WSP9435
P-Ch MOSFET
Product Summery
General Description
The WSP9435 is the highest performance trench
P-Ch MOSFET with extreme high cell density ,
which provide excellent RDSON and gate charge
for most of the synchronous buck converter
applications .
BVDSS
RDSON
ID
-30V
38mΩ
-5.4A
Applications
The WSP9435 meet the RoHS and Green
Product requirement , with full function reliability
approved.
z Power Management in Notebook Computer,
Portable Equipment and Battery Powered
Systems
Features
z ESD:2KV
z Advanced high cell density Trench technology
SOP-8 Pin Configuration
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
VDS
VGS
ID@TA=25℃
ID@TA=70℃
IDM
Rating
Units
Drain-Source Voltage
-30
V
Gate-Source Voltage
±20
V
1
-5.4
A
1
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
Pulsed Drain
-4.5
A
Current1,2
-21
A
3
PD@TA=25℃
Total Power Dissipation
2.5
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
Parameter
Typ.
RθJA
Thermal Resistance Junction-Ambient
RθJC
1
www.winsok.tw
Thermal Resistance Junction-Case
Page 1
1
Max.
Unit
---
80
℃/W
---
30
℃/W
Rev 2: Apr.2019
WSP9435
P-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
VGS(th)
Static Drain-Source On-Resistance2
Gate Threshold Voltage
Min.
Typ.
Max.
Unit
VGS=0V , ID=-250uA
-30
---
---
V
Reference to 25℃ , ID=-1mA
---
-0.023
---
V/℃
VGS=-10V , ID=-5.4A
---
38
48
VGS=-4.5V , ID=-2A
---
60
78
-1.0
-1.5
-2.3
V
---
4
---
mV/℃
VDS=-24V , VGS=0V , TJ=25℃
---
---
-1
VDS=-24V , VGS=0V , TJ=55℃
---
---
-5
VGS=VDS , ID =-250uA
mΩ
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=-5V , ID=-4A
---
11
---
S
Qg
Total Gate Charge (-4.5V)
---
13
19
---
1.3
2.2
---
3.1
2.7
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDS=-15V , VGS=-10V , ID=-5.4A
uA
nC
---
8
9.6
Rise Time
VDD=-15V , VGS=-10V , RG=6Ω,
---
13
15.1
Turn-Off Delay Time
ID=-1A ,RL=10Ω.
---
26
36
Fall Time
---
7
12.0
Ciss
Input Capacitance
---
642
---
Coss
Output Capacitance
---
76
---
Crss
Reverse Transfer Capacitance
---
66
---
Min.
Typ.
Max.
Unit
---
---
-2.0
A
---
---
-21
A
---
---
-1.2
V
---
13
---
nS
---
7
---
nC
Td(on)
Tr
Td(off)
Tf
Turn-On Delay Time
VDS=-15V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
Parameter
Conditions
1,4
IS
Continuous Source Current
ISM
Pulsed Source Current2,4
2
VSD
Diode Forward Voltage
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
VGS=0V , IS=-1A , TJ=25℃
IF=-5.4A,dI/dt=100A/µs , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper ,t≤10sec.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The power dissipation is limited by 150℃ junction temperature
4.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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Page 2
Rev 2: Apr.2019
WSP9435
P-Ch MOSFET
Typical Characteristics
100
RDSON (mΩ)
ID=-5.4A
80
60
42
2
4
6
-VGS (V)
8
10
Fig.2 On-Resistance vs. Gate-Source
Fig.1 Typical Output Characteristics
10
VDS=-15V
ID=-5.4A
-IS Source Current(A)
8
TJ=150℃
TJ=25℃
6
4
2
0
0.2
0.4
0.6
0.8
1
-VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics of Reverse
Fig.4 Gate-Charge Characteristics
2.0
Normalized On Resistance
Normalized VGS(th)
1.5
1.5
1
1.0
0.5
0.5
0
-50
0
50
100
TJ ,Junction Temperature (℃)
150
-50
50
100
150
Fig.6 Normalized RDSON vs. TJ
Fig.5 Normalized VGS(th) vs. TJ
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0
TJ , Junction Temperature (℃)
Page 3
Rev 2: Apr.2019
WSP9435
P-Ch MOSFET
Fig.7 Capacitance
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJA)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.01
P DM
0.01
T ON
T
D = TON/T
TJpeak = TC+P DMXRθJC
SINGLE
0.001
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
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Fig.11 Gate Charge Waveform
Page 4
Rev 2: Apr.2019
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