XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
1 Features
3 Description
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The XDx31 family of voltage-to-frequency converters
are ideally suited for use in simple low-cost circuits
for analog-to-digital conversion, precision frequencyto-voltage conversion, long-term integration, linear
frequency modulation or demodulation, and many
other functions. The output when used as a voltageto-frequency converter is a pulse train at a frequency
precisely proportional to the applied input voltage.
Thus, it provides all the inherent advantages of the
voltage-to-frequency conversion techniques, and is
easy to apply in all standard voltage-to-frequency
converter applications.
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Ensured Linearity 0.01% Maximum
Improved Performance in Existing Voltage-toFrequency Conversion Applications
Split or Single-Supply Operation
Operates on Single 5-V Supply
Pulse Output Compatible With All Logic Forms
Excellent Temperature Stability: ±50 ppm/°C
Maximum
Low Power Consumption: 15 mW Typical at 5 V
Wide Dynamic Range, 100 dB Minimum at 10-kHz
Full Scale Frequency
Wide Range of Full Scale Frequency:
1 Hz to 100 kHz
Low-Cost
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PART NUMBER
2 Applications
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Device Information(1)
Voltage to Frequency Conversions
Frequency to Voltage Conversions
Remote-Sensor Monitoring
Tachometers
Schematic Diagram
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1
PACKAGE
XD331-231
DIP8
XL331
SOP8
XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
5 Pin Configuration and Functions
P Package
8-Pin PDIP
Top View
Pin Functions
PIN
NAME
NO.
IOUT
1
IREF
FOUT
I/O
DESCRIPTION
O
Current Output
2
I
Reference Current
3
O
Frequency Output. This output is an open-collector output and requires a pullup resistor.
GND
4
G
Ground
RC
5
I
R-C filter input
THRESH
6
I
Threshold input
COMPIN
7
I
Comparator Input
VS
8
P
Supply Voltage
6 Specifications
6.1 Absolute Maximum Ratings (1) (2) (3)
MIN
MAX
UNIT
40
V
+VS
V
260
°C
Supply Voltage, VS
Output Short Circuit to Ground
Continuous
Output Short Circuit to VCC
Continuous
−0.2
Input Voltage
Lead Temperature (Soldering, 10 sec.)
(1)
(2)
PDIP
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are measured with respect to GND = 0 V, unless otherwise noted.
6.2 ESD Ratings
V(ESD)
(1)
(2)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) (2)
VALUE
UNIT
±500
V
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
Human body model, 100 pF discharged through a 1.5-kΩ resistor.
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
6.3 Recommended Operating Conditions
XD231
Operating Ambient
Temperature
XD331 XL331
Supply Voltage, VS (1)
(1)
MIN
MAX
−25
85
UNIT
°C
0
70
°C
4
40
V
All voltages are measured with respect to GND = 0 V, unless otherwise noted.
6.4 Thermal Information
XD331 XL331
THERMAL METRIC (1)
P (PDIP)
UNIT
8 PINS
RθJA
(1)
Junction-to-ambient thermal resistance
100
°C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
PARAMETER
VFC Non-Linearity
TEST CONDITIONS
MIN
TYP
MAX
UNIT
4.5 V ≤ VS ≤ 20 V
±0.003
±0.01
% FullScale
TMIN ≤ TA ≤ TMAX
±0.006
±0.02
% FullScale
VS = 15 V, f = 10 Hz to 11 kHz
±0.024
±0.14
%FullScale
0.95
1
1.05
kHz/V
0.9
1
1.1
kHz/V
TMIN ≤ TA ≤ TMAX
4.5 V ≤ VS ≤ 20 V
±30
±150
ppm/°C
±20
±50
ppm/°C
4.5 V ≤ VS ≤ 10 V
0.01
0.1
%/V
10 V ≤ VS ≤ 40 V
0.006
0.06
%/V
(1)
VFC Non-Linearity in Circuit of Figure 14
Conversion Accuracy
Scale Factor (Gain)
Temperature Stability
of Gain
XD231
VIN = −10 V, RS = 14 kΩ
XD331, XL331
XDx31
XDx31
Change of Gain with VS
Rated Full-Scale Frequency
VIN = −10 V
10.0
Gain Stability vs. Time (1000 Hours)
TMIN ≤ TA ≤ TMAX
Over Range (Beyond Full-Scale) Frequency
VIN = −11 V
kHz
% FullScale
±0.02
10%
INPUT COMPARATOR
Offset Voltage
XD231
TMIN ≤ TA ≤ TMAX
XD331/XL331
TMIN ≤ TA ≤ TMAX
Bias Current
Offset Current
Common-Mode Range
TMIN ≤ TA ≤ TMAX
±3
±10
mV
±4
±14
mV
±3
±10
mV
−80
−300
nA
±8
±100
nA
VCC − 2
V
−0.2
TIMER
Timer Threshold Voltage, Pin 5
Input Bias Current, Pin 5
0.667 × VS
0.7 × VS
All Devices
0V ≤ VPIN 5 ≤ 9.9 V
±10
±100
nA
XD231
VPIN
5
= 10 V
200
1000
nA
XD331/XL331
VPIN
5 = 10 V
200
500
nA
0.22
0.5
V
VSAT PIN 5 (Reset)
(1)
0.63 × VS
VS = 15 V
I = 5 mA
Non-linearity is defined as the deviation of fOUT from VIN × (10 kHz/−10 VDC) when the circuit has been trimmed for zero error at 10 Hz
and at 10 kHz, over the frequency range 1 Hz to 11 kHz. For the timing capacitor, CT, use NPO ceramic, Teflon®, or polystyrene.
