SS26

SS22~SS210 Surface Mount Schottky Rectifiers SMA/DO-214AC Features








For surface mounted application Easy pick and place Metal to silicon rectifier, majority carrier conduction Low power loss, high efficiency High current capability, low VF High surge current capability Plastic material used carriers Underwriters Laboratory Classification 94V-0 Epitaxial construction High temperature soldering: 260oC / 10 seconds at terminals Mechanical Data



Case: Molded plastic Terminals: Pure tin plated, lead free. Polarity: Indicated by cathode band Packaging: 12mm tape per EIA STD RS-481 Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characteristics Rating at 25oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Symbol SS SS SS SS Type Number Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at TL(See Fig. 1) Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) Maximum Instantaneous Forward Voltage (Note 1) IF= 2.0A @ 25oC @ 100oC o Maximum DC Reverse Current @ TA =25 C at o Rated DC Blocking Voltage @ TA=125 C Typical Junction Capacitance (Note 3) Typical Thermal Resistance ( Note 2 ) Operating Temperature Range VRRM VRMS VDC 22 20 14 20 www.slkormicro.com 24 40 28 40 SS 26 60 42 60 25 50 35 50 SS 29 90 63 90 SS 210 100 70 100 Units V V V I(AV) 2.0 A IFSM 50 A 0.5 0.4 VF 0.70 0.65 0.4 IR 10 Cj 0.85 0.70 0.1 5.0 130 17 75 R θJL R θJA TJ -65 to +125 Storage Temperature Range Notes: 23 30 21 30 -65 to +150 -65 to +150 TSTG 1. Pulse Test with PW=300 usec, 1% Duty Cycle 2. Measured on P.C.Board with 0.4” x 0.4”(10mm x 10mm) Copper Pad Areas. 3. Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C. 1 V mA mA pF o C/W o C C o SS22~SS210 FIG.1- MAXIMUM FORWARD CURRENT DERATING CURVE FIG.2- MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT PEAK FORWARD SURGE CURRENT. (A) AVERAGE FORWARD CURRENT. (A) 2.0 RESISTIVE OR INDUCTIVE LOAD 1.5 SS25-SS215 SS22-SS24 1.0 0.5 PCB MOUNTED ON 0.2X0.2" (5.0X5.0mm) COPPER PAD AREAS 50 8.3ms Single Half Sine Wave JEDEC Method AT RATED TL 40 30 20 10 0 0 1 O LEAD TEMPERATURE. ( C) 10 NUMBER OF CYCLES AT 60Hz 100 FIG.4-TYPICALREVERSE CHARACTERISTICS FIG.3- TYPICAL FORWARD CHARACTERISTICS 100 SS22-SS24 SS25-SS215 50 TJ=25 OC INSTANTANEOUS REVERSE CURRENT. (mA) INSTANTANEOUS FORWARD CURRENT. (A) O SS25-SS26 10 SS22-SS24 1 SS29-SS210 0.1 SS215 PULSE WIDTH=300 S 1% DUTY CYCLE 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 TJ=125 C 10 1 O TJ=75 C 0.1 0.01 O TJ=25 C 0.001 0 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE. (%) 1.6 FORWARD VOLTAGE. (V) FIG.6- TYPICAL TRANSIENT THERMAL CHARACTERISTICS FIG.5-TYPICAL JUNCTION CAPACITANCE 100 TRANSIENT THERMAL IMPEDANCE. (OC/W) JUNCTION CAPACITANCE.(pF) 400 O Tj=25 C f=1.0MHz Vsig=50mVp-p 100 10 0.1 SS29-SS215 SS22-SS24 SS25-SS26 1 10 100 REVERSE VOLTAGE. (V) www.slkormicro.com 2 10 1 0.1 0.01 0.1 1 T, PULSE DURATION. (sec) 10 100