm * Cap change and Q/D.F.: To meet initial spec. * Test time: 6 hrs. (Two hours each in three mutually perpendicular directions.) 9. Solderability * Solder temperature: 235±5°C 95% min. coverage of all metalized area. * Dipping time: 2±0.5 sec. 10. Bending Test * The middle part of substrate shall be pressurized by * No remarkable damage. means of the pressurizing rod at a rate of about 1 mm per * Cap change: within ±5.0% or ±0.5pF whichever is larger. second until the deflection becomes 1 mm and then the (This capacitance change means the change of capacitance pressure shall be maintained for 5±1 sec. under specified flexure of substrate from the capacitance * Measurement to be made after keeping at room temp for measured before the test.) 24±2 hrs. 11. Resistance to * Solder temperature: 270±5°C * No remarkable damage. Soldering * Dipping time: 10±1 sec Heat * Preheating: 120 to 150°C for 1 minute before immerse the * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * Cap change: within ±2.5% or ±0.25pF whichever is larger. capacitor in a eutectic solder. * 25% max leaching on each edge. * Measurement to be made after keeping at room temp for 24±2 hrs. (Class I) or 48±4 hrs. (Class II). 12. Temperature Cycle * Conduct the five cycles according to the temperatures and * No remarkable damage. time. Step 1 2 3 4 * Cap change：within ±2.5％ or ±0.25pF whichever is larger. Temp. (°C) Min. operating temp. +0/-3 Room temp. Max operating temp. +3/-0 Room temp. Time (min.) 30±3 2~3 30±3 2~3 * Q/D.F., I.R. and dielectric strength: To meet initial requirements. * Measurement to be made after keeping at room temp for 24±2 hrs. * Test temp.: 40±2°C * No remarkable damage. (Damp Heat) * Humidity: 90~95% RH * Cap change: within ±5.0% or ±0.5pF whichever is larger. Steady State * Test time: 500+24/-0hrs. * Q/D.F. value: 13. Humidity * Measurement to be made after keeping at room temp for 24±2 hrs. NP0: Cap≥30pF, Q≥350; 10pF≤Cap