Y20600327122040

承 认 书 SPECIFICATION FOR APPROVAL 客户名称：Customer 货 Y2*6 石英晶体谐振器 名：Description 客户料号： Part No 物料编号： Code No Y206327681251075 频 率：Frequency 32.768KHZ 日 期：Date 2023-04-19 备 注：RoHS compliance with Directive (EU) 2015/863 制作(Prepare by) 检查(Check by) 批准（Approve by） 江丹娜 甘瑛 张刚 客户批准 Approve by customer 批准日期 Approval date Add:广东省深圳市华发北路桑达工业区桑达雅苑 7P 7 P Sangda Yayuan Huafa North Road, Futian District, Shenzhen, Guangdong Tel: 86-755-83048260 86-755-83048290 Fax: 86-755-83048280 www.jghcorp.com ShenZhen JingGuangHua Electronics Co.，Ltd. 1、 Specifications 1 规格型号 Holder Type 2 标称频率 Nominal Frequency 32.768KHz 3 振动模式 Mode of Oscillation 基频 4 调整频差 Frequency Tolerance at 25℃ 5 温度频差 Temperature Frequency Stability 6 工作温度 Operating Temperature Range -20~70℃ 7 贮存温度 Storage Temperature Range -40~85℃ 8 负载电容 Load Capacitance 12.5pF 9 静电容 Shunt capacitance ≤3pf 10 等效电阻 Equivalent Series Resistance 40 KΩ Max 11 激励功率 Drive Level 12 绝缘阻抗 Insulation Resistance 13 年老化率 Aging Y2*6 ±10ppm -0.04ppm/deg. C2Max. 0.1uW 500MΩ min./DC100V ±3ppm/First year 2.Dimensions (unit:mm) 3.Suggested soldering 3.1 3.2 3.3 Not recommended reflow soldering. lead wire should be soldered within 3seconds with the iron heated to a temperature no higher than 380℃. in sold-dip mounting,ti should be soldered with 10 seconds no higher than 260℃. www.jghcorp.com ShenZhen JingGuangHua Electronics Co.，Ltd. 4、Reliability specifications NO 1. Item Vibration 2. Shock 3. Hermetic seal Condition (1)Vibration Frequency 10 to 55Hz Frequency Change:±5ppm Max. (2)Vibration Amplitude 1.5mm Resistance Change: 5kohm Max. (3) Cycle Time 1-2min(10-55-10Hz) (4)Direction X.Y.Z (5)Duration 2h/each direction 3 Times free drop from 75cm height to hard wooden board of thickness more than 30mm Solder ability High temperature Resistance Change: 5kohm Max. less than 1 × 10 EXP(–7) Checked:before the molded crystal uints mbar.l/sec. crystal units into the solution (7-10%) of rosin 3±0.5s,then dip it into the tank 5-10s.Temperature of solder melted tank is 245℃ ±5℃ 5. Frequency Change:±5ppm Max. Helium leak detector Dip the leads of 4. Standard The dipped surface of the leads should be at least 95% covered with continuous new solder coating 96 hours at +100℃±2℃ Frequency Change:±5ppm Max. After 1-2hours past at room temperature from Resistance Change: 5kohm Max. following 6. Low temperature 72 hours at -40℃±2℃ Frequency Change:±5ppm Max. After 1-2hours past at room temperature from Resistance Change: 5kohm Max. following test. 7. Humidity 96 hours at +40℃±2℃,relative humidity Frequency Change:±5ppm Max. 90-95%After 1-2hours past at room temperature Resistance Change: 5kohm Max. from following 8. 9. 10. After supplying the following temperature cycle Frequency Change:±5ppm Max. (50cycles) Resistance Change: 5kohm Max. Temperature cycle salt spray test Lead strength www.jghcorp.com On the basis of GB/T10125-1997 Frequency Change:±5ppm Max. Resistance Change: 5kohm Max. In the lead 2.00 Kg tensile force was applied at the Frequency Change:±5ppm Max. end to keep more than 5 seconds Resistance Change: 5kohm Max. ShenZhen JingGuangHua Electronics Co.，Ltd. 5、Packaging standard Dimension of Inside Package 内包装尺寸图 Dimensions of outside Package 10 inner box=1 outer box 外包装尺寸图 www.jghcorp.com ShenZhen JingGuangHua Electronics Co.，Ltd. 6、Handling Notice for Standard Tuning Fork Crystal (Cylindrical Type) 6.1. Shock resistance It may deteriorate the characteristics or cause of no oscillation if excess physical shock given. Please be careful not to drop. Please use under condition to minimize the shocks as much as possible. Please review the conditions if it is used by auto mounting or after the conditions are changed. 6.2. Heat and humidity resistance in storage Storing the crystal products under higher or lower temperature or high humidity for a long period may deteriorate the characteristics of crystal units. Please store and use the crystal products at the normal temperature and humidity. 6.3. Solder heat resistance Standard type crystal products use Material have a 230℃ melting point. Heating up the package more than 230ºC may deteriorate the characteristics or cause of no oscillation the products. If the crystal products need to be soldered at temperature of more than +230ºC, please study heat-resistance products or SMD products. Please review the condition or consult us about flow solder process. 6.4. Mounting method to PCB When the crystal products need to be lay down please fix to PCB securely. If the crystal is used with mechanical vibration location, please put cushion in between PCB or fix with elasticity glue (Silicon etc) as shown in below figure. Please don’t gluing hermetic seal grass.When the crystal products need to be mounted vertically, gap between crystal units and PCB more than 3mm for 3×8 type , more than 2mm for 2×6 type is recommended. 6.5. Lead process When the lead needs to be cut please maintenance the cutter. When the lead needs to be bent or repaired please be careful not to giving excess pressure at the root of the lead to avoid crack of the hermetic seal glass. Also please be careful not to giving excess pressure at sealing to avoid sealing tightness deteriorate.Leave more than 0.5 mm of lead from the case. 6.6 Ultrasonic cleaning and ultrasonic soldering Soldered by ultrasonic cannot be guaranteed, because crystal may be sympathetic vibrated and may damage.Please study at your side about ultrasonic cleaning. 6.7. Drive level Applying excessive drive level to the crystal units may cause deterioration of characteristics or damage. Less than 1.0μW is recommended to this products. More than 2.0μW cannot be guaranteed. www.jghcorp.com ShenZhen JingGuangHua Electronics Co.，Ltd.