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
Electrical Characteristics (continued)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
126
135
144
μA
116
136
156
μA
0.2
1
μA
0.02
10
nA
2
50
nA
CURRENT SOURCE (PIN 1)
XD231
Output Current
0V ≤ VPIN 1 ≤ 10 V
Change with Voltage
Current Source OFF
Leakage
RS = 14 kΩ, VPIN 1 = 0
XD331, XL331
XD231
XD331 XL331
All Devices
TA = TMAX
Operating Range of Current (Typical)
μA
(10 to 500)
REFERENCE VOLTAGE (PIN 2)
XD231
1.76
1.89
2.02
1.7
1.89
2.08
XD331, XL331
Stability vs. Temperature
±60
Stability vs. Time, 1000 Hours
VDC
VDC
ppm/°C
±0.1%
LOGIC OUTPUT (PIN 3)
I = 5 mA
VSAT
0.15
0.5
V
0.1
0.4
V
±0.05
1
μA
2
3
4
mA
VS = 40 V
2.5
4
6
mA
VS = 5 V
1.5
3
6
mA
2
4
8
mA
I = 3.2 mA (2 TTL Loads),
TMIN ≤ TA ≤ TMAX
OFF Leakage
SUPPLY CURRENT
XD231
XD331, XL331
VS = 5 V
VS = 40 V
6.6 Dissipation Ratings
Package Dissipation at 25°C (1)
(1)
VALUE
UNIT
1.25
W
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature TA, and can be calculated using the formula
PDmax = (TJmax - TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe
fault condition (e.g., when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed).
Obviously, such conditions should always be avoided.
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
6.7 Typical Characteristics
Figure 1. Non-Linearity Error as Precision V-to-F Converter
Figure 2. Non-Linearity Error
Figure 3. Non-Linearity Error vs. Power Supply Voltage
Figure 4. Frequency vs. Temperature
Figure 5. VREF vs. Temperature
Figure 6. Output Frequency vs. VSUPPLY
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
Typical Characteristics (continued)
Figure 8. Non-Linearity Error (Figure 14)
Figure 7. 100 kHz Non-Linearity Error
Figure 9. Input Current (Pins 6,7) vs. Temperature
Figure 10. Power Drain vs. VSUPPLY
Figure 11. Output Saturation Voltage vs. IOUT (Pin 3)
Figure 12. Non-Linearity Error, Precision F-to-V Converter
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
7 Detailed Description
7.1 Overview
7.1.1 Detail of Operation, Functional Block Diagram
The Functional Block Diagram shows a band gap reference which provides a stable 1.9-VDC output. This 1.9 VDC
is well regulated over a VS range of 3.9 V to 40 V. It also has a flat, low temperature coefficient, and typically
changes less than ½% over a 100°C temperature change.
The current pump circuit forces the voltage at pin 2 to be at 1.9 V, and causes a current i = 1.90 V/RS to flow.
For RS=14 k, i=135 μA. The precision current reflector provides a current equal to i to the current switch. The
current switch switches the current to pin 1 or to ground, depending upon the state of the R-S flip-flop.
The timing function consists of an R-S flip-flop and a timer comparator connected to the external RtCt network.
