BSS123
N-Channel Power MOSFET
■MAXIMUM
RATINGS
Characteristic
Symbol
Max
Unit
Drain-Source Voltage
BVDSS
100
V
Gate- Source Voltage
VGS
+20
V
Drain Current-continuous
IDR
150
mA
Drain Current-pulsed
IDRM
600
mA
■THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation
TA=25℃
Derate above25℃
Symbol
Max
Unit
PD
250
mW
1.8
mW/℃
500
℃/W
Thermal Resistance Junction to Ambient
RΘJA
Junction and Storage Temperature
TJ,Tstg
www.slkormicro.com
1
150℃,-55to+150℃
BSS123
■ELECTRICAL CHARACTERISTICS
(TA=25℃ unless otherwise noted )
Characteristic
Symbol
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
(ID =10uA,VGS=0V)
BVDSS
100
—
—
V
Gate Threshold Voltage
(ID =1mA,VGS= VDS)
VGS(th)
1.0
—
2.8
V
Diode Forward Voltage Drop
(ISD=200mA,VGS=0V)
VSD
—
—
1.5
V
Zero Gate Voltage Drain Current
(VGS=0V, VDS= 80V)
IDSS
—
—
1
uA
Gate Body Leakage
(VGS=+20V, VDS=0V)
IGSS
—
—
+10
uA
RDS(ON)
—
3.5
6
Ω
CISS
—
—
40
pF
COSS
—
—
25
pF
Turn-ON Time
(VDS=50V, ID=200mA, RGEN=25Ω)
t(on)
—
—
10
ns
Turn-OFF Time
(VDS=50V, ID=200mA, RGEN=25Ω)
t(off)
—
—
20
ns
Static Drain-Source On-State Resistance
(ID=120mA,VGS=10V)
Input Capacitance
(VGS=0V, VDS=25V,f=1MHz)
Common Source Output Capacitance
(VGS=0V, VDS=25V,f=1MHz)
1. FR-5=1.0×0.75×0.062in.
2. Alumina=0.4×0.3×0.024in.99.5%alumina.
3. Pulse Width
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