When the input comparator detects a voltage at pin 7 higher than pin 6, it sets the R-S flip-flop which turns ON
the current switch and the output driver transistor. When the voltage at pin 5 rises to ⅔ VCC, the timer comparator
causes the R-S flip-flop to reset. The reset transistor is then turned ON and the current switch is turned OFF.
However, if the input comparator still detects the voltage on pin 7 as higher than pin 6 when pin 5 crosses ⅔
VCC, the flip-flop will not be reset, and the current at pin 1 will continue to flow, trying to make the voltage at pin 6
higher than pin 7. This condition will usually apply under start-up conditions or in the case of an overload voltage
at signal input. During this sort of overload the output frequency will be 0. As soon as the signal is restored to the
working range, the output frequency will be resumed.
7.2 Functional Block Diagram
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
8 Application and Implementation
8.1 Application Information
8.1.1 Simplified Voltage-to-Frequency Converter
The operation of these blocks is best understood by going through the operating cycle of the basic V-to-F
converter, Figure 13, which consists of the simplified block diagram of the XDx31 and the various resistors and
capacitors connected to it.
The voltage comparator compares a positive input voltage, V1, at pin 7 to the voltage, Vx, at pin 6. If V1 is
greater, the comparator will trigger the 1-shot timer. The output of the timer will turn ON both the frequency
output transistor and the switched current source for a period t = 1.1 RtCt. During this period, the current i will
flow out of the switched current source and provide a fixed amount of charge, Q = i × t, into the capacitor, CL.
This will normally charge Vx up to a higher level than V1. At the end of the timing period, the current i will turn
OFF, and the timer will reset itself.
Now there is no current flowing from pin 1, and the capacitor CL will be gradually discharged by RL until Vx falls
to the level of V1. Then the comparator will trigger the timer and start another cycle.
The current flowing into CL is exactly IAVE = i × (1.1×RtCt) × f, and the current flowing out of CL is exactly Vx/RL ≃
VIN/RL. If VIN is doubled, the frequency will double to maintain this balance. Even a simple V-to-F converter can
provide a frequency precisely proportional to its input voltage over a wide range of frequencies.
9.1.2 Principles of Operation
The XDx31 are monolithic circuits designed for accuracy and versatile operation when applied as voltage-tofrequency (V-to-F) converters or as frequency-to-voltage (F-to-V) converters. A simplified block diagram of the
XDx31 is shown in Figure 13 and consists of a switched current source, input comparator, and 1-shot timer.
Figure 13. Simplified Block Diagram of Stand-Alone
Voltage-to-Frequency Converter and
External Components
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
8.2 Typical Applications
8.2.1 Basic Voltage-to-Frequency Converter
The simple stand-alone V-to-F converter shown in Figure 14 includes all the basic circuitry of Figure 13 plus a
few components for improved performance.
231
331
*Use stable components with low temperature coefficients. See Application Information.
**0.1 μF or 1 μF, See Typical Applications.
Figure 14. Simple Stand-Alone V-to-F Converter
with ±0.03% Typical Linearity (f = 10 Hz to 11 kHz)
8.2.1.1 Design Requirements
For this example, the system requirements are 0.05% linearity over an output frequency range of 10 Hz to 4 kHz
with an input voltage range of 25 mV to 12.5 V. The available supply voltage is 15.0 V.
8.2.1.2 Detailed Design Procedure
A capacitor CIN is added from pin 7 to ground to act as a filter for VIN, use of a 0.1 μF is appropriate for this
application. A value of 0.01 μF to 0.1 μF will be adequate in most cases; however, in cases where better filtering
is required, a 1-μF capacitor can be used. When the RC time constants are matched at pin 6 and pin 7, a voltage
step at VIN will cause a step change in fOUT. If CIN is much less than CL, a step at VIN may cause fOUT to stop
momentarily.
Next, we cancel the comparator bias current by setting RIN to 100 kΩ to match RL. This will help to minimize any
frequency offset.
For best results, all the components should be stable low-temperature-coefficient components, such as metal-film
resistors. The capacitor should have low dielectric absorption; depending on the temperature characteristics
desired, NPO ceramic, polystyrene, Teflon or polypropylene are best suited.
The resistance RS at pin 2 is made up of a 12-kΩ fixed resistor plus a 5-kΩ (cermet, preferably) gain adjust
rheostat. The function of this adjustment is to trim out the gain tolerance of the XDx31, and the tolerance of Rt,
RL and Ct.
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
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XD331 DIP-8 / XL331 SOP8 / XD231 DIP-8